Materials Science and Engineering: R: Reports

Materials Science and Engineering: R: Reports

ISSNs: 0927-796X

Elsevier BV, Netherlands

Scopus rating (2020): CiteScore 41.7 SJR 8.366 SNIP 7.483

Journal

Journal Metrics

Research Output

  1. 2019
  2. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology

    Tu, K. N. & Liu, Y., Apr 2019, In: Materials Science and Engineering R: Reports. 136, p. 1-12

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 50
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  3. 2018
  4. Structural evolutions of metallic materials processed by severe plastic deformation

    Cao, Y., Ni, S., Liao, X., Song, M. & Zhu, Y., Nov 2018, In: Materials Science and Engineering R: Reports. 133, p. 1-59

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 214
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  5. 2014
  6. Structure and properties of lead-free solders bearing micro and nano particles

    Zhang, L. & Tu, K. N., Aug 2014, In: Materials Science and Engineering R: Reports. 82, 1, p. 1-32

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 222
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  7. 2012
  8. Thermomigration in solder joints

    Chen, C., Hsiao, H., Chang, Y., Ouyang, F. & Tu, K. N., Sep 2012, In: Materials Science and Engineering R: Reports. 73, 9-10, p. 85-100

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 99
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  9. 2010
  10. Boron nitride nanotubes

    Zhi, C., Bando, Y., Tang, C. & Golberg, D., 22 Nov 2010, In: Materials Science and Engineering R: Reports. 70, 3-6, p. 92-111

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 359
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  11. Nucleation and growth of epitaxial silicide in silicon nanowires

    Chou, Y., Lu, K. & Tu, K. N., 22 Nov 2010, In: Materials Science and Engineering R: Reports. 70, 3-6, p. 112-125

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 27
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  12. 2002
  13. Progress in the room-temperature optical functions of semiconductors

    Djurišić, A. B., Chan, Y. & Herbert Li, E., 15 Aug 2002, In: Materials Science and Engineering: R: Reports. 38, 6, p. 237-293

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 85
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  14. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

    Zeng, K. & Tu, K. N., 14 Jun 2002, In: Materials Science and Engineering: R: Reports. 38, 2, p. 55-105

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1296
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  15. 2001
  16. Tin-lead (SnPb) solder reaction in flip chip technology

    Tu, K. N. & Zeng, K., 2 Jul 2001, In: Materials Science and Engineering: R: Reports. 34, 1, p. 1-58

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 599
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