Research output per year
Research output per year
Personal profile
Author IDs
ORCID iD: 0000-0002-6700-7288
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Collaborations from the last five years
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Research output
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Investigation of grain growth mechanisms in nanocrystalline Cu for Cu direct bonding
Xie, S., Ye, Z., Xiong, Z., Du, F., Zhao, S., Tu, K. N., Guo, Y., Liu, S. & Liu, Y., Jul 2025, In: Journal of Materials Research and Technology. 37, p. 2107-2117 11 p.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile16 Downloads (CityUHK Scholars) -
Electroplated Low Temperature Self-Annealing Cu Film for Cu-Cu Bonding
Xie, S., Du, F., Xiong, Z., Tu, K.-N. & Liu, Y., 2024, 2024 25th International Conference on Electronic Packaging Technology (ICEPT). IEEE, (International Conference on Electronic Packaging Technology, ICEPT ).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review