PUN Po Leung (潘寶樑)
Biography
Dr. Kelvin Pun Po Leung is currently the Vice President of Goertek Microelectronics. Inc. He has led several projects related to innovation technology strategies and R&D implementation, including the Innovation and Technology Fund project from the Hong Kong SAR government. He serves as an industrial advisor and a member of the engineering doctoral committee at the City University of Hong Kong. He is also currently serving as a Guest Professor at the Guangdong University of Technology.
With over twenty years of experience in the semiconductor packaging industry, he is dedicated to researching and industrializing advanced substrates, packaging technologies, sensors, digital healthcare, optoelectronics, and related microsystems. He has published over 20 papers in peer-reviewed journals and international conferences and holds 25 international patents. Dr. Pun is a chartered engineer, a senior member of IEEE, and a member of the Semiconductor Nanotechnology Alliance (SNA). He has served as a technical committee member and session chair at ICEPT, and he has delivered keynote speeches on advanced packaging materials at ECTC and SEMICON. The projects he has led and participated in have received prestigious recognition, including the RD100, Inventions of Geneva, CES show in Las Vegas, and the Best Paper Award at IEEE conferences.
Research Interests:
- Advanced substrates, WLP, and Chiplet integration.
- Nano-functional and reliability of interconnect materials, contributing to the reliability of interconnection under thermal, mechanical, and electric fields.
Dr. Pun earned his BEng, MSc, and Doctoral degrees all from the City University of Hong Kong.
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