Soldering and Surface Mount Technology

Soldering and Surface Mount Technology

ISSNs: 0954-0911, 0263-0060

Additional searchable ISSN (Electronic): 1758-6836

Emerald Group Publishing Limited, United Kingdom

Scopus rating (2021): CiteScore 3.6 SJR 0.256 SNIP 0.801

Journal

Journal Metrics
1 - 10 out of 10Page size: 20

Research Output

  1. 2016
  2. Published

    An investigation of microstructure and properties of Sn3.0Ag0.5Cu-XAl2O3 composite solder

    Chen, G., Huang, B., Liu, H., Chan, Y. C., Tang, Z. & Wu, F., 2016, In: Soldering and Surface Mount Technology. 28, 2, p. 84-92

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 7
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  3. Published

    Retained ratio of reinforcement in SAC305 composite solder joints: Effect of reinforcement type, processing and reflow cycle

    Chen, G., Liu, L., Silberschmidt, V. V., Chan, Y. C., Liu, C. & Wu, F., 2016, In: Soldering and Surface Mount Technology. 28, 3, p. 159-166

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 9
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  4. 2010
  5. Published

    An experimental methodology for the study of co-planarity variation effects in anisotropic conductive adhesive assemblies

    Dou, G., Whalley, D. C., Liu, C. & Chan, Y. C., 2010, In: Soldering and Surface Mount Technology. 22, 1, p. 47-55

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 11
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  6. 2006
  7. Published

    Macro-micro modelling of moisture induced stresses in an ACF flip chip assembly

    Yin, C. Y., Lu, H., Bailey, C. & Chan, Y. C., 2006, In: Soldering and Surface Mount Technology. 18, 2, p. 27-32

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 13
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  8. Published

    RLC effects in fine pitch anisotropic conductive film connections

    Dou, G., Chan, Y. C., Morris, J. E. & Whalley, D. C., 2006, In: Soldering and Surface Mount Technology. 18, 1, p. 3-10

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 8
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  9. 2005
  10. Published

    Modelling the effect of voids in anisotropic conductive adhesive joints

    Lee, K. K., Yeung, N. H. & Chan, Y. C., 2005, In: Soldering and Surface Mount Technology. 17, 1, p. 4-12

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 8
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  11. Published

    The effect of curing on the performance of ACF bonded chip-on-flex assemblies after thermal ageing

    Rizvi, M. J., Chan, Y. C., Bailey, C., Lu, H. & Sharif, A., 2005, In: Soldering and Surface Mount Technology. 17, 2, p. 40-48

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 46
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  12. Published

    The effect of thermal cycling on the contact resistance of anisotropic conductive joints

    Ali, L., Chan, Y. C. & Alam, M. O., 2005, In: Soldering and Surface Mount Technology. 17, 3, p. 20-31

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 11
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  13. 2002
  14. Published

    Degradation of flip-chip-on-glass interconnection with ACF under high humidity and thermal aging

    Wu, C. M. L. & Chau, M. L., 2002, In: Soldering and Surface Mount Technology. 14, 2, p. 51-58

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 17
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  15. 2001
  16. Published

    Effects of bump height on the reliability of ACF in flip-chip

    Wu, C. M. L., Liu, J. & Yeung, N. H., 2001, In: Soldering and Surface Mount Technology. 13, 1, p. 25-30

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 36
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