Journal of Materials Science: Materials in Electronics

Journal of Materials Science: Materials in Electronics

ISSNs: 0957-4522

Additional searchable ISSN (electronic): 1573-482X

Springer, United States

Scopus rating (2023): CiteScore 5 SJR 0.512 SNIP 0.696

Journal

Journal Metrics
21 - 40 out of 54Page size: 20

Research Output

  1. 2016
  2. Published

    Tensile creep behavior of Sn–Ag–Cu–Ni multicomponent lead-free solder alloy

    Zhao, N., Huang, M. L. & Wu, C. M. L., Jul 2016, In: Journal of Materials Science: Materials in Electronics. 27, 7, p. 6630-6636

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 3
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  3. 2015
  4. Published

    Electromigration in eutectic In-48Sn ball grid array (BGA) solder interconnections with Au/Ni/Cu pads

    Li, Y., Wu, F. & Chan, Y. C., Nov 2015, In: Journal of Materials Science: Materials in Electronics. 26, 11, p. 8522-8533

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 22
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  5. Published

    Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

    Gain, A. K., Zhang, L. & Chan, Y. C., Sept 2015, In: Journal of Materials Science: Materials in Electronics. 26, 9, p. 7039-7048

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 42
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  6. Published

    Influence of the aggregated Ag3Sn on the improvement of electromigration phenomenon in the doped Sn58Bi solder joints

    Sun, H., Chan, Y. C. & Wu, F., Jul 2015, In: Journal of Materials Science: Materials in Electronics. 26, 7, p. 5129-5134

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 22
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  7. Published

    The impact of reflow soldering induced dopant redistribution on the mechanical properties of CNTs doped Sn58Bi solder joints

    Sun, H., Chan, Y. C. & Wu, F., Jul 2015, In: Journal of Materials Science: Materials in Electronics. 26, 7, p. 5318-5325

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 11
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  8. 2014
  9. Published

    Influence of cerium oxide (CeO2) nanoparticles on the microstructure and hardness of tin–silver–copper (Sn–Ag–Cu) solders on silver (Ag) surface-finished copper (Cu) substrates

    Fouzder, T., Chan, Y. C. & Chan, D. K., Dec 2014, In: Journal of Materials Science: Materials in Electronics. 25, 12, p. 5375-5387

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 26
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  10. Published

    A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

    Sun, H., Li, Q. & Chan, Y. C., Oct 2014, In: Journal of Materials Science: Materials in Electronics. 25, 10, p. 4380-4390

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 47
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  11. Published

    Effect of TiO2 addition concentration on the wettability and intermetallic compounds growth of Sn3.0Ag0.5Cu-xTiO2 nano-composite solders

    Li, Y., Zhao, X., Liu, Y., Wang, Y. & Wang, Y., Sept 2014, In: Journal of Materials Science: Materials in Electronics. 25, 9, p. 3816-3827

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 30
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  12. Published

    Interfacial microstructure and hardness of nickel (Ni) nanoparticle-doped tin-silver-copper (Sn-Ag-Cu) solders on immersion silver (Ag)-plated copper (Cu) substrates

    Fouzder, T., Li, Q., Chan, Y. C. & Chan, D. K., Sept 2014, In: Journal of Materials Science: Materials in Electronics. 25, 9, p. 4012-4023

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 15
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  13. Published

    Effect of carbon nanotubes and their dispersion on electroless Ni-P under bump metallization for lead-free solder interconnection

    Xu, S., Hu, X., Yang, Y., Chen, Z. & Chan, Y. C., Jun 2014, In: Journal of Materials Science: Materials in Electronics. 25, 6, p. 2686-2691

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 20
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  14. Published

    Microstructure and kinetic analysis of the properties and behavior of nickel (Ni) nano-particle doped tin-zinc-bismuth (Sn-8Zn-3Bi) solders on immersion silver (Ag)-plated copper (Cu) substrates

    Fouzder, T., Li, Q., Chan, Y. C. & Chan, D. K., Jun 2014, In: Journal of Materials Science: Materials in Electronics. 25, 6, p. 2529-2539

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 12
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  15. Published

    Tin whiskers growth of SnAgIn solder on Kovar substrate with Au/Ni plating

    Li, Q., Chan, Y. C. & Chen, Z., Mar 2014, In: Journal of Materials Science: Materials in Electronics. 25, 3, p. 1222-1227

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 3
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  16. Published

    Effect of 1 wt% ZnO nanoparticles addition on the microstructure, IMC development, and mechanical properties of high Bi content Sn-57.6Bi-0.4Ag solder on Ni metalized Cu pads

    Wu, N., Ismathullakhan, S. & Chan, Y. C., 2014, In: Journal of Materials Science: Materials in Electronics. 25, 5, p. 2169-2176

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 13
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  17. 2013
  18. Published

    Influence of annealing temperature on the structural and optical properties of highly-oriented Al and Er co-doped ZnO films

    Kong, J.-Z., Wang, Z., Luan, C.-Y., Wang, M.-L., Zhou, F., Wu, X.-M. & Zhang, W.-J. & 4 others, Zhu, K.-J., Qiu, J.-H., Zapien, J.-A. & Lee, S.-T., Oct 2013, In: Journal of Materials Science: Materials in Electronics. 24, 10, p. 3868-3874

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 3
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  19. Published

    Photocatalytic behaviors of porous ZnO hierarchical structures fabricated via a precursor-pyrolyzing route

    Tong, Y., Cao, F., Tang, P., Chen, H. & Chu, P. K., Jan 2013, In: Journal of Materials Science: Materials in Electronics. 24, 1, p. 89-95

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 6
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  20. 2012
  21. Published

    Relationship between microstructural evolution and electric properties of B 2O 3-CaCu 3Ti 4O 12 composite ceramics

    Yuan, W.-X., Li, Z. J. & Wang, C. D., Aug 2012, In: Journal of Materials Science: Materials in Electronics. 23, 8, p. 1552-1557

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 7
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  22. Published

    Influence of small Sb nanoparticles additions on the microstructure, hardness and tensile properties of Sn-9Zn binary eutectic solder alloy

    Shafiq, I., Chan, Y. C., Wong, N. B. & Yung, W. K. C., Jul 2012, In: Journal of Materials Science: Materials in Electronics. 23, 7, p. 1427-1434

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 20
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  23. 2011
  24. Published

    Thermomigration and electromigration in Sn8Zn3Bi solder joints

    Gu, X., Yung, K. C., Chan, Y. C. & Yang, D., Mar 2011, In: Journal of Materials Science: Materials in Electronics. 22, 3, p. 217-222

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 19
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  25. 2010
  26. Published

    Effect of Y 2O 3 particles on microstructure formation and shear properties of Sn-58Bi solder

    Liu, X., Huang, M., Wu, C. M. L. & Wang, L., Oct 2010, In: Journal of Materials Science: Materials in Electronics. 21, 10, p. 1046-1054

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 66
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  27. Published

    Thermomigration and electromigration in Sn58Bi ball grid array solder joints

    Gu, X., Yung, K. C. & Chan, Y. C., Oct 2010, In: Journal of Materials Science: Materials in Electronics. 21, 10, p. 1090-1098

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 26
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