Journal of Materials Science: Materials in Electronics

Journal of Materials Science: Materials in Electronics

ISSNs: 0957-4522

Additional searchable ISSN (electronic): 1573-482X

Springer, United States

Scopus rating (2023): CiteScore 5 SJR 0.512 SNIP 0.696

Journal

Journal Metrics

Research Output

  1. 2009
  2. Published

    Fabrication and application of long silicon nanowire yarns

    Shao, M., Fu, Y., Cheng, L., Wang, X., Ma, D. & Lee, S., 2009, In: Journal of Materials Science: Materials in Electronics. 20, 12, p. 1200-1202

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 1
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  3. Published

    Structures and electrical properties of (Na 0.5K 0.5) NbO 3-Li(Ta 0.5Nb 0.5) O 3 lead-free piezoelectric ceramics

    Zuo, R., Su, S., Fu, J. & Xu, Z., 2009, In: Journal of Materials Science: Materials in Electronics. 20, 5, p. 469-472

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 13
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  4. 2007
  5. Published

    Direct robust bonding between Sn-based solder and Si substrate

    Yu, D. Q., Wu, C. M. L., Wong, Y. W. & Lai, J. K. L., Oct 2007, In: Journal of Materials Science: Materials in Electronics. 18, 10, p. 1057-1063

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 8
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  6. Published

    Interfacial adhesion of polymeric adhesive film on different surfaces in the fabrication of polymer photonic devices

    Uddin, M. A., Ho, W. F. & Chan, H. P., Jun 2007, In: Journal of Materials Science: Materials in Electronics. 18, 6, p. 655-663

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 10
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  7. Published

    Rare-earth additions to lead-free electronic solders

    Wu, C. M. L. & Wong, Y. W., Mar 2007, In: Journal of Materials Science: Materials in Electronics. 18, 1-3, p. 77-91

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 75
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  8. 2006
  9. Published

    Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

    Wu, B. Y., Zhong, H. W., Chan, Y. C. & Alam, M. O., Nov 2006, In: Journal of Materials Science: Materials in Electronics. 17, 11, p. 943-950

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 13
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  10. Published

    Effect of solder filler thickness on the mechanical stability of fiber-solder-ferrule joint under temperature cyclic loading

    Tan, C. W., Chan, Y. C. & Yeung, N. H., Apr 2006, In: Journal of Materials Science: Materials in Electronics. 17, 4, p. 325-333

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 2
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  11. 2005
  12. Published

    Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

    Sharif, A. & Chan, Y. C., Mar 2005, In: Journal of Materials Science: Materials in Electronics. 16, 3, p. 153-158

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 17
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  13. 2000
  14. Published

    Metallurgical reaction and mechanical strength of electroless Ni-P solder joints for advanced packaging applications

    Hung, K. C., Chan, Y. C. & Tang, C. W., Nov 2000, In: Journal of Materials Science: Materials in Electronics. 11, 8, p. 587-593

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 25
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  15. Published

    Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying

    Huang, M. L., Wu, C. M. L., Lai, J. K. L., Wang, L. & Wang, F. G., 2000, In: Journal of Materials Science: Materials in Electronics. 11, 1, p. 57-65

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 48
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  16. 1996
  17. Published

    Effect of dopants on ageing properties for the PMN-0.1 PT relaxor ferroelectric ceramics

    Wang, Y., Gui, Z., Chan, Y. C., Li, L. & Zhang, X., 1996, In: Journal of Materials Science: Materials in Electronics. 7, 2, p. 133-135

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 12
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  18. 1994
  19. Published

    Thermal shock resistance of miniaturized multilayer ceramic capacitors

    Yeung, F., Chan, Y. C., Wang, Y., Gui, Z. L. & Li, L. T., Dec 1994, In: Journal of Materials Science: Materials in Electronics. 5, 6, p. 339-343

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 6
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  20. Published

    Failure analysis of miniaturized multilayer ceramic capacitors in surface mount printed circuit board assemblies

    Chan, Y. C., Yeung, F. & Mok, T. S., Feb 1994, In: Journal of Materials Science: Materials in Electronics. 5, 1, p. 25-29

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 9
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