Department of Systems Engineering
Organisational unit: Academic Departments
Research Output
- 2023
- Published
Failure of Ball Grid Array during Electromigration and the Simulation of Dynamic Void Formation
Yao, Y., An, Y., Tu, K. & Liu, Y., Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference (EPTC 2023). TAY, A., CHUI, K. J., LIM, Y. K., TAN, C. S. & SHIN, S. (eds.). Institute of Electrical and Electronics Engineers, Inc., p. 316-319 (Proceedings of the Electronics Packaging Technology Conference, EPTC).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
- Published
Fast Bellman Updates for Wasserstein Distributionally Robust MDPs
Yu, Z., Dai, L., Xu, S., Gao, S. & Ho, C. P., Dec 2023, NeurIPS Proceedings: Advances in Neural Information Processing Systems 36 (NeurIPS 2023). Oh, A., Naumann, T., Globerson, G., Saenko, K., Hardt, M. & Levine, S. (eds.). Neural Information Processing Systems (NeurIPS), Vol. 36. (Advances in Neural Information Processing Systems).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
- Published
Hypothesis testing of Poisson rates in COVID-19 offspring distributions
Luo, R., Dec 2023, In: Infectious Disease Modelling. 8, 4, p. 980-1001Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
- Published
Improving the Knowledge Gradient Algorithm
Yang, L., Gao, S. & Ho, C. P., Dec 2023, NIPS '23: Proceedings of the 37th International Conference on Neural Information Processing Systems. Oh, A., Naumann, T., Globerson, A., Saenko, K., Hardt, M. & Levine, S. (eds.). Red Hook, NY: Curran Associates Inc., p. 61747-61758 2698. (Advances in Neural Information Processing Systems).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
- Published
Low melting point SnBiIn-based micro-nanoparticles for high-density microbump bonding technology
Mao, X., Chen, Y., Tu, K. & Liu, Y., Dec 2023, 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC). Institute of Electrical and Electronics Engineers, Inc., p. 369-372 (Proceedings of the Electronics Packaging Technology Conference, EPTC).Research output: Chapters, Conference Papers, Creative and Literary Works › RGC 32 - Refereed conference paper (with host publication) › peer-review
- Published
Robust Statistical Modeling of Heterogeneity for Repairable Systems Using Multivariate Gaussian Convolution Processes
Cui, D., Sun, Q. & Xie, M., Dec 2023, In: IEEE Transactions on Reliability. 72, 4, p. 1493-1506Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 1 - Published
Spatiotemporal Entropy for Abnormality Detection and Localization of Li-ion Battery Packs
Wei, P. & Li, H., Dec 2023, In: IEEE Transactions on Industrial Electronics. 70, 12, p. 12851-12859 9 p.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 5 - Published
Turning traffic surveillance cameras into intelligent sensors for traffic density estimation
Hu, Z., Lam, W. H. K., Wong, S. C., Chow, A. H. F. & Ma, W., Dec 2023, In: Complex & Intelligent Systems. 9, 6, p. 7171–7195Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 3 - Online published
Atomically Thin Decoration Layers for Robust Orientation Control of 2D Transition Metal Dichalcogenides
Chang, Y., Yang, N., Min, J., Zheng, F., Huang, C., Chen, J., Zhang, Y., & 12 others, 29 Nov 2023, (Online published) In: Advanced Functional Materials. 2311387.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 1 - Online published
Switching periodic event-triggered H∞ control for NCSs and its application to UAVs
Wu, Z., Wang, Y., Xiong, J. & Xie, M., 28 Nov 2023, (Online published) In: IEEE Transactions on Vehicular Technology.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
- Online published
Bayesian Analysis of Lifetime Delayed Degradation Process for Destructive/Nondestructive Inspection
Chen, S., Lu, Z., Hu, Q., Xie, M. & Yu, D., 23 Nov 2023, (Online published) In: IEEE Transactions on Reliability.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 1 - Online published
A Self-Assembled 3D/0D Quasi-Core–Shell Structure as Internal Encapsulation Layer for Stable and Efficient FAPbI3 Perovskite Solar Cells and Modules
Wang, Y., Yang, C., Wang, Z., Li, G., Yang, Z., Wen, X., Hu, X., & 6 others, 21 Nov 2023, (Online published) In: Small. 2306954.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
- Published
A global strategy based on deep learning for time-dependent optimal reliability design
Ling, C., Li, X. & Kuo, W., Nov 2023, In: Quality and Reliability Engineering International. 39, 7, p. 2937-2956 20 p.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
- Published
Exploring the Potential of GaN-Based Power HEMTs with Coherent Channel
Chen, X., Wang, F., Wang, Z. & Huang, J., Nov 2023, In: Micromachines. 14, 11, 2041.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
- Published
Impact of institutional environment on entrepreneurial intention: The moderating role of entrepreneurship education
Zhuang, J. & Sun, H., Nov 2023, In: International Journal of Management Education. 21, 3, 100863.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 10 - Published
Latest Advancements in Next-Generation Semiconductors: Materials and Devices for Wide Bandgap and 2D Semiconductors
Wang, Z. & Huang, J., Nov 2023, In: Micromachines. 14, 11, 1992.Research output: Journal Publications and Reviews › Editorial Preface
Scopus citations: 1 - Published
Nanotwinning-assisted structurally stable copper for fine-pitch redistribution layer in 2.5D/3D IC packaging
Chen, C., Cherng, S., He, C., Chung, C., Wang, S., Huang, Y. & Feng, S. P., Nov 2023, In: Journal of Materials Research and Technology. 27, p. 4883-4890Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 2 - Published
Novel Kriging based learning function for system reliability analysis with correlated failure modes
Feng, K., Lu, Z., Yang, Y., Ling, C., He, P. & Dai, Y., Nov 2023, In: Reliability Engineering and System Safety. 239, 109529.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 6 - Published
Survival signature based robust redundancy allocation under imprecise probability
Ling, C., Yang, L., Feng, K. & Kuo, W., Nov 2023, In: Reliability Engineering and System Safety. 239, 109510.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 2 - Published
UHF RFID Antenna Sensor System Using Optimal Power-oriented Setup-independent Technique
Zhang, X., Li, H. & Chung, H. S., Nov 2023, In: IEEE Transactions on Antennas and Propagation. 71, 11, p. 8639-8647Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
