Research output per year
Research output per year
Personal profile
Author IDs
Scopus Author ID: 55730183300
Impact
Biography
Professor TU King-Ning is the Chair Professor of Materials and Electrical Engineering of the City University of Hong Kong. Professor Tu received his BSc degree from National Taiwan University, MSc degree from Brown University, and PhD degree on applied physics from Harvard University in 1968. Professor Tu has been the TSMC Chair Professor and E. Sun Scholar of National Chiao Tung University, Taiwan. Professor Tu is a world leader in the science of thin films, especially in its applications in microelectronic devices, packaging and reliability. His recent work is on predicting failure in modern microelectronics based on entropy production.
Research Interests/Areas
- Thin Film Materials Science
- Kinetics in Nanoscale Materials
- Reliability Science in Microelectronic Devices
Related Links
Education/Academic qualification
PhD, Harvard University
BS, National Taiwan University
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 3 Good Health and Well-being -
SDG 7 Affordable and Clean Energy -
SDG 9 Industry, Innovation, and Infrastructure
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Collaborations from the last five years
Recent external collaboration based on locations. Dive into details by clicking on the dots or
Research output
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Dual-dispersion medium derived 3D graphene networks: a strategy to fabricate Cu@Ag/GO composite with optimized performance and suppressed dewetting
Wei, H. (Co-first Author), Li, Z. (Co-first Author), Yao, Y., Li, W., Fang, Y., Tu, K. N., Yang, G., Zhang, Y., Huang, G. & Cui, C., 28 Jan 2026, In: Composites Part B: Engineering. 310, 17 p., 113130.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
5 Link opens in a new tab Citations (Scopus) -
Solder Alloy Composition, Its Preparation Method And Uses In Room-Temperature Rapid Solid-State Soldering
TU, K. N. (Inventor) & LIU, Y. (Inventor), 21 Jul 2026, Patent No. US12,686,083, Priority No. 18/333,253Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityUHK)
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The study of rapid Cu–Cu bonding using thermally stable nanostructured Cu layers
Xie, S., Xiong, Z., Ye, Z., Duan, Y., Du, F., Tu, K. N. & Liu, Y., 1 Mar 2026, In: Applied Surface Science. 721, 9 p., 165382.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile3 Link opens in a new tab Citations (Scopus)2 Downloads (CityUHK Scholars) -
A Comparison Between Ripening Under a Constant Volume and Ripening Under a Constant Surface Area
Tu, K.-N., Gusak, A. M., Sun, Q. & Yao, Y., Feb 2025, In: Nanomaterials. 15, 4, 316.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile2 Link opens in a new tab Citations (Scopus)32 Downloads (CityUHK Scholars) -
Comparison of Thermomigration Velocity Between Sn-Cu0.7 and Ternary Sn-Bi-In Solder
Yao, Y., Mao, X., Duan, Y., Sun, Q., Tu, K. N. & Liu, Y., Apr 2025, 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). IEEE, p. 167-168 (International Conference on Electronics Packaging (ICEP)).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
1 Link opens in a new tab Citation (Scopus)
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NSFC: Multi-scale Inverse Design and Experimental Verification of High-entropy Solder
LIU, Y. (Principal Investigator / Project Coordinator), GUO, Y. (Co-Investigator), LIU, S. (Co-Investigator) & TU, K. N. (Co-Investigator)
1/01/24 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), LIU, Y. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), FENG, S. P. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), FENG, S. P. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), LIU, Y. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), TU, K. N. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), FENG, S. P. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), LIU, Y. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
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SZSTIB-C-HK: 三維封裝高產能銅銅直接鍵合工藝研究
LIU, Y. (Principal Investigator / Project Coordinator), FENG, S. P. (Co-Investigator) & TU, K. N. (Co-Investigator)
1/05/23 → …
Project: Research
Prizes
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Stanford's top 2% most highly cited scientists 2024
TU, K. N. (Recipient), Sept 2024
Prize: RGC 64B - Prizes and awards
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Bronze Medal at the 49th International Exhibition of Inventions of Geneva
TU, K. N. (Recipient), LIU, Y. (Recipient) & CHEN, C. (Recipient), Apr 2024
Prize: RGC 64B - Prizes and awards
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Stanford's top 2% most highly cited scientists 2023
TU, K. N. (Recipient), Oct 2023
Prize: RGC 64B - Prizes and awards
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Silver Medal at 2023 International Exhibition of Inventions Geneva (IEIG)
TU, K. N. (Recipient), LIU, Y. (Recipient) & CHEN, C. (Recipient), Apr 2023
Prize: RGC 64B - Prizes and awards
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Stanford's top 2% most highly cited scientists 2022
TU, K. N. (Recipient), Nov 2022
Prize: RGC 64B - Prizes and awards
Press/Media
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17 MSE Faculty Members in Stanford’s List of World’s Top 2% Scientists
CHI, Y., CHUNG, C. Y., HE, J.-H., JEN, A., WU, L., LIU, C. T., ROGACH, A., SHEK, C. H., TU, K. N., WANG, F., YIP, H. L., ZENG, X., ZHANG, Q., ZHANG, W., ZHI, C. & ZHU, Y.
21/10/22
1 item of Media coverage
Press/Media: Press / Media
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CityU’s record-breaking showing at International Exhibition of Inventions Geneva
LAU, C., LEUNG, M. Y. K., HILL, F. I., PANG, S. W., LI, H., WANG, S., YU, X., LEI, D., LI, Y., WU, W., ZHU, Z., TSO, C. Y., ZHANG, W., TU, K. N., LIU, Y., NG, S. T. T., ZHAO, S., LEE, W. M., LAM, H. F., LUO, X., ZHANG, Z., ZHAO, X., YAN, H., XIE, M., ZHU, K., JING, X., HU, J., TSE, C. F. N., LU, J., LAM, H. W. M., LAM, H. W. R., HO, J. C. Y., DAOUD, W., KHOO, B. L., KWONG, T. W. S., LI, X., CHAN, C. H., LUK, K. M., CHU, P. K. H., LO, P. K. P. & ZHI, C.
29/04/23
7 items of Media coverage
Press/Media: Press / Media
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CityUHK triumphs at the International Exhibition of Inventions of Geneva with 36 awards
PANG, S. W., TSE, C. K., FENG, S. P., CHAN, C. H., WU, G., KUO, W., JIANG, C., ZHU, Z., CHUNG, S. H. H., HU, J., CHEN, M. K., TSAI, D.-P., LIN, S. K. C., CHAN, L. L., LU, J., LY, T. H., LI, L., LAU, C., LI, X., HILL, F. I., WANG, C., KO, C. C. V., LEUNG, M. Y. K., YU, K. N. P., LAU, T. C., HO, J. C. Y., SONG, L., WANG, S., TU, K. N., LIU, Y., LU, Z., ZUKERMAN, M., WANG, Y., SUN, Y., YAN, H., LAU, C. K. T. & BAN, K.
20/04/24
7 items of Media coverage
Press/Media: Press / Media