Materials Science and Engineering: R: Reports
Materials Science and Engineering: R: Reports
ISSNs: 0927-796X
Elsevier BV, Netherlands
Scopus rating (2021): CiteScore 43 SJR 6.443 SNIP 6.593
Journal
Research Output
- 2019
Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology
Tu, K. N. & Liu, Y., Apr 2019, In: Materials Science and Engineering R: Reports. 136, p. 1-12Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 95- 2018
Structural evolutions of metallic materials processed by severe plastic deformation
Cao, Y., Ni, S., Liao, X., Song, M. & Zhu, Y., Nov 2018, In: Materials Science and Engineering R: Reports. 133, p. 1-59Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 312- 2014
Structure and properties of lead-free solders bearing micro and nano particles
Zhang, L. & Tu, K. N., Aug 2014, In: Materials Science and Engineering R: Reports. 82, 1, p. 1-32Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 269- 2012
Thermomigration in solder joints
Chen, C., Hsiao, H., Chang, Y., Ouyang, F. & Tu, K. N., Sep 2012, In: Materials Science and Engineering R: Reports. 73, 9-10, p. 85-100Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 121- 2010
Boron nitride nanotubes
Zhi, C., Bando, Y., Tang, C. & Golberg, D., 22 Nov 2010, In: Materials Science and Engineering R: Reports. 70, 3-6, p. 92-111Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 399Nucleation and growth of epitaxial silicide in silicon nanowires
Chou, Y., Lu, K. & Tu, K. N., 22 Nov 2010, In: Materials Science and Engineering R: Reports. 70, 3-6, p. 112-125Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 32- 2002
Progress in the room-temperature optical functions of semiconductors
Djurišić, A. B., Chan, Y. & Herbert Li, E., 15 Aug 2002, In: Materials Science and Engineering: R: Reports. 38, 6, p. 237-293Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 89Six cases of reliability study of Pb-free solder joints in electronic packaging technology
Zeng, K. & Tu, K. N., 14 Jun 2002, In: Materials Science and Engineering: R: Reports. 38, 2, p. 55-105Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 1335- 2001
Tin-lead (SnPb) solder reaction in flip chip technology
Tu, K. N. & Zeng, K., 2 Jul 2001, In: Materials Science and Engineering: R: Reports. 34, 1, p. 1-58Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 620