Dr. SUN Huayu (孫華宇)
Research Output
- 2018
- Published
Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs
Sun, H., Chan, Y. C. & Wu, F., May 2018, In: Journal of Materials Science: Materials in Electronics. 29, 10, p. 8584-8593Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 12 - 2017
- Published
Effect of Nickel-Coating Modified CNTs on the Dopant Dispersion and Performance of BGA Solder Joints
Sun, H., Chan, Y. C., Hu, X. & Wu, F., May 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers, Inc., p. 1981-1986Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
Scopus citations: 5 - 2016
- Published
Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods
Zhu, Z., Sun, H., Wu, F. & Chan, Y.-C., Jul 2016, In: Journal of Materials Science: Materials in Electronics. 27, 7, p. 6835-6844Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 14 - Published
Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints
Sun, H., Chan, Y. C. & Wu, F., 22 Feb 2016, In: Materials Science & Engineering A. 656, p. 249-255Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 34 - 2015
- Published
Electromigration study of SnCu0.7 solder joints with Ag added by different methods
Zhu, Z., Sun, H., Chan, Y.-C. & Wu, F., Dec 2015, Proceedings of the Electronic Packaging Technology Conference, EPTC. Institute of Electrical and Electronics Engineers, Inc., 7412350Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
Scopus citations: 1 - Published
Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints
Sun, H., Chan, Y. C. & Wu, F., Jul 2015, In: Journal of Materials Science: Materials in Electronics. 26, 7, p. 5129-5134Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 18 - Published
The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints
Sun, H., Chan, Y. C. & Wu, F., Jul 2015, In: Journal of Materials Science: Materials in Electronics. 26, 7, p. 5318-5325Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 11 - 2014
- Published
Drawbacks of the nanoparticle reinforced lead-free BGA solder joints
Sun, H. & Chan, Y. C., 18 Nov 2014, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers, Inc., 6962816Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
Scopus citations: 1 - Published
A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints
Sun, H., Li, Q. & Chan, Y. C., Oct 2014, In: Journal of Materials Science: Materials in Electronics. 25, 10, p. 4380-4390Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 44 - Published
Fabrication and characterizations of frequency-tunable soft composite antennas for wireless sensing
Tangf, Q.-Y., Sun, H.-Y., Pan, Y.-M., Chan, Y. C. & Leung, K. W., 2014, 8th European Conference on Antennas and Propagation, EuCAP 2014. Institute of Electrical and Electronics Engineers, Inc., p. 2978-2980 6902453Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
