Research output per year
Research output per year
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Dive into the research topics where Huayu SUN is active. These topic labels come from the works of this person. Together they form a unique fingerprint.
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Research output
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Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs
Sun, H., Chan, Y. C. & Wu, F., May 2018, In: Journal of Materials Science: Materials in Electronics. 29, 10, p. 8584-8593Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
17 Link opens in a new tab Citations (Scopus) -
Effect of Nickel-Coating Modified CNTs on the Dopant Dispersion and Performance of BGA Solder Joints
Sun, H., Chan, Y. C., Hu, X. & Wu, F., May 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference. IEEE, p. 1981-1986Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
6 Link opens in a new tab Citations (Scopus) -
Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods
Zhu, Z., Sun, H., Wu, F. & Chan, Y.-C., Jul 2016, In: Journal of Materials Science: Materials in Electronics. 27, 7, p. 6835-6844Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
15 Link opens in a new tab Citations (Scopus) -
Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints
Sun, H., Chan, Y. C. & Wu, F., 22 Feb 2016, In: Materials Science & Engineering A. 656, p. 249-255Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
42 Link opens in a new tab Citations (Scopus) -
Electromigration study of SnCu0.7 solder joints with Ag added by different methods
Zhu, Z., Sun, H., Chan, Y.-C. & Wu, F., Dec 2015, Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, 7412350Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
1 Link opens in a new tab Citation (Scopus)
Thesis
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Studies of Doping Distribution and Carbon Nanotube Reinforcement in Low Temperature Solder Joints for Advanced Electronic Packaging
SUN, H. (Author), CHAN, Y. C. (Supervisor), 6 Oct 2017Student thesis: Doctoral Thesis