PUN Po Leung (潘寶樑)
Dr. Kelvin Pun Po Leung is currently the CTO and VP of Business Development at the Compass Technology Co. Ltd.
For two decades, Dr. Pun has been engaged in product development and technology management. He has participated in numerous technical research projects funded by the Hong Kong SAR and oversaw the management of their enterprise innovation technology strategies and R&D implementation. Moreover, he constantly works with Fortune 100 companies to deliver state-of-the-art technological solutions to promote product launches for medical, optoelectronic, and consumer electronics products. Furthermore, he has extensive practical experience in flexible substrate design, System in Package (SiP) technologies, and the applications of advanced electronic materials.
Dr. Pun has published over 20 papers in peer-reviewed journals and international conferences, accumulating a total of 28 granted and pending US patents, he serves as a session chair of the Technical Committee of the 2020 ICEPT International Electronic Packaging Technology Conference. He has also presented keynote speeches at numerous IEEE ECTC conferences and technical symposia related to electronics IC packaging, and materials.
The awards he has won over the years include
• Gold medal, 47th International Exhibition of Inventions of Geneva ;
• RD100, in recognition of his work for one of the top 100 most technologically significant new products in 2019;
• 2019 CES Innovation award ; and
• Best Paper on Lead-free Solder Joint Reliability from the 2009 ICEPT International Electronics Packaging Conference.
-Advanced substrate and interconnect technology for electronics IC packaging.
-Nano-functional and reliability of interconnect materials, contributing to the reliability of interconnection in thermal, mechanical, and electric field.
Dr. Pun earned his BEng, MSc, and Doctoral degree from the City University of Hong Kong.