Microelectronics and Reliability

Microelectronics and Reliability

ISSNs: 0026-2714

Additional searchable ISSN (Electronic): 1872-941X

PERGAMON-ELSEVIER SCIENCE LTD, United Kingdom

Scopus rating (2021): CiteScore 3.5 SJR 0.452 SNIP 0.851

Journal

Journal Metrics
1 - 20 out of 124Page size: 20

Research Output

  1. 2019

  2. Study of grain size effect of Cu metallization on interfacial microstructures of solder joints

    Zheng, Z., Chiang, P., Huang, Y., Wang, W., Li, P., Tsai, Y., Chen, C., & 1 othersFeng, S., Aug 2019, In: Microelectronics Reliability. 99, p. 44-51

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 6
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  3. Published

    Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect

    Zhu, Z., Chan, Y. & Wu, F., Jan 2019, In: Microelectronics Reliability. 92, p. 12-19

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 12
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  4. 2018
  5. Published

    Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing

    Zhu, Z., Chan, Y. & Wu, F., Dec 2018, In: Microelectronics Reliability. 91, p. 179-182

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 11
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  6. Published

    Statistical nature of hard breakdown recovery in high-κ dielectric stacks studied using ramped voltage stress

    Feng, X., Raghavan, N., Mei, S., Dong, S., Pey, K. L. & Wong, H., Sep 2018, In: Microelectronics Reliability. 88-90, p. 164-168

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 1
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  7. Published

    A double snapback SCR ESD protection scheme for 28 nm CMOS process

    Hu, T., Dong, S., Jin, H., Wong, H., Xu, Z., Li, X. & Liou, J. J., May 2018, In: Microelectronics Reliability. 84, p. 20-25

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 13
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  8. 2017

  9. Growth competition between layer-type and porous-type Cu3Sn in microbumps

    Chu, D. T., Chu, Y., Lin, J., Chen, Y., Wang, C., Song, Y., Chiang, C., & 2 othersChen, C. & Tu, K. N., 1 Dec 2017, In: Microelectronics Reliability. 79, p. 32-37

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 21
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  10. Published

    Battery remaining useful life prediction at different discharge rates

    Wang, D., Yang, F., Zhao, Y. & Tsui, K., Nov 2017, In: Microelectronics Reliability. 78, p. 212-219

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 48
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  11. Published

    Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds

    Pun, K. P. L., Dhaka, N. S., Cheung, C. & Chan, A. H. S., Nov 2017, In: Microelectronics Reliability. 78, p. 339-348

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 6
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  12. Published

    Prognostics of Lithium-ion batteries based on state space modeling with heterogeneous noise variance

    Wang, D., Yang, F., Zhao, Y. & Tsui, K. L., Aug 2017, In: Microelectronics Reliability. 75, p. 1-8

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 22
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  13. Published

    Prognostics of Li(NiMnCo)O2-based lithium-ion batteries using a novel battery degradation model

    Yang, F., Wang, D., Xing, Y. & Tsui, K., Mar 2017, In: Microelectronics Reliability. 70, p. 70-78

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 74
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  14. 2016
  15. Published

    Editorial

    Asenov, A., Schichtmann, U., Tan, C. M., Wong, H. & Zhou, X., 1 Jun 2016, In: Microelectronics Reliability. 61, p. 1-2

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › Editorial Preface

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  16. Published

    Comparative study of reliability degradation behaviors of LDMOS and LDMOS-SCR ESD protection devices

    Yu, Z., Jin, H., Dong, S., Wong, H., Zeng, J. & Wang, W., Jun 2016, In: Microelectronics Reliability. 61, p. 111-114

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 1
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  17. Effects of thermal annealing on the charge localization characteristics of HfO2/Au/HfO2 stack

    Feng, X., Dong, S., Wong, H., Yu, D., Pey, K. L., Shubhakar, K. & Lau, W. S., Jun 2016, In: Microelectronics Reliability. 61, p. 78-81

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 5
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  18. Published

    Simulation and evaluation of the peak temperature in LED light bulb heatsink

    Sun, L., Zhu, J. & Wong, H., Jun 2016, In: Microelectronics Reliability. 61, p. 140-144

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 13
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  19. The variation of the leakage current characteristics of W/Ta2O5/W MIM capacitors with the thickness of the bottom W electrode

    Yu, D. Q., Lau, W. S., Wong, H., Feng, X., Dong, S. & Pey, K. L., Jun 2016, In: Microelectronics Reliability. 61, p. 95-98

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 8
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  20. 2015
  21. Published

    Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints

    Hu, T., Li, Y., Chan, Y. & Wu, F., Jul 2015, In: Microelectronics Reliability. 55, 8, p. 1226-1233 11538.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 40
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  22. 2014

  23. Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

    Hu, X., Li, Y., Liu, Y., Liu, Y. & Min, Z., Aug 2014, In: Microelectronics Reliability. 54, 8, p. 1575-1582

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 51
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  24. Published

    On the current conduction mechanisms of CeO2/La 2O3 stacked gate dielectric

    Feng, X., Wong, H., Yang, B. L., Dong, S., Iwai, H. & Kakushima, K., Jun 2014, In: Microelectronics Reliability. 54, 6-7, p. 1133-1136

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 7
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  25. Published

    Snapback breakdown ESD device based on zener diodes on silicon-on-insulator technology

    Tam, W., Kok, C., Siu, S. & Wong, H., Jun 2014, In: Microelectronics Reliability. 54, 6-7, p. 1163-1168

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 8
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  26. Published

    Special section reliability and variability of devices for circuits and systems

    Asenov, A., Schlichtmann, U., Tan, C. M., Wong, H. & Zhou, X., Jun 2014, In: Microelectronics Reliability. 54, 6-7

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

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