Journal of Electronic Materials

Journal of Electronic Materials

ISSNs: 0361-5235

Additional searchable ISSN (Electronic): 1543-186X

Springer, United States

Scopus rating (2022): CiteScore 3.9 SJR 0.383 SNIP 0.626

Journal

Journal Metrics

Research Output

  1. 2020
  2. Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure

    Wang, I., Ku, C., Lam, T., Huang, E., Tu, K. N. & Chen, C., Jan 2020, In: Journal of Electronic Materials. 49, 1, p. 109-115

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 2
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  3. 2018
  4. Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3

    Tseng, Y., Lee, H., Hau, N. Y., Feng, S. & Chen, C., 1 Jan 2018, In: Journal of Electronic Materials. 47, 1, p. 27-34

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 8
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  5. 2016
  6. Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing

    Lai, K., Wu, P., Chen, C., Wei, T., Wu, C. & Feng, S., 1 Oct 2016, In: Journal of Electronic Materials. 45, 10, p. 4813-4822

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 8
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  7. 2013
  8. Microstructure of GaN1-xBix

    Liliental-Weber, Z., Dos Reis, R., Levander, A. X., Yu, K. M., Walukiewicz, W., Novikov, S. V. & Foxon, C. T., Jan 2013, In: Journal of Electronic Materials. 42, 1, p. 26-32

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 4
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  9. 2012
  10. Synthesis of Ge 1-xSn x alloy thin films using ion implantation and pulsed laser melting (II-PLM)

    Bhatia, A., Hlaing Oo, W. M., Siegel, G., Stone, P. R., Yu, K. M. & Scarpulla, M. A., May 2012, In: Journal of Electronic Materials. 41, 5, p. 837-844

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 10
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  11. 2009
  12. Nonuniform and negative marker displacements induced by current crowding during electromigration in flip-chip Sn-0.7Cu solder joints

    Liang, S. W., Hsiao, H., Chen, C., Xu, L., Tu, K. N. & Lai, Y., Dec 2009, In: Journal of Electronic Materials. 38, 12, p. 2443-2448

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 5
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  13. 2008
  14. Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration

    Liang, S. W., Chang, Y. W., Chen, C., Preciado, J. & Tu, K. N., Jul 2008, In: Journal of Electronic Materials. 37, 7, p. 962-967

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 4
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  15. 2007
  16. Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads

    Lin, W. H., Wu, A. T., Lin, S. Z., Chuang, T. H. & Tu, K. N., Jul 2007, In: Journal of Electronic Materials. 36, 7, p. 753-759

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 21
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  17. 2006
  18. Electromigration effect on intermetallic growth and Young's modulus in SAC solder joint

    XU, L., PANG, J. H. L., REN, F. & TU, K. N., Dec 2006, In: Journal of Electronic Materials. 35, 12, p. 2116-2125

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 27
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  19. 2004
  20. The application of lead-free solder to optical fiber packaging

    Ou, S., Xu, G., Xu, Y. & Tu, K. N., Dec 2004, In: Journal of Electronic Materials. 33, 12, p. 1440-1444

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1
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  21. 2003
  22. Formation of nickel disilicide using nickel implantation and rapid thermal annealing

    Choi, C., Chang, S., Ok, Y., Seong, T., Gan, H., Pan, G. Z. & Tu, K. N., Oct 2003, In: Journal of Electronic Materials. 32, 10, p. 1072-1078

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 6
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  23. Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activation

    Fong, H. P., Wu, Y., Wang, Y. Y. & Wan, C. C., Jan 2003, In: Journal of Electronic Materials. 32, 1, p. 9-17

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 12
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  24. 2002
  25. Band anticrossing in highly mismatched group II-VI semiconductor alloys

    Yu, K. M., Wu, J., Walukiewicz, W., Beeman, J. W., Ager, J. W., Haller, E. E., Miotkowski, I., & 1 othersRamdas, A., Jul 2002, In: Journal of Electronic Materials. 31, 7, p. 754-758

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 7
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  26. 2001
  27. Mechanisms of dislocation reduction in GaN using an intermediate temperature interlayer

    Bourret-Courchesne, E. D., Yu, K. M., Benamara, M., Liliental-Weber, Z. & Washburn, J., Nov 2001, In: Journal of Electronic Materials. 30, 11, p. 1417-1420

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 14
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  28. Morphological stability of solder reaction products in flip chip technology

    Tu, K. N., Ku, F. & Lee, T. Y., Sept 2001, In: Journal of Electronic Materials. 30, 9, p. 1129-1132

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 50
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  29. Synthesis and characterization of porous polymeric low dielectric constant films

    Xu, Y., Zheng, D. W., Tsai, Y., Tu, K. N., Zhao, B., Liu, Q. Z., Brongo, M., & 4 othersOng, C. W., Choy, C. L., Sheng, G. T. T. & Tung, C. H., Apr 2001, In: Journal of Electronic Materials. 30, 4, p. 309-313

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 23
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  30. Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

    Liu, C. Y., Li, J., Vandentop, G. J., Choi, W. J. & Tu, K. N., 2001, In: Journal of Electronic Materials. 30, 5, p. 521-525 92.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 22
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  31. 2000
  32. Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying

    Wu, C. M. L., Huang, M. L., Lai, J. K. L. & Chan, Y. C., Aug 2000, In: Journal of Electronic Materials. 29, 8, p. 1015-1020

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 42
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  33. Low-dislocation relaxed SiGe grown on an effective compliant substrate

    LUO, Y. H., LIU, J. L., JIN, G., WANG, K. L., MOORE, C. D., GOORSKY, M. S., CHIH, C., & 1 othersTU, K. N., Jul 2000, In: Journal of Electronic Materials. 29, 7, p. 950-955

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 9
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  34. 1999
  35. Effects of short-range order and natural microinhomogeneities on the FIR optical properties of CdxHg1-xTe

    Vasilevskiy, M. I., Belogorokhov, A. I. & Gomes, M. J. M., Jun 1999, In: Journal of Electronic Materials. 28, 6, p. 654-661

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 3
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