Materials Science and Engineering: R: Reports

Materials Science and Engineering: R: Reports

ISSNs: 0927-796X

Elsevier BV, Netherlands

Scopus rating (2021): CiteScore 43 SJR 6.443 SNIP 6.593

Journal

Journal Metrics
1 - 9 out of 9Page size: 20

Research Output

  1. 2019

  2. Recent advances on kinetic analysis of solder joint reactions in 3D IC packaging technology

    Tu, K. N. & Liu, Y., Apr 2019, In: Materials Science and Engineering R: Reports. 136, p. 1-12

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 95
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  3. 2018

  4. Structural evolutions of metallic materials processed by severe plastic deformation

    Cao, Y., Ni, S., Liao, X., Song, M. & Zhu, Y., Nov 2018, In: Materials Science and Engineering R: Reports. 133, p. 1-59

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 312
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  5. 2014

  6. Structure and properties of lead-free solders bearing micro and nano particles

    Zhang, L. & Tu, K. N., Aug 2014, In: Materials Science and Engineering R: Reports. 82, 1, p. 1-32

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 269
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  7. 2012

  8. Thermomigration in solder joints

    Chen, C., Hsiao, H., Chang, Y., Ouyang, F. & Tu, K. N., Sep 2012, In: Materials Science and Engineering R: Reports. 73, 9-10, p. 85-100

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 121
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  9. 2010

  10. Boron nitride nanotubes

    Zhi, C., Bando, Y., Tang, C. & Golberg, D., 22 Nov 2010, In: Materials Science and Engineering R: Reports. 70, 3-6, p. 92-111

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 399
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  11. Nucleation and growth of epitaxial silicide in silicon nanowires

    Chou, Y., Lu, K. & Tu, K. N., 22 Nov 2010, In: Materials Science and Engineering R: Reports. 70, 3-6, p. 112-125

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 32
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  12. 2002

  13. Progress in the room-temperature optical functions of semiconductors

    Djurišić, A. B., Chan, Y. & Herbert Li, E., 15 Aug 2002, In: Materials Science and Engineering: R: Reports. 38, 6, p. 237-293

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 89
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  14. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

    Zeng, K. & Tu, K. N., 14 Jun 2002, In: Materials Science and Engineering: R: Reports. 38, 2, p. 55-105

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 1335
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  15. 2001

  16. Tin-lead (SnPb) solder reaction in flip chip technology

    Tu, K. N. & Zeng, K., 2 Jul 2001, In: Materials Science and Engineering: R: Reports. 34, 1, p. 1-58

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 620
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