Research output per year
Research output per year
Personal profile
Author IDs
Scopus Author ID: 55730183300
Impact
Biography
Professor TU King-Ning is the Chair Professor of Materials and Electrical Engineering of the City University of Hong Kong. Professor Tu received his BSc degree from National Taiwan University, MSc degree from Brown University, and PhD degree on applied physics from Harvard University in 1968. Professor Tu has been the TSMC Chair Professor and E. Sun Scholar of National Chiao Tung University, Taiwan. Professor Tu is a world leader in the science of thin films, especially in its applications in microelectronic devices, packaging and reliability. His recent work is on predicting failure in modern microelectronics based on entropy production.
Research Interests/Areas
- Thin Film Materials Science
- Kinetics in Nanoscale Materials
- Reliability Science in Microelectronic Devices
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
Related Links
Education/Academic qualification
PhD, Harvard University
BS, National Taiwan University
Fingerprint
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Collaborations from the last five years
Recent external collaboration on country/territory level. Dive into details by clicking on the dots or
Research output
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A Comparison Between Ripening Under a Constant Volume and Ripening Under a Constant Surface Area
Tu, K.-N., Gusak, A. M., Sun, Q. & Yao, Y., Feb 2025, In: Nanomaterials. 15, 4, 316.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile18 Downloads (CityUHK Scholars) -
Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints
Yao, Y., Lu, Z., An, Y., Tu, K. N. & Liu, Y., Jan 2025, In: Electronic Materials Letters. 21, 1, p. 134-143Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile1 Citation (Scopus)7 Downloads (CityUHK Scholars) -
Effect of WC thickness on the microstructure and properties of WC-C/DLC coated 304 steel
Sun, Q., Mao, X., Yao, Y., Li, J., Shen, Z., Tu, K.-N. & Liu, Y., 30 Sept 2025, In: Applied Surface Science. 704, 163418.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
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Electromigration failure induced by interdiffusion between Al trace and Cu seed layer in the immortal microbump in three-dimensional integrated circuit
Yao, Y., An, Y., Tu, K. N. & Liu, Y., May 2025, In: Journal of Materials Research and Technology. 36, p. 6400-6408Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile -
Fabrication of nanoporous-nanotwinned Cu by dealloying and its application for high-power device packaging
Lu, W.-H., Tran, D.-P., Lin, H.-E., Shen, G.-Y., Chen, B.-Y., Lee, K.-P., Tsai, C.-C., Lin, Y.-Q., Tu, K. N. & Chen, C., 20 Apr 2025, In: Journal of Alloys and Compounds. 1024, 180265.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
1 Citation (Scopus)
Projects
- 9 Active
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ITF: Development of Thermally Instable Nanograined Cu and Thermally Stable Composite Cu for 3DIC Stacking and Advanced Electronic Packaging Applications
FENG, S. P. (Principal Investigator / Project Coordinator), LIU, Y. (Co-Investigator) & TU, K. N. (Co-Investigator)
1/01/24 → …
Project: Research
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NSFC: Multi-scale Inverse Design and Experimental Verification of High-entropy Solder
LIU, Y. (Principal Investigator / Project Coordinator), GUO, Y. (Co-Investigator), LIU, S. (Co-Investigator) & TU, K. N. (Co-Investigator)
1/01/24 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), LIU, Y. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), FENG, S. P. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), FENG, S. P. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), LIU, Y. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
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TBRS-ExtU-Lead: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits
LI, L. J. (Main Project Coordinator [External]), TU, K. N. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), FENG, S. P. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), LIU, Y. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)
1/11/23 → …
Project: Research
Prizes
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Stanford's top 2% most highly cited scientists 2024
TU, K. N. (Recipient), Sept 2024
Prize: 64B_Prizes and awards
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Bronze Medal at the 49th International Exhibition of Inventions of Geneva
TU, K. N. (Recipient), LIU, Y. (Recipient) & CHEN, C. (Recipient), Apr 2024
Prize: 64B_Prizes and awards
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Silver Medal at 2023 International Exhibition of Inventions Geneva (IEIG)
TU, K. N. (Recipient), LIU, Y. (Recipient) & CHEN, C. (Recipient), Apr 2023
Prize: 64B_Prizes and awards
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Stanford's top 2% most highly cited scientists 2023
TU, K. N. (Recipient), Oct 2023
Prize: 64B_Prizes and awards
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Stanford's top 2% most highly cited scientists 2022
TU, K. N. (Recipient), Nov 2022
Prize: 64B_Prizes and awards
Press/Media
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17 MSE Faculty Members in Stanford’s List of World’s Top 2% Scientists
CHI, Y., CHUNG, C. Y., HE, J.-H., JEN, A., WU, L., LIU, C. T., ROGACH, A., SHEK, C. H., TU, K. N., WANG, F., YIP, H. L., ZENG, X., ZHANG, Q., ZHANG, W., ZHI, C. & ZHU, Y.
21/10/22
1 item of Media coverage
Press/Media: Press / Media
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CityU’s record-breaking showing at International Exhibition of Inventions Geneva
LAU, C., LEUNG, M. Y. K., HILL, F. I., PANG, S. W., LI, H., WANG, S., YU, X., LEI, D., LI, Y., WU, W., ZHU, Z., TSO, C. Y., ZHANG, W., TU, K. N., LIU, Y., NG, S. T. T., ZHAO, S., LEE, W. M., LAM, H. F., LUO, X., ZHANG, Z., ZHAO, X., YAN, H., XIE, M., ZHU, K., JING, X., HU, J., TSE, C. F. N., LU, J., LAM, H. W. M., LAM, H. W. R., HO, J. C. Y., DAOUD, W., KHOO, B. L., KWONG, T. W. S., LI, X., CHAN, C. H., LUK, K. M., CHU, P. K. H., LO, P. K. P. & ZHI, C.
29/04/23
7 items of Media coverage
Press/Media: Press / Media
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CityUHK triumphs at the International Exhibition of Inventions of Geneva with 36 awards
PANG, S. W., TSE, C. K., FENG, S. P., CHAN, C. H., WU, G., KUO, W., JIANG, C., ZHU, Z., CHUNG, S. H. H., HU, J., CHEN, M. K., TSAI, D.-P., LIN, S. K. C., CHAN, L. L., LU, J., LY, T. H., LI, L., LAU, C., LI, X., HILL, F. I., WANG, C., KO, C. C. V., LEUNG, M. Y. K., YU, K. N. P., LAU, T. C., HO, J. C. Y., SONG, L., WANG, S., TU, K. N., LIU, Y., LU, Z., ZUKERMAN, M., WANG, Y., SUN, Y., YAN, H., LAU, C. K. T. & BAN, K.
20/04/24
8 items of Media coverage
Press/Media: Press / Media
Supervised Students
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Miss Peixuan LI, 李沛萱
- Department of Systems Engineering - Research Assistant
Person: Doctor of Philosophy (Student), Research Assistant
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