Journal of Materials Science: Materials in Electronics

Journal of Materials Science: Materials in Electronics

ISSNs: 0957-4522

Additional searchable ISSN (electronic): 1573-482X

Springer, United States

Scopus rating (2023): CiteScore 5 SJR 0.512 SNIP 0.696

Journal

Journal Metrics
41 - 54 out of 54Page size: 20

Research Output

  1. 2009
  2. Published

    The challenges in the fabrication of reliable polymer photonic devices

    Uddin, M. A. & Chan, H. P., Jan 2009, In: Journal of Materials Science: Materials in Electronics. 20, SUPPL. 1

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 12
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  3. Published

    Fabrication and application of long silicon nanowire yarns

    Shao, M.-W., Fu, Y., Cheng, L., Wang, X.-H., Ma, D.-D.-D. & Lee, S.-T., 2009, In: Journal of Materials Science: Materials in Electronics. 20, 12, p. 1200-1202

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 1
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  4. Published

    Structures and electrical properties of (Na 0.5K 0.5) NbO 3-Li(Ta 0.5Nb 0.5) O 3 lead-free piezoelectric ceramics

    Zuo, R., Su, S., Fu, J. & Xu, Z., 2009, In: Journal of Materials Science: Materials in Electronics. 20, 5, p. 469-472

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 13
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  5. 2007
  6. Published

    Direct robust bonding between Sn-based solder and Si substrate

    Yu, D. Q., Wu, C. M. L., Wong, Y. W. & Lai, J. K. L., Oct 2007, In: Journal of Materials Science: Materials in Electronics. 18, 10, p. 1057-1063

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 8
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  7. Published

    Interfacial adhesion of polymeric adhesive film on different surfaces in the fabrication of polymer photonic devices

    Uddin, M. A., Ho, W. F. & Chan, H. P., Jun 2007, In: Journal of Materials Science: Materials in Electronics. 18, 6, p. 655-663

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 11
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  8. Published

    Rare-earth additions to lead-free electronic solders

    Wu, C. M. L. & Wong, Y. W., Mar 2007, In: Journal of Materials Science: Materials in Electronics. 18, 1-3, p. 77-91

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 76
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  9. 2006
  10. Published

    Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

    Wu, B. Y., Zhong, H. W., Chan, Y. C. & Alam, M. O., Nov 2006, In: Journal of Materials Science: Materials in Electronics. 17, 11, p. 943-950

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 13
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  11. Published

    Effect of solder filler thickness on the mechanical stability of fiber-solder-ferrule joint under temperature cyclic loading

    Tan, C. W., Chan, Y. C. & Yeung, N. H., Apr 2006, In: Journal of Materials Science: Materials in Electronics. 17, 4, p. 325-333

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 2
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  12. 2005
  13. Published

    Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

    Sharif, A. & Chan, Y. C., Mar 2005, In: Journal of Materials Science: Materials in Electronics. 16, 3, p. 153-158

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 17
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  14. 2000
  15. Published

    Metallurgical reaction and mechanical strength of electroless Ni-P solder joints for advanced packaging applications

    Hung, K. C., Chan, Y. C. & Tang, C. W., Nov 2000, In: Journal of Materials Science: Materials in Electronics. 11, 8, p. 587-593

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 25
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  16. Published

    Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying

    Huang, M. L., Wu, C. M. L., Lai, J. K. L., Wang, L. & Wang, F. G., 2000, In: Journal of Materials Science: Materials in Electronics. 11, 1, p. 57-65

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 49
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  17. 1996
  18. Published

    Effect of dopants on ageing properties for the PMN-0.1 PT relaxor ferroelectric ceramics

    Wang, Y., Gui, Z., Chan, Y. C., Li, L. & Zhang, X., 1996, In: Journal of Materials Science: Materials in Electronics. 7, 2, p. 133-135

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 12
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  19. 1994
  20. Published

    Thermal shock resistance of miniaturized multilayer ceramic capacitors

    Yeung, F., Chan, Y. C., Wang, Y., Gui, Z. L. & Li, L. T., Dec 1994, In: Journal of Materials Science: Materials in Electronics. 5, 6, p. 339-343

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 6
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  21. Published

    Failure analysis of miniaturized multilayer ceramic capacitors in surface mount printed circuit board assemblies

    Chan, Y. C., Yeung, F. & Mok, T. S., Feb 1994, In: Journal of Materials Science: Materials in Electronics. 5, 1, p. 25-29

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 9
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