PUN Po Leung (潘寶樑)
Dr. Kelvin Pun Po Leung is currently the CTO and Corporate VP of Compass Technology Co. Ltd.
For two decades, Dr. Pun has been engaged in product development and technology management for the semiconductor IC packaging industry. He has participated in numerous technical research projects funded by the Hong Kong SAR and oversaw the management of their enterprise innovation technology strategies and R&D implementation. Moreover, He constantly works with Fortune 100 companies to fabricate the most demanding product with aggressive timelines to drive sustained high growth.
Dr. Pun has published over 20 papers in peer-reviewed journals and international conferences, accumulating a total of 28 granted and pending US patents, he serves as a session chair of the Technical Committee of the 2020 ICEPT International Electronic Packaging Technology Conference. He has also presented keynote speeches at IEEE/ECTC conferences and numerous technical symposia related to electronics IC packaging, and materials. His project outcomes have been recognized by different innovation and technology awards such as R&D100, Inventions of Geneva, CES show at Vegas, and the best paper award in ICEPT.
-Advanced substrate technologies, wafer level, packaging level integation, 3D packaging.
-Nano-functional and reliability of interconnect materials, contributing to the reliability of interconnection in thermal, mechanical, and electric field.
Dr. Pun earned his BEng, MSc, and Doctoral degree from the City University of Hong Kong.