Microelectronic Engineering

Microelectronic Engineering

ISSNs: 0167-9317

Additional searchable ISSN (Electronic): 1873-5568

Elsevier BV, Netherlands

Scopus rating (2020): CiteScore 4.5 SJR 0.553 SNIP 0.915

Journal

Journal Metrics

Research Output

  1. 2021
  2. Published

    Fabrication and nanoindentation characterization of nickel micro-pillar mold for nanoimprint lithography

    Li, M., Luo, W., Chen, Y., Zheng, Y. & Cheng, X., 15 Oct 2021, In: Microelectronic Engineering. 250, 111636.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 3
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  3. 2017
  4. Published

    Role of metal nanocrystals on the breakdown statistics of flash memory high-κ stacks

    Feng, X., Raghavan, N., Mei, S., Du, L., Pey, K. L. & Wong, H., 25 Jun 2017, In: Microelectronic Engineering. 178, p. 293-297

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1
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  5. 2016
  6. Fabrication of a W/CuxO/Cu memristor with sub-micron holes for passive sensing of oxygen

    Nyenke, C. & Dong, L., 1 Oct 2016, In: Microelectronic Engineering. 164, p. 48-52

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 6
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  7. Published

    Glucose oxidase immobilization platform based on ZnO nanowires supported by silicon nanowires for glucose biosensing

    Miao, F., Lu, X., Tao, B., Li, R. & Chu, P. K., 5 Jan 2016, In: Microelectronic Engineering. 149, p. 153-158

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 28
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  8. 2015
  9. Characterization and bio-binding ability study on size-controllable highly monodisperse magnetic nanoparticles

    Li, L., Ruotolo, A., Leung, C. W., Jiang, C. P. & Pong, P. W. T., 16 Aug 2015, In: Microelectronic Engineering. 144, p. 61-67

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 8
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  10. Published

    Ordered-standing nickel hydroxide microchannel arrays: Synthesis and application for highly sensitive non-enzymatic glucose sensors

    Miao, F., Tao, B. & Chu, P. K., 3 Aug 2015, In: Microelectronic Engineering. 133, p. 11-15

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 9
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  11. Published

    A memristive diode for neuromorphic computing

    Wang, X., Shao, Q., Ku, P. S. & Ruotolo, A., 20 Apr 2015, In: Microelectronic Engineering. 138, p. 7-11

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 4
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  12. Published

    On the scaling of subnanometer EOT gate dielectrics for ultimate nano CMOS technology

    Wong, H. & Iwai, H., 20 Apr 2015, In: Microelectronic Engineering. 138, p. 57-76

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 32
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  13. Published

    Quasi-analytical model of ballistic cylindrical surrounding gate nanowire MOSFET

    Xu, W., Wong, H., Kakushima, K. & Iwai, H., 20 Apr 2015, In: Microelectronic Engineering. 138, p. 111-117 9754.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 13
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  14. 2014
  15. Published

    Study of microstructure evolution in novel Sn-Zn/Cu bi-layer and Cu/Sn-Zn/Cu sandwich structures with nanoscale thickness for 3D packaging interconnection

    Li, Q., Chan, Y. C., Zhang, K. & Yung, K. C., 25 Jun 2014, In: Microelectronic Engineering. 122, p. 52-58

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 8
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  16. 2013
  17. Published

    A study of degradation of indium tin oxide thin films on glass for display applications

    Leung, W. S., Chan, Y. C. & Lui, S. M., Jan 2013, In: Microelectronic Engineering. 101, p. 1-7

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 14
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  18. Published

    Effects of moisture absorption on anisotropic conductive films interconnection for flip chip on flex applications

    Yin, C. Y., Lu, H., Bailey, C. & Chan, Y. C., 2013, In: Microelectronic Engineering. 107, p. 17-22

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 9
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  19. Published

    Feature development on prepatterned elastomer surfaces upon ion implantation

    Sun, Y., Wang, H. Y., Xiong, T., Chu, P. K. & Leung, C. W., 2013, In: Microelectronic Engineering. 110, p. 346-349

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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  20. 2010
  21. The effect of sputtered W-based carbide diffusion barriers on the thermal stability and void formation in copper thin films

    Xie, Q., Jiang, Y., De Keyser, K., Detavernier, C., Deduytsche, D., Ru, G., Qu, X. & 1 others, Tu, K. N., Dec 2010, In: Microelectronic Engineering. 87, 12, p. 2535-2539

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 7
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  22. Gate oxide wear out using novel polysilazane-base inorganic as nano-scaling shallow trench filling

    Ho, C. Y., Shih, K. & He, J. H., Apr 2010, In: Microelectronic Engineering. 87, 4, p. 580-583

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1
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  23. 2009
  24. Published

    Effect of small Sn-3.5Ag-0.5Cu additions on the structure and properties of Sn-9Zn solder in ball grid array packages

    Gain, A. K., Chan, Y. C., Sharif, A. & Yung, W. K. C., Nov 2009, In: Microelectronic Engineering. 86, 11, p. 2347-2353

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 25
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  25. Published

    Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads

    Das, S. K., Sharif, A., Chan, Y. C., Wong, N. B. & Yung, W. K. C., Oct 2009, In: Microelectronic Engineering. 86, 10, p. 2086-2093

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 24
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  26. Aging effect of rolled-up InGaAs/GaAs/Cr helical nanobelts

    Zhang, L., Xu, D., Dong, L. & Nelson, B. J., Apr 2009, In: Microelectronic Engineering. 86, 4-6, p. 824-827

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 6
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  27. Published

    Stability of submicron AlGaN/GaN HEMT devices irradiated by gamma rays

    Jha, S., Jelenković, E. V., Pejović, M. M., Ristić, G. S., Pejović, M., Tong, K. Y., Surya, C. & 2 others, Bello, I. & Zhang, W. J., Jan 2009, In: Microelectronic Engineering. 86, 1, p. 37-40

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 27
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  28. 2008
  29. Nanotwin formation and its physical properties and effect on reliability of copper interconnects

    Xu, D., Sriram, V., Ozolins, V., Yang, J., Tu, K. N., Stafford, G. R., Beauchamp, C. & 4 others, Zienert, I., Geisler, H., Hofmann, P. & Zschech, E., Oct 2008, In: Microelectronic Engineering. 85, 10, p. 2155-2158

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 28
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