Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
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SDG 9 Industry, Innovation, and Infrastructure
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Collaborations from the last five years
Research output
- 6 RGC 21 - Publication in refereed journal
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Interface Engineering Suppresses Self-Annealing in Electroplated Nanograined Copper for Low-Temperature Copper-to-Copper Bonding
Peng, G. (Co-first Author), Dong, X. (Co-first Author), Li, B. (Co-first Author), He, C., Chen, C., Huang, L., Liu, J., Zhou, Y., Li, Q., Gong, H., Wang, Y., Mu, K., Cherng, S.-J., Yang, P.-Y., Lu, Y., Yang, Y., Hung, S.-W. & Feng, S.-P., 4 Jan 2026, (Online published) In: Advanced Science. 10 p., e21964.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile1 Link opens in a new tab Citation (Scopus)1 Downloads (CityUHK Scholars) -
Metastable Nanocrystalline Copper for Effective Copper-to-Copper Bonding
He, C., Mu, K., Zhou, J., Dong, X., Pang, C., Wu, X., Cherng, S.-J., Chung, C.-C., Huang, Y.-T., Lu, Y. & Feng, S.-P., 23 Jul 2025, In: Nano Letters. 25, 29, p. 11325-11332Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
4 Link opens in a new tab Citations (Scopus) -
Nanograin-Twin-Nanograin Alternating Composite Structure Enable Improved Cross-Interface Cu─Cu Bonding at Low Thermal Budgets
Chen, C. (Co-first Author), Li, H. Y. (Co-first Author), Peng, G., Zheng, Z., Dong, E., Zhong, J., He, C., Wang, Y., Chang, J.-S., Gan, Z., Gao, J., Huang, Y.-T., Chen, C.-M. & Feng, S.-P., 1 Sept 2025, In: Small Methods. 9, 9, 9 p., e00831.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
8 Link opens in a new tab Citations (Scopus) -
Ultra-Tough Copper–Copper Bonding by Nano-Oxide-Dispersed Copper Nanomembranes
Teng, Y. (Co-first Author), Zhu, W. (Co-first Author), Wang, Q., Zhang, Z., Wang, H., Guo, B., Yang, Z., Gong, H., He, C., Qu, B., Feng, S.-P. & Yang, Y., 10 Apr 2025, In: Advanced Science. 12, 14, 12 p., 2408302.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile3 Link opens in a new tab Citations (Scopus)50 Downloads (CityUHK Scholars) -
Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget
He, C., Zhou, J., Zhou, R., Chen, C., Jing, S., Mu, K., Huang, Y.-T., Chung, C.-C., Cherng, S.-J., Lu, Y., Tu, K.-N. & Feng, S.-P., 2024, In: Nature Communications. 12, 7095.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Open AccessFile47 Link opens in a new tab Citations (Scopus)96 Downloads (CityUHK Scholars)
Activities
- 1 Conference / Symposium
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IUMRS-ICEM 2024 Conference
HE, C. (Presenter), FENG, S. P. (Program Chair) & HUANG, J.-K. (Co-chair)
17 May 2024 → 20 May 2024Activity: Organizing or Participating in a conference / an event › Conference / Symposium
Thesis
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Designing Copper Microstructure for Low-Thermal-Budget Copper-to-Copper Bonding in Advanced Electronic Packaging
HE, C. (Author), FENG, S. P. (Supervisor), 28 Jul 2025Student thesis: Doctoral Thesis