Prof. TU King Ning (杜經寧)

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Projects

  1. ITF: Development of Thermally Instable Nanograined Cu and Thermally Stable Composite Cu for 3DIC Stacking and Advanced Electronic Packaging Applications

    FENG, S. P. (Principal Investigator / Project Coordinator), LIU, Y. (Co-Investigator) & TU, K. N. (Co-Investigator)

    1/01/24 → …

    Project: Research

  2. NSFC: Multi-scale Inverse Design and Experimental Verification of High-entropy Solder

    LIU, Y. (Principal Investigator / Project Coordinator), GUO, Y. (Co-Investigator), LIU, S. (Co-Investigator) & TU, K. N. (Co-Investigator)

    1/01/24 → …

    Project: Research

  3. TBRS: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits

    LI, L. J. (Main Project Coordinator [External]), TU, K. N. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), FENG, S. P. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), LIU, Y. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)

    1/11/23 → …

    Project: Research

  4. TBRS: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits

    LI, L. J. (Main Project Coordinator [External]), FENG, S. P. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), LIU, Y. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)

    1/11/23 → …

    Project: Research

  5. TBRS: Overcoming Technical Limits of Copper Hybrid Bonding for Advanced Three-Dimensional Integrated Circuits

    LI, L. J. (Main Project Coordinator [External]), LIU, Y. (Principal Investigator / Project Coordinator), CHEN, S.-C. (Co-Principal Investigator), FENG, S. P. (Co-Principal Investigator), HUANG, M. (Co-Principal Investigator), LEE, W.-N. (Co-Principal Investigator), SHAO, Q. (Co-Principal Investigator), TU, K. N. (Co-Principal Investigator), XIANG, C. (Co-Principal Investigator) & Zhao, N. (Co-Principal Investigator)

    1/11/23 → …

    Project: Research

  6. MainGov: 三維封裝高產能銅銅直接鍵合工藝研究

    LIU, Y. (Principal Investigator / Project Coordinator), FENG, S. P. (Co-Investigator) & TU, K. N. (Co-Investigator)

    1/05/23 → …

    Project: Research

  7. DON_RMG: Low Temperature Hybrid Bonding with Nano-twin Copper - RMGS

    TU, K. N. (Principal Investigator / Project Coordinator)

    1/01/22 → …

    Project: Research

  8. DON_RMG: Predicting Failure in Modern Microelectronic Devices Caused by Joule Heating - RMGS

    TU, K. N. (Principal Investigator / Project Coordinator)

    1/01/22 → …

    Project: Research

  9. DON_RMG: Research on Semiconductor: From Theory to Practice - RMGS

    ZHANG, W. (Principal Investigator / Project Coordinator), FENG, S. P. (Co-Principal Investigator), TU, K. N. (Co-Investigator) & XUE, C. J. (Co-Investigator)

    1/12/21 → …

    Project: Research