Prof. TU King Ning (杜經寧)

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Research Output

  1. 2025
  2. Published

    Counteracting Effect of Sn Grain Orientation on Current Crowding in Electromigration Failures of Solder Joints

    Yao, Y., Lu, Z., An, Y., Tu, K. N. & Liu, Y., Jan 2025, In: Electronic Materials Letters. 21, 1, p. 134-143

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Check@CityULib
  3. 2024
  4. Published

    Quaternary low melting point Sn-Bi-in-xGa solder with improved mechanical performance for advanced electronic packaging

    Qiao, J., Mao, X., Xie, L., Xie, S., Tu, K.-N. & Liu, Y., Dec 2024, In: Intermetallics. 175, 108534.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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  5. Published

    Low-temperature attaching of LED chips using SnBiIn solder nanoparticles

    Mao, X., An, Y., Yao, Y., Qiao, J., Xie, L., Tu, K.-N. & Liu, Y., Oct 2024, In: Journal of Materials Science: Materials in Electronics. 35, 28, 1881.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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  6. Published

    Influence of Sn grain orientation on mean-time-to-failure equation for microbumps in 3D IC technology

    Yao, Y., Gusak, A. M., Chen, C., Liu, Y. & Tu, K. N., 1 Sept 2024, In: Scripta Materialia. 250, 116175.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 2
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  7. Published

    Effect of Joule heating on the reliability of microbumps in 3D IC

    Yao, Y., An, Y., Dong, J., Wang, Y., Tu, K. N. & Liu, Y., Jul 2024, In: Journal of Materials Research and Technology. 31, p. 3374-3382

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 5
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  8. Published

    Mechanical characterizations of η′-Cu6(Sn, In)5 intermetallic compound solder joint: Getting prepared for future nanobumps

    Mao, X., An, Y., Chen, Y., Zheng, G., Hou, R., Zhang, X. & Guo, Y. & 3 others, Liu, S., Tu, K.-N. & Liu, Y., May 2024, In: Journal of Materials Research and Technology. 30, p. 1136-1147

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 3
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  9. Published

    Coupling effect between electromigration and joule heating on the failure of ball grid array in 3D integrated circuit technology

    Yao, Y., An, Y., Tu, K. N. & Liu, Y., Jan 2024, In: Journal of Materials Research and Technology. 28, p. 3573-3582

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 4
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  10. Published

    Electroplated Low Temperature Self-Annealing Cu Film for Cu-Cu Bonding

    Xie, S., Du, F., Xiong, Z., Tu, K.-N. & Liu, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology (ICEPT). Institute of Electrical and Electronics Engineers, Inc., (International Conference on Electronic Packaging Technology, ICEPT ).

    Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

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  11. Published

    Elements of Electromigration: Electromigration in 3D IC Technology

    Tu, K.-N. & Liu, Y., 2024, Boca Raton: CRC Press.

    Research output: Scholarly Books, Monographs, Reports and Case Studies › RGC 11 - Research book or monograph (Author) › peer-review

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  12. Published

    Influence Factors of Joule Heating in Microbump in Advanced Packaging Technology

    Yao, Y., An, Y., Tu, K. N. & Liu, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology (ICEPT). Institute of Electrical and Electronics Engineers, Inc., (International Conference on Electronic Packaging Technology, ICEPT ).

    Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

    Check@CityULib
  13. Published

    Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders

    Qiao, J., Mao, X., Tu, K.-N. & Liu, Y., 2024, 2024 International Conference on Electronics Packaging (ICEP). Institute of Electrical and Electronics Engineers, Inc., p. 13-14 (International Conference on Electronics Packaging, ICEP).

    Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

    Check@CityULib
  14. Published

    Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget

    He, C., Zhou, J., Zhou, R., Chen, C., Jing, S., Mu, K. & Huang, Y.-T. & 5 others, Chung, C.-C., Cherng, S.-J., Lu, Y., Tu, K.-N. & Feng, S.-P., 2024, In: Nature Communications. 12, 7095.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 3
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  15. Published

    Simulation Research on Wafer-Level Electrochemical Deposition Uniformity

    Xiong, Z., Xie, S., Tu, K. N. & Liu, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology (ICEPT). Institute of Electrical and Electronics Engineers, Inc., 6 p. (International Conference on Electronic Packaging Technology, ICEPT).

    Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

    Check@CityULib
  16. 2023
  17. Published

    Failure of Ball Grid Array during Electromigration and the Simulation of Dynamic Void Formation

    Yao, Y., An, Y., Tu, K.-N. & Liu, Y., Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference (EPTC 2023). TAY, A., CHUI, K. J., LIM, Y. K., TAN, C. S. & SHIN, S. (eds.). Institute of Electrical and Electronics Engineers, Inc., p. 316-319 (Proceedings of the Electronics Packaging Technology Conference, EPTC).

    Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

    Check@CityULib
  18. Published

    Low melting point SnBiIn-based micro-nanoparticles for high-density microbump bonding technology

    Mao, X., Chen, Y., Tu, K.-N. & Liu, Y., Dec 2023, 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers, Inc., p. 369-372 (Proceedings of the Electronics Packaging Technology Conference, EPTC).

    Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

    Check@CityULib
  19. Published

    Measurement of Thermal Stress by X-ray Nano-Diffraction in (111)-Oriented Nanotwinned Cu Bumps for Cu/SiO2 Hybrid Joints

    Hsu, W.-Y., Yang, S.-C., Lin, Y.-Y., Hsieh, W.-Z., Tu, K.-N., Chiu, W.-L. & Chang, H.-H. & 2 others, Chiang, C.-Y. & Chen, C., Sept 2023, In: Nanomaterials. 13, 17, 2448.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 6
    Check@CityULib
  20. Published

    Coupling Effect of Electromigration and Joule Heating Induced Failure in Advanced Packaging

    Yao, Y., An, Y., Tu, K.-N. & Liu, Y., Aug 2023, 2023 24th International Conference on Electronic Packaging Technology (ICEPT). Institute of Electrical and Electronics Engineers, Inc., (International Conference on Electronic Packaging Technology, ICEPT).

    Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

    Check@CityULib
  21. Published

    Synergistic Effect of Current Stressing and Temperature Cycling on Reliability of Low Melting Point SnBi Solder

    Shen, Z., An, Y., Xiong, Z., Tu, K.-N. & Liu, Y., Aug 2023, 2023 24th International Conference on Electronic Packaging Technology (ICEPT). Institute of Electrical and Electronics Engineers, Inc., 5 p. (International Conference on Electronic Packaging Technology, ICEPT).

    Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review

    Check@CityULib
  22. Accepted/In press/Filed

    Solder Alloy Composition, Its Preparation Method And Uses In Room-Temperature Rapid Solid-State Soldering

    LIU, Y. (Inventor) & TU, K. N. (Inventor), 12 Jun 2023, (Accepted/In press/Filed) Priority No. 18/333,253

    Research output: Patents, Agreements and Assignments › RGC 51 - Patents (CityU)

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  23. Published

    Electromigration in three-dimensional integrated circuits

    Shen, Z., Jing, S., Heng, Y., Yao, Y., Tu, K. N. & Liu, Y., Jun 2023, In: Applied Physics Reviews. 10, 2, 021309.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 18
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