Microelectronics and Reliability
Microelectronics and Reliability
ISSNs: 0026-2714
Additional searchable ISSN (Electronic): 1872-941X
PERGAMON-ELSEVIER SCIENCE LTD, United Kingdom
Scopus rating (2021): CiteScore 3.5 SJR 0.452 SNIP 0.851
Journal
Research Output
- 2019
Study of grain size effect of Cu metallization on interfacial microstructures of solder joints
Zheng, Z., Chiang, P., Huang, Y., Wang, W., Li, P., Tsai, Y., Chen, C., & 1 others , Aug 2019, In: Microelectronics Reliability. 99, p. 44-51Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 6- Published
Effect of alternating current (AC) stressing on the microstructure and mechanical properties of low-silver content solder interconnect
Zhu, Z., Chan, Y. & Wu, F., Jan 2019, In: Microelectronics Reliability. 92, p. 12-19Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 12 - 2018
- Published
Failure mechanisms of solder interconnects under current stressing in advanced electronic packages: An update on the effect of alternating current (AC) stressing
Zhu, Z., Chan, Y. & Wu, F., Dec 2018, In: Microelectronics Reliability. 91, p. 179-182Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 11 - Published
Statistical nature of hard breakdown recovery in high-κ dielectric stacks studied using ramped voltage stress
Feng, X., Raghavan, N., Mei, S., Dong, S., Pey, K. L. & Wong, H., Sep 2018, In: Microelectronics Reliability. 88-90, p. 164-168Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 1 - Published
A double snapback SCR ESD protection scheme for 28 nm CMOS process
Hu, T., Dong, S., Jin, H., Wong, H., Xu, Z., Li, X. & Liou, J. J., May 2018, In: Microelectronics Reliability. 84, p. 20-25Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 13 - 2017
Growth competition between layer-type and porous-type Cu3Sn in microbumps
Chu, D. T., Chu, Y., Lin, J., Chen, Y., Wang, C., Song, Y., Chiang, C., & 2 others , 1 Dec 2017, In: Microelectronics Reliability. 79, p. 32-37Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 21- Published
Battery remaining useful life prediction at different discharge rates
Wang, D., Yang, F., Zhao, Y. & Tsui, K., Nov 2017, In: Microelectronics Reliability. 78, p. 212-219Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 48 - Published
Effect of ENEPIG metallization for solid-state gold-gold diffusion bonds
Pun, K. P. L., Dhaka, N. S., Cheung, C. & Chan, A. H. S., Nov 2017, In: Microelectronics Reliability. 78, p. 339-348Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 6 - Published
Prognostics of Lithium-ion batteries based on state space modeling with heterogeneous noise variance
Wang, D., Yang, F., Zhao, Y. & Tsui, K. L., Aug 2017, In: Microelectronics Reliability. 75, p. 1-8Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 22 - Published
Prognostics of Li(NiMnCo)O2-based lithium-ion batteries using a novel battery degradation model
Yang, F., Wang, D., Xing, Y. & Tsui, K., Mar 2017, In: Microelectronics Reliability. 70, p. 70-78Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 74 - 2016
- Published
Editorial
Asenov, A., Schichtmann, U., Tan, C. M., Wong, H. & Zhou, X., 1 Jun 2016, In: Microelectronics Reliability. 61, p. 1-2Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › Editorial Preface
- Published
Comparative study of reliability degradation behaviors of LDMOS and LDMOS-SCR ESD protection devices
Yu, Z., Jin, H., Dong, S., Wong, H., Zeng, J. & Wang, W., Jun 2016, In: Microelectronics Reliability. 61, p. 111-114Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 1 Effects of thermal annealing on the charge localization characteristics of HfO2/Au/HfO2 stack
Feng, X., Dong, S., Wong, H., Yu, D., Pey, K. L., Shubhakar, K. & Lau, W. S., Jun 2016, In: Microelectronics Reliability. 61, p. 78-81Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 5- Published
Simulation and evaluation of the peak temperature in LED light bulb heatsink
Sun, L., Zhu, J. & Wong, H., Jun 2016, In: Microelectronics Reliability. 61, p. 140-144Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 13 The variation of the leakage current characteristics of W/Ta2O5/W MIM capacitors with the thickness of the bottom W electrode
Yu, D. Q., Lau, W. S., Wong, H., Feng, X., Dong, S. & Pey, K. L., Jun 2016, In: Microelectronics Reliability. 61, p. 95-98Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 8- 2015
- Published
Effect of nano Al2O3 particles doping on electromigration and mechanical properties of Sn-58Bi solder joints
Hu, T., Li, Y., Chan, Y. & Wu, F., Jul 2015, In: Microelectronics Reliability. 55, 8, p. 1226-1233 11538.Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 40 - 2014
Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging
Hu, X., Li, Y., Liu, Y., Liu, Y. & Min, Z., Aug 2014, In: Microelectronics Reliability. 54, 8, p. 1575-1582Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 51- Published
On the current conduction mechanisms of CeO2/La 2O3 stacked gate dielectric
Feng, X., Wong, H., Yang, B. L., Dong, S., Iwai, H. & Kakushima, K., Jun 2014, In: Microelectronics Reliability. 54, 6-7, p. 1133-1136Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 7 - Published
Snapback breakdown ESD device based on zener diodes on silicon-on-insulator technology
Tam, W., Kok, C., Siu, S. & Wong, H., Jun 2014, In: Microelectronics Reliability. 54, 6-7, p. 1163-1168Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 8 - Published
Special section reliability and variability of devices for circuits and systems
Asenov, A., Schlichtmann, U., Tan, C. M., Wong, H. & Zhou, X., Jun 2014, In: Microelectronics Reliability. 54, 6-7Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review