PUN Po Leung (潘寶樑)
Research Output
- 2019
- Published
Application of Fuzzy Integrated FMEA with Product Lifetime Consideration for New Product Development in Flexible Electronics Industry
Pun, K. P. L., Rotanson, J., Cheung, C. & Chan, A. H. S., 1 Apr 2019, In: Journal of Industrial Engineering and Management. 12, 1, p. 176-200Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 5 - 2018
- Published
Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection
PUN, K. P. L., ISLAM, M. N., ROTANSON, J., CHEUNG, C. & CHAN, A. H. S., Sept 2018, In: Journal of Electronic Materials. 47, 9, p. 5191–5202Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 14 - Published
Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization
Pun, K. P. L., Ali, L., Kohtoku, M., Cheung, C., Chan, A. H. S. & Wong, C. P., Apr 2018, In: Journal of Materials Science: Materials in Electronics. 29, 8, p. 6937–6949Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 4 - 2017
- Published
Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds
Pun, K. P. L., Dhaka, N. S., Cheung, C. & Chan, A. H. S., Nov 2017, In: Microelectronics Reliability. 78, p. 339-348Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 6 - Published
Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging
Pun, K. P. L., Islam, M. N., Cheung, C. W. & Chan, A. H. S., Sept 2017, In: Journal of Materials Science: Materials in Electronics. 28, 17, p. 12617-12629Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 10
