Journal of Materials Science: Materials in Electronics

Journal of Materials Science: Materials in Electronics

ISSNs: 0957-4522

Additional searchable ISSN (electronic): 1573-482X

Springer, United States

Scopus rating (2022): CiteScore 4.6 SJR 0.496 SNIP 0.681

Journal

Journal Metrics

Research Output

  1. 2010
  2. Published

    Effect of Y 2O 3 particles on microstructure formation and shear properties of Sn-58Bi solder

    Liu, X., Huang, M., Wu, C. M. L. & Wang, L., Oct 2010, In: Journal of Materials Science: Materials in Electronics. 21, 10, p. 1046-1054

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 59
    Check@CityULib
  3. Published

    Thermomigration and electromigration in Sn58Bi ball grid array solder joints

    Gu, X., Yung, K. C. & Chan, Y. C., Oct 2010, In: Journal of Materials Science: Materials in Electronics. 21, 10, p. 1090-1098

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 26
    Check@CityULib
  4. 2009
  5. Published

    The challenges in the fabrication of reliable polymer photonic devices

    Uddin, M. A. & Chan, H. P., Jan 2009, In: Journal of Materials Science: Materials in Electronics. 20, SUPPL. 1

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 10
    Check@CityULib
  6. Published

    Fabrication and application of long silicon nanowire yarns

    Shao, M., Fu, Y., Cheng, L., Wang, X., Ma, D. & Lee, S., 2009, In: Journal of Materials Science: Materials in Electronics. 20, 12, p. 1200-1202

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 1
    Check@CityULib
  7. Published

    Structures and electrical properties of (Na 0.5K 0.5) NbO 3-Li(Ta 0.5Nb 0.5) O 3 lead-free piezoelectric ceramics

    Zuo, R., Su, S., Fu, J. & Xu, Z., 2009, In: Journal of Materials Science: Materials in Electronics. 20, 5, p. 469-472

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 13
    Check@CityULib
  8. 2007
  9. Published

    Direct robust bonding between Sn-based solder and Si substrate

    Yu, D. Q., Wu, C. M. L., Wong, Y. W. & Lai, J. K. L., Oct 2007, In: Journal of Materials Science: Materials in Electronics. 18, 10, p. 1057-1063

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 8
    Check@CityULib
  10. Published

    Interfacial adhesion of polymeric adhesive film on different surfaces in the fabrication of polymer photonic devices

    Uddin, M. A., Ho, W. F. & Chan, H. P., Jun 2007, In: Journal of Materials Science: Materials in Electronics. 18, 6, p. 655-663

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 10
    Check@CityULib
  11. Published

    Rare-earth additions to lead-free electronic solders

    Wu, C. M. L. & Wong, Y. W., Mar 2007, In: Journal of Materials Science: Materials in Electronics. 18, 1-3, p. 77-91

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 75
    Check@CityULib
  12. Stress analysis of spontaneous Sn whisker growth

    Tu, K. N., Chen, C. & Wu, A. T., Mar 2007, In: Journal of Materials Science: Materials in Electronics. 18, 1-3, p. 269-281

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 71
    Check@CityULib
  13. 2006
  14. Ni implantation-induced enhancement of the crystallisation of amorphous Si

    Ok, Y., Seong, T., Choi, C. & Tu, K. N., Dec 2006, In: Journal of Materials Science: Materials in Electronics. 17, 12, p. 979-985

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 2
    Check@CityULib
  15. Published

    Degradation of Sn37Pb and Sn3.5Ag0.5Cu solder joints between Au/Ni (P)/Cu pads stressed with moderate current density

    Wu, B. Y., Zhong, H. W., Chan, Y. C. & Alam, M. O., Nov 2006, In: Journal of Materials Science: Materials in Electronics. 17, 11, p. 943-950

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 13
    Check@CityULib
  16. Published

    Effect of solder filler thickness on the mechanical stability of fiber-solder-ferrule joint under temperature cyclic loading

    Tan, C. W., Chan, Y. C. & Yeung, N. H., Apr 2006, In: Journal of Materials Science: Materials in Electronics. 17, 4, p. 325-333

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 2
    Check@CityULib
  17. 2005
  18. Published

    Interfacial reactions of Sn-3.5% Ag and Sn-3.5% Ag-0.5% Cu solder with electroless Ni/Au metallization during multiple reflow cycles

    Sharif, A. & Chan, Y. C., Mar 2005, In: Journal of Materials Science: Materials in Electronics. 16, 3, p. 153-158

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 17
    Check@CityULib
  19. 2001
  20. Preparation, characterization and femtosecond time-resolved optical Kerr effect of plasma polybenzonitrile derivative films

    Zhao, X., Hu, X., Yue, C. Y., He, Y. & Chen, H., Oct 2001, In: Journal of Materials Science: Materials in Electronics. 12, 10, p. 557-560

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 7
    Check@CityULib
  21. 2000
  22. Published

    Metallurgical reaction and mechanical strength of electroless Ni-P solder joints for advanced packaging applications

    Hung, K. C., Chan, Y. C. & Tang, C. W., Nov 2000, In: Journal of Materials Science: Materials in Electronics. 11, 8, p. 587-593

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 25
    Check@CityULib
  23. Published

    Lead free solder alloys Sn-Zn and Sn-Sb prepared by mechanical alloying

    Huang, M. L., Wu, C. M. L., Lai, J. K. L., Wang, L. & Wang, F. G., 2000, In: Journal of Materials Science: Materials in Electronics. 11, 1, p. 57-65

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 47
    Check@CityULib
  24. 1999
  25. High dielectric AlN/Al2O3 composite powder using a plasma spray approach for microelectronics application

    BOEY, F. Y. C., SUN, L., SONG, X. & KHOR, K. A., Jul 1999, In: Journal of Materials Science: Materials in Electronics. 10, 5-6, p. 455-459

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 7
    Check@CityULib
  26. 1996
  27. Published

    Effect of dopants on ageing properties for the PMN-0.1 PT relaxor ferroelectric ceramics

    Wang, Y., Gui, Z., Chan, Y. C., Li, L. & Zhang, X., 1996, In: Journal of Materials Science: Materials in Electronics. 7, 2, p. 133-135

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 12
    Check@CityULib
  28. 1994
  29. Published

    Thermal shock resistance of miniaturized multilayer ceramic capacitors

    Yeung, F., Chan, Y. C., Wang, Y., Gui, Z. L. & Li, L. T., Dec 1994, In: Journal of Materials Science: Materials in Electronics. 5, 6, p. 339-343

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 6
    Check@CityULib
  30. Published

    Failure analysis of miniaturized multilayer ceramic capacitors in surface mount printed circuit board assemblies

    Chan, Y. C., Yeung, F. & Mok, T. S., Feb 1994, In: Journal of Materials Science: Materials in Electronics. 5, 1, p. 25-29

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 9
    Check@CityULib
Previous 1 2 3 Next