Journal of Materials Science: Materials in Electronics

Journal of Materials Science: Materials in Electronics

ISSNs: 0957-4522

Additional searchable ISSN (electronic): 1573-482X

Springer, United States

Scopus rating (2023): CiteScore 5 SJR 0.512 SNIP 0.696

Journal

Journal Metrics
1 - 20 out of 61Page size: 20

Research Output

  1. 2024
  2. Published

    Low-temperature attaching of LED chips using SnBiIn solder nanoparticles

    Mao, X., An, Y., Yao, Y., Qiao, J., Xie, L., Tu, K.-N. & Liu, Y., Oct 2024, In: Journal of Materials Science: Materials in Electronics. 35, 28, 1881.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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  3. 2023
  4. Published

    Exploring the potential of a ZnS/CNFs cloudy-like architecture for high-performance asymmetric supercapacitors

    Arif, M., Shah, M. Z. U., Ahmad, S. A., Shah, M. S., Hussain, I., Song, P. & Sajjad, M. & 3 others, Huang, T., Yi, J. & Shah, A., Jun 2023, In: Journal of Materials Science: Materials in Electronics. 34, 17, 1340.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 11
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  5. Published

    High performance asymmetric supercapacitor based on hydrothermally synthesized ZnO nanosheets embedded on Ni foam

    Ali, A., Hameed, I., Hussain, I., Mujahid, R., Ahmad, R. T. M., Yahya, Z. & Waqas, M. & 1 others, Ammar, M., Mar 2023, In: Journal of Materials Science: Materials in Electronics. 34, 8, 744.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 16
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  6. 2021
  7. Published

    Preparation and excellent dielectric properties of flexible Ba0.7Sr0.29La0.01TiO3 composite fiber ceramics

    Wang, Y., Dong, Q., Shi, S., Zhang, X., Zhu, Z., Guo, Z. & Chow, Y. T. & 4 others, Wang, X., Zhang, G., Zhu, L. & Xu, D., Nov 2021, In: Journal of Materials Science: Materials in Electronics. 32, 22, p. 26359-26370

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 2
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  8. 2020

  9. Effect of nano-Ag3Sn additions on wettability, interfacial intermetallic growth and mechanical properties of Zn–30Sn–1Ge solders on Cu substrates

    Wei, Y., Liu, Y., Tan, C., Zhang, J. & Zhao, X., Apr 2020, In: Journal of Materials Science: Materials in Electronics. 31, 8, p. 5796-5806

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 4
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  10. 2019
  11. Published

    Effect of hydroxyl group in polymeric dielectric layer on the performance of organic thin-film transistors and their application for NO2 gas sensor

    Shao, B., Han, S., Hou, S., Zeng, H., Yu, X. & Yu, J., Dec 2019, In: Journal of Materials Science: Materials in Electronics. 30, 23, p. 20638–20645

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 3
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  12. Published

    Modulation of resistive switching in Pt/LiCoO2/SiO2/Si stacks

    Hu, Q., Huang, A., Zhang, X., Li, R., Gao, Q., Wang, M. & Wang, M. & 3 others, Shi, H., Xiao, Z. & Chu, P. K., Mar 2019, In: Journal of Materials Science: Materials in Electronics. 30, 5, p. 4753-4759

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 3
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  13. Published

    Self-supported electrodes composed of silicon nanocrystals in 3D hierarchical carbon network for reversible sodium storage

    Wu, J., Xu, G., Liu, X., Li, Z., Yang, L. & Chu, P. K., Feb 2019, In: Journal of Materials Science: Materials in Electronics. 30, 3, p. 2732-2742

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 5
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  14. Published

    Brittle-to-ductile transition of Au2Al and AuAl2 intermetallic compounds in wire bonding

    Yang, H., Cao, K., Zhao, X., Liu, W., Lu, J. & Lu, Y., 15 Jan 2019, In: Journal of Materials Science: Materials in Electronics. 30, 1, p. 862-866

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 12
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  15. 2018
  16. Published

    Industrialization of a FeSiBNbCu nanocrystalline alloy with high B s of 1.39 T and outstanding soft magnetic properties

    Xiao, H., Wang, A., Zhao, C., He, A., Zhang, G., Li, H. & Li, R.-W. & 1 others, Liu, X., Nov 2018, In: Journal of Materials Science: Materials in Electronics. 29, 22, p. 19517-19523

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 17
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  17. Published

    Reliability performance of tin–bismuth–silver (Sn57.6Bi0.4Ag) solder joints with different content of carbon nano-tubes (CNTs) or nickel (Ni)-modified CNTs

    Sun, H., Chan, Y. C. & Wu, F., May 2018, In: Journal of Materials Science: Materials in Electronics. 29, 10, p. 8584-8593

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 12
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  18. Published

    Latest advancement of fully additive process for 8 µm ultra-fine pitch chip-on-film (COF) by nano-size Ni–P metallization

    Pun, K. P. L., Ali, L., Kohtoku, M., Cheung, C.-W., Chan, A. H. S. & Wong, C. P., Apr 2018, In: Journal of Materials Science: Materials in Electronics. 29, 8, p. 6937–6949

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 4
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  19. Published

    Microstructural evolution of 96.5Sn–3Ag–0.5Cu lead free solder reinforced with nickel-coated graphene reinforcements under large temperature gradient

    Chen, G., Liu, L., Silberschmidt, V. V., Liu, C., Wu, F. & Chan, Y. C., Apr 2018, In: Journal of Materials Science: Materials in Electronics. 29, 7, p. 5253-5263

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 19
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  20. Published

    Tuning of Bi3+-related photoemission in the Sc2O3: Bi3+ phosphor

    Li, W., Yang, M., Sun, G. & Kang, F., Apr 2018, In: Journal of Materials Science: Materials in Electronics. 29, 8, p. 7015-7019

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 3
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  21. 2017
  22. Published

    Enhanced electrochemical reduction of hydrogen peroxide by Co3O4 nanowire electrode

    Jeong, W., Yin, C.-L., Hui, K. S., Hui, K. N., Cho, Y. R. & Cho, K. M., Nov 2017, In: Journal of Materials Science: Materials in Electronics. 28, 22, p. 16672-16678

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 2
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  23. Published

    Solid-state growth kinetics of intermetallic compounds in Cu pillar solder flip chip with ENEPIG surface finish under isothermal aging

    Pun, K. P. L., Islam, M. N., Cheung, C. W. & Chan, A. H. S., Sept 2017, In: Journal of Materials Science: Materials in Electronics. 28, 17, p. 12617-12629

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 10
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  24. Published

    An experimental study of magnetorheological fluids on electrical conductivity property

    Yang, X., Huang, Y., Hou, Y., Xu, R. & Chu, P. K., 1 Jun 2017, In: Journal of Materials Science: Materials in Electronics. 28, 11, p. 8130-8135

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 6
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  25. Published

    Polarized evolution of interfacial intermetallic compounds (IMCs) in interconnects under electromigration (EM)

    Zhu, Z., LI, Y., Chan, Y. C. & Wu, F., Jun 2017, In: Journal of Materials Science: Materials in Electronics. 28, 12, p. 8717-8724

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 5
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  26. Published

    The microwave dielectric properties of transparent ZnAl2O4 ceramics fabricated by spark plasma sintering

    FU, P., Wang, Z., Lin, Z. D., Liu, Y. Q. & VELLAISAMY, A. L. R., Mar 2017, In: Journal of Materials Science: Materials in Electronics. 28, 13, p. 9589-9595

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 34
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  27. 2016
  28. Published

    An investigation on the ZnO retained ratio, microstructural evolution, and mechanical properties of ZnO doped Sn3.0Ag0.5Cu composite solder joints

    Peng, H., Chen, G., Mo, L., Chan, Y. C., Wu, F. & Liu, H., 1 Sept 2016, In: Journal of Materials Science: Materials in Electronics. 27, 9, p. 9083-9093

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 19
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