College of Engineering

Department of Systems Engineering

Organisational unit: Academic Departments

Research Output

  1. 2024
  2. Published

    Elements of Electromigration: Electromigration in 3D IC Technology

    Tu, K. & Liu, Y., 2024, Boca Raton: CRC Press.

    Research output: Scholarly Books, Monographs, Reports and Case StudiesRGC 11 - Research book or monograph (Author)peer-review

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  3. Published

    Inverible Gray Image with Predictive Coding

    zhang, Z. & luo, R., 2024, Proceedings - 2024 2nd International Conference on Computer Graphics and Image Processing CGIP 2024. Institute of Electrical and Electronics Engineers, Inc., p. 54-59

    Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

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  4. Published

    Machine Learning Aided Six Sigma: Perspective and Practical Implementation

    Maged, A., Haridy, S., Awad, M. & Shamsuzzaman, M., 2024, In: IEEE Transactions on Engineering Management. 71, p. 1519-1530

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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  5. Published

    Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders

    Qiao, J., Mao, X., Tu, K. & Liu, Y., 2024, 2024 International Conference on Electronics Packaging (ICEP). Institute of Electrical and Electronics Engineers, Inc., p. 13-14 (International Conference on Electronics Packaging, ICEP).

    Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

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  6. Published

    Nanocrystalline copper for direct copper-to-copper bonding with improved cross-interface formation at low thermal budget

    He, C., Zhou, J., Zhou, R., Chen, C., Jing, S., Mu, K., Huang, Y., & 5 othersChung, C., Cherng, S., Lu, Y., Tu, K. & Feng, S., 2024, In: Nature Communications. 12, 7095.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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  7. Published

    Reliable and Lightweight Adaptive Convolution Network for PCB Surface Defect Detection

    Lei, L., Li, H. & Yang, H., 2024, In: IEEE Transactions on Instrumentation and Measurement. 73, 2003208.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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  8. Published
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  9. Published

    The innovation paradox: Concept space expansion with diminishing originality and the promise of creative artificial intelligence

    Sarica, S. & Luo, J., 2024, In: Design Science. 10, 18 p., e11.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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  10. Published

    Variational AutoEncoders-LSTM based fault detection of time-dependent high dimensional processes

    Maged, A., Lui, C. F., Haridy, S. & Xie, M., 2024, In: International Journal of Production Research. 62, 4, p. 1092–1107 16 p.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 10
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  11. Published

    基于温度循环加速退化试验的光纤连接器寿命评估

    张楠, 冯业为, 李鹏, 张泽明 & 张雯, 2024, In: 环境技术. 2

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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  12. 2023
  13. Published

    Synergistic role of Cu-C and Cu-N dual bonding of nanostructured g-C3N4/Cu2SnS3 photocatalysts for efficient CO2 conversion to CO

    Omr, H. A. E., Putikam, R., Feng, S., Lin, M. & Lee, H., 15 Dec 2023, In: Applied Catalysis B: Environmental. 339, 123103.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 18
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  14. Published

    基于多源异构信息的航空发动机转子参数校准与可靠性分析

    杨乐昌 & 汪晨星, 15 Dec 2023, In: 航空学报. 44, 23, 228575.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

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  15. Online published

    Enhancing the sustainability and robustness of critical material supply in electrical vehicle market: an AI-powered supplier selection approach

    Wang, Z., Chen, Z., Su, Q., Chin, K., Pedrycz, W. & Skibniewski, M. J., 8 Dec 2023, (Online published) In: Annals of Operations Research.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 5
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  16. Published

    Robust ADP-based control for uncertain nonlinear Stackelberg games

    Yu, L., Lai, J., Xiong, J. & Xie, M., 7 Dec 2023, In: Neurocomputing. 561, 126834.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 1
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  17. Published

    High Thermopower of Agarose-Based Ionic Thermoelectric Gel Through Micellization Effect Decoupling the Cation/Anion Thermodiffusion

    Li, Q., Yu, D., Wang, S., Zhang, X., Li, Y., Feng, S. & Liu, W., 1 Dec 2023, In: Advanced Functional Materials. 33, 49, 2305835.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 11
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  18. Published

    A sequential three-way classification model based on risk preference and decision correction[Formula presented]

    Liang, P., Cao, W. & Hu, J., Dec 2023, In: Applied Soft Computing. 149, Part A, 110978.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 2
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  19. Published

    Bioinspired, heredity-derived hierarchical bulk multifunctional copper alloys

    Shi, P., Shen, Z., Wang, H., Li, Z., Gu, Y., Li, Y., Yan, J., & 20 othersLin, Z., Wang, M., Yang, Y., Ling, C., Ding, B., Min, N., Peng, J., Luan, J., Liu, T., Ren, W., Lei, Z., Zhou, Y., Liu, Y., Liang, N., van Aken, P. A., Ren, Y., Zhong, Y., Liu, C. T., Gao, H. & Zhu, Y., Dec 2023, In: Materials Today. 71, p. 22-37

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 3
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  20. Published

    Composing Parameter-Efficient Modules with Arithmetic Operations

    Zhang, J., Chen, S., Liu, J. & He, J., Dec 2023, Advances in Neural Information Processing Systems 36 (NeurIPS 2023). Oh, A., Naumann, T., Globerson, A., Saenko, K., Hardt, M. & Levine, S. (eds.). Neural Information Processing Systems (NeurIPS), 22 p. (Advances in Neural Information Processing Systems).

    Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

    Scopus citations: 3
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  21. Published

    Failure of Ball Grid Array during Electromigration and the Simulation of Dynamic Void Formation

    Yao, Y., An, Y., Tu, K. & Liu, Y., Dec 2023, Proceedings of the 25th Electronics Packaging Technology Conference (EPTC 2023). TAY, A., CHUI, K. J., LIM, Y. K., TAN, C. S. & SHIN, S. (eds.). Institute of Electrical and Electronics Engineers, Inc., p. 316-319 (Proceedings of the Electronics Packaging Technology Conference, EPTC).

    Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

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  22. Published

    Fast Bellman Updates for Wasserstein Distributionally Robust MDPs

    Yu, Z., Dai, L., Xu, S., Gao, S. & Ho, C. P., Dec 2023, NeurIPS Proceedings: Advances in Neural Information Processing Systems 36 (NeurIPS 2023). Oh, A., Naumann, T., Globerson, G., Saenko, K., Hardt, M. & Levine, S. (eds.). Neural Information Processing Systems (NeurIPS), Vol. 36. (Advances in Neural Information Processing Systems).

    Research output: Chapters, Conference Papers, Creative and Literary WorksRGC 32 - Refereed conference paper (with host publication)peer-review

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