SUN Huayu (孫華宇)

Research Output

  1. 2018
  2. Published

    Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs

    Sun, H., Chan, Y. C. & Wu, F., May 2018, In : Journal of Materials Science: Materials in Electronics. 29, 10, p. 8584-8593

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 4
    Check@CityULib
  3. 2017
  4. Published

    Effect of Nickel-Coating Modified CNTs on the Dopant Dispersion and Performance of BGA Solder Joints

    Sun, H., Chan, Y. C., Hu, X. & Wu, F., May 2017, Proceedings - IEEE 67th Electronic Components and Technology Conference. IEEE, p. 1981-1986

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)

    Scopus citations: 2
    Check@CityULib
  5. 2016
  6. Published

    Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods

    Zhu, Z., Sun, H., Wu, F. & Chan, Y., 9 Mar 2016, In : Journal of Materials Science: Materials in Electronics. 27, 7, p. 6835-6844

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 10
    Check@CityULib
  7. Published

    Effect of CNTs and Ni coated CNTs on the mechanical performance of Sn57.6Bi0.4Ag BGA solder joints

    Sun, H., Chan, Y. C. & Wu, F., 22 Feb 2016, In : Materials Science and Engineering A. 656, p. 249-255

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 17
    Check@CityULib
  8. 2015
  9. Published

    Electromigration study of SnCu0.7 solder joints with Ag added by different methods

    Zhu, Z., Sun, H., Chan, Y. & Wu, F., Dec 2015, Proceedings of the Electronic Packaging Technology Conference, EPTC. IEEE, 7412350

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)

    Check@CityULib
  10. Published

    The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints

    Sun, H., Chan, Y. C. & Wu, F., 19 Apr 2015, In : Journal of Materials Science: Materials in Electronics. 26, 7, p. 5318-5325

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 7
    Check@CityULib
  11. Published

    Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints

    Sun, H., Chan, Y. C. & Wu, F., 11 Apr 2015, In : Journal of Materials Science: Materials in Electronics. 26, 7, p. 5129-5134

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 11
    Check@CityULib
  12. 2014
  13. Published

    Drawbacks of the nanoparticle reinforced lead-free BGA solder joints

    Sun, H. & Chan, Y. C., 18 Nov 2014, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962816

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)

    Scopus citations: 1
    Check@CityULib
  14. Published

    A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

    Sun, H., Li, Q. & Chan, Y. C., Oct 2014, In : Journal of Materials Science: Materials in Electronics. 25, 10, p. 4380-4390

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 30
    Check@CityULib
  15. Published

    Fabrication and characterizations of frequency-tunable soft composite antennas for wireless sensing

    Tangf, Q., Sun, H., Pan, Y., Chan, Y. C. & Leung, K. W., 2014, 8th European Conference on Antennas and Propagation, EuCAP 2014. Institute of Electrical and Electronics Engineers Inc., p. 2978-2980 6902453

    Research output: Chapters, Conference Papers, Creative and Literary Works (RGC: 12, 32, 41, 45)32_Refereed conference paper (with ISBN/ISSN)

    Check@CityULib