Journal of Materials Science: Materials in Electronics

Journal of Materials Science: Materials in Electronics

ISSNs: 0957-4522

Additional searchable ISSN (Electronic): 1573-482X

Springer, United States

Scopus rating (2019): CiteScore 3.9 SJR 0.477 SNIP 0.686

Journal

Journal Metrics

Research Output

  1. 2019
  2. Published

    Effect of hydroxyl group in polymeric dielectric layer on the performance of organic thin-film transistors and their application for NO2 gas sensor

    Shao, B., Han, S., Hou, S., Zeng, H., Yu, X. & Yu, J., Dec 2019, In : Journal of Materials Science: Materials in Electronics. 30, 23, p. 20638–20645

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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  3. Published

    Modulation of resistive switching in Pt/LiCoO2/SiO2/Si stacks

    Hu, Q., Huang, A., Zhang, X., Li, R., Gao, Q., Wang, M., Wang, M. & 3 others, Shi, H., Xiao, Z. & Chu, P. K., Mar 2019, In : Journal of Materials Science: Materials in Electronics. 30, 5, p. 4753-4759

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 1
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  4. Published

    Self-supported electrodes composed of silicon nanocrystals in 3D hierarchical carbon network for reversible sodium storage

    Wu, J., Xu, G., Liu, X., Li, Z., Yang, L. & Chu, P. K., Feb 2019, In : Journal of Materials Science: Materials in Electronics. 30, 3, p. 2732-2742

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 1
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  5. Published

    Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding

    Yang, H., Cao, K., Zhao, X., Liu, W., Lu, J. & Lu, Y., Jan 2019, In : Journal of Materials Science: Materials in Electronics. 30, 1, p. 862-866

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 5
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  6. 2018
  7. Published

    Industrialization of a FeSiBNbCu nanocrystalline alloy with high s of 1.39 T and outstanding soft magnetic properties

    Xiao, H., Wang, A., Zhao, C., He, A., Zhang, G., Li, H., Li, R. & 1 others, Liu, X., Nov 2018, In : Journal of Materials Science: Materials in Electronics. 29, 22, p. 19517-19523

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 3
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  8. Published

    Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs

    Sun, H., Chan, Y. C. & Wu, F., May 2018, In : Journal of Materials Science: Materials in Electronics. 29, 10, p. 8584-8593

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 4
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  9. Published

    Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization

    Pun, K. P. L., Ali, L., Kohtoku, M., Cheung, C., Chan, A. H. S. & Wong, C. P., Apr 2018, In : Journal of Materials Science: Materials in Electronics. 29, 8, p. 6937–6949

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 4
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  10. Published

    Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

    Chen, G., Liu, L., Silberschmidt, V. V., Liu, C., Wu, F. & Chan, Y. C., Apr 2018, In : Journal of Materials Science: Materials in Electronics. 29, 7, p. 5253-5263

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 11
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  11. Published

    Tuning of Bi3+-related photoemission in the Sc2O3: Bi3+ phosphor

    Li, W., Yang, M., Sun, G. & Kang, F., Apr 2018, In : Journal of Materials Science: Materials in Electronics. 29, 8, p. 7015-7019

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 2
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  12. 2017
  13. Published

    Enhanced electrochemical reduction of hydrogen peroxide by Co3O4 nanowire electrode

    Jeong, W., Yin, C., Hui, K. S., Hui, K. N., Cho, Y. R. & Cho, K. M., Nov 2017, In : Journal of Materials Science: Materials in Electronics. 28, 22, p. 16672-16678

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 1
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  14. Published

    Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging

    Pun, K. P. L., Islam, M. N., Cheung, C. W. & Chan, A. H. S., Sep 2017, In : Journal of Materials Science: Materials in Electronics. 28, 17, p. 12617-12629

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 7
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  15. Published

    An experimental study of magnetorheological fluids on electrical conductivity property

    Yang, X., Huang, Y., Hou, Y., Xu, R. & Chu, P. K., 1 Jun 2017, In : Journal of Materials Science: Materials in Electronics. 28, 11, p. 8130-8135

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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  16. Published

    Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)

    Zhu, Z., LI, Y., Chan, Y. C. & Wu, F., Jun 2017, In : Journal of Materials Science: Materials in Electronics. 28, 12, p. 8717-8724

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 4
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  17. Published

    The microwave dielectric properties of transparent ZnAl2O4 ceramics fabricated by spark plasma sintering

    FU, P., Wang, Z., Lin, Z. D., Liu, Y. Q. & VELLAISAMY, A. L. R., Mar 2017, In : Journal of Materials Science: Materials in Electronics. 28, 13, p. 9589-9595

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 11
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  18. 2016
  19. Published

    An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints

    Peng, H., Chen, G., Mo, L., Chan, Y. C., Wu, F. & Liu, H., 1 Sep 2016, In : Journal of Materials Science: Materials in Electronics. 27, 9, p. 9083-9093

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 4
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  20. Published

    Tensile creep behavior of Sn–Ag–Cu–Ni multicomponent lead-free solder alloy

    Zhao, N., Huang, M. L. & Wu, C. M. L., Jul 2016, In : Journal of Materials Science: Materials in Electronics. 27, 7, p. 6630-6636

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 2
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  21. Published

    Comparative study of the microstructure and mechanical strength of tin-copper (Sn0.7Cu) solder modified with silver (Ag) by both alloying and doping methods

    Zhu, Z., Sun, H., Wu, F. & Chan, Y., 9 Mar 2016, In : Journal of Materials Science: Materials in Electronics. 27, 7, p. 6835-6844

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 10
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  22. 2015
  23. Performance improvement of organic field-effect transistor based nitrogen dioxide gas sensor using biocompatible PMMA/silk fibroin bilayer dielectric

    Li, X., Shi, W., Yu, X. & Yu, J., 22 Oct 2015, In : Journal of Materials Science: Materials in Electronics. 26, 10, p. 7948-7954

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 9
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  24. Published

    Microstructure, elastic modulus and shear strength of alumina (Al2O3) nanoparticles-doped tin–silver–copper (Sn–Ag–Cu) solders on copper (Cu) and gold/nickel (Au/Ni)-plated Cu substrates

    Gain, A. K., Zhang, L. & Chan, Y. C., Sep 2015, In : Journal of Materials Science: Materials in Electronics. 26, 9, p. 7039-7048

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 30
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  25. Effect of thermal annealing on the performance of ternary organic photovoltaics based on PTB7: PC71BM : F8BT

    Shang, M., Yu, X., Ye, X., Zhang, L., Jiang, Q. & Lin, H., Aug 2015, In : Journal of Materials Science: Materials in Electronics. 26, 8, p. 5708-5714

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 4
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