Journal of Electronic Materials

Journal of Electronic Materials

ISSNs: 0361-5235

Additional searchable ISSN (Electronic): 1543-186X

Springer, United States

Scopus rating (2022): CiteScore 3.9 SJR 0.383 SNIP 0.626

Journal

Journal Metrics

Research Output

  1. 2018
  2. Published

    Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction

    ZHOU, Z., MO, L., LIU, H., CHAN, Y. C. & WU, F., Dec 2018, In: Journal of Electronic Materials. 47, 12, p. 7435-7448

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1
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  3. Published

    Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

    PUN, K. P. L., ISLAM, M. N., ROTANSON, J., CHEUNG, C. & CHAN, A. H. S., Sept 2018, In: Journal of Electronic Materials. 47, 9, p. 5191–5202

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 13
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  4. 2017
  5. Published

    TiO2/Sb2S3/P3HT Based Inorganic–Organic Hybrid Heterojunction Solar Cells with Enhanced Photoelectric Conversion Performance

    Zhang, H., Song, L., Luo, L., Liu, L., Wang, H. & Wang, F., 1 Jul 2017, In: Journal of Electronic Materials. 46, 7, p. 4670-4675

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 7
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  6. Published

    Chemical Coupling SERS Properties of Pyridine on Silver-Caged Metal Clusters M@Ag-12 (M = V-, Nb-, Ta-, Cr, Mo, W, Mn+, Tc+, Re+)

    Chen, L., Wang, Z., Li, Z. & Zhang, R., Jul 2017, In: Journal of Electronic Materials. 46, 7, p. 3904-3909

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 3
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  7. Published

    Structural Asymmetry-Facilitated Tunability of Spin Distribution in the (10,0) Carbon Nanotube Induced by Charging

    Wang, J., Gao, Y., Zhang, Z., Xu, D., Wang, Z. & Zhang, R., Jul 2017, In: Journal of Electronic Materials. 46, 7, p. 3857-3861

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 2
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  8. 2014
  9. Published

    Modeling and optimization of thermoelements by a combined analytical and numerical method

    XU, S., CHEN, Q., ZHU, Y., WANG, L., ZHENG, L. & CHU, P. K., Feb 2014, In: Journal of Electronic Materials. 43, 2, p. 404-413

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1
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  10. 2013
  11. Published

    Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn-3.0Ag-0.5Cu solder alloy

    Shafiq, I., Lau, H. Y. & Chan, Y. C., Sept 2013, In: Journal of Electronic Materials. 42, 9, p. 2835-2847

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 9
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  12. 2012
  13. Published

    Effects of high-temperature treatment on the reaction between Sn-3%Ag-0.5%Cu solder and sputtered Ni-V film on ferrite substrate

    Shen, X., Jin, H., Dong, S., Wong, H., Zhou, J., Guo, Z. & Wang, D., Nov 2012, In: Journal of Electronic Materials. 41, 11, p. 3145-3151

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1
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  14. Published

    Electrical properties of textured (KNa) 0.44Li 0.06Nb 0.84Sb 0.06Ta 0.1O 3 thick films

    Fu, F., Zhai, J., Xu, Z., Bai, W. & Kong, L., Nov 2012, In: Journal of Electronic Materials. 41, 11, p. 3077-3081

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 2
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  15. Published

    Near-ultraviolet light-emitting devices using vertical ZnO nanorod arrays

    Jha, S., Wang, C. D., Luan, C. Y., Liu, C. P., Bin, H., Kutsay, O., Bello, I., & 3 othersZapien, J. A., Zhang, W. J. & Lee, S. T., May 2012, In: Journal of Electronic Materials. 41, 5, p. 853-856

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 11
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  16. 2011
  17. Published

    Fabrication and Characterization of Silicon Microchannel Plates as Temperature-Sensing Materials

    CI, P., SHI, J., WANG, F., XU, S., YANG, Z., YANG, P., WANG, L., & 1 othersCHU, P. K., Dec 2011, In: Journal of Electronic Materials. 40, 12, p. 2363-2367

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1
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  18. 2009
  19. Published

    An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

    Wang, W., Choubey, A., Azarian, M. H. & Pecht, M., Jun 2009, In: Journal of Electronic Materials. 38, 6, p. 815-827

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 38
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  20. 2008
  21. Published

    Electromigration in line-type Cu/Sn-Bi/Cu solder joints

    Gu, X. & Chan, Y. C., Nov 2008, In: Journal of Electronic Materials. 37, 11, p. 1721-1726

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 55
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  22. Published

    Joule heating enhanced phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu solder joints during current stressing

    Wu, B. Y., Alam, M. O., Chan, Y. C. & Zhong, H. W., Apr 2008, In: Journal of Electronic Materials. 37, 4, p. 469-476

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 15
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  23. Published

    Silicidation of Ni(Yb) film on Si(001)

    Luo, J., Jiang, Y., Ru, G., Li, B. & Chu, P. K., Mar 2008, In: Journal of Electronic Materials. 37, 3, p. 245-248

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 7
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  24. 2006
  25. Published

    Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad

    Sharif, A. & Chan, Y. C., Oct 2006, In: Journal of Electronic Materials. 35, 10, p. 1812-1817

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 13
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  26. Published

    Intergrowth mechanism of silicon nanowires and silver dendrites

    Qiu, T., Wu, X. L., Siu, G. G. & Chu, P. K., Oct 2006, In: Journal of Electronic Materials. 35, 10, p. 1879-1884

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 63
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  27. Published

    Stable optical emission from annealed poly (p-phenylene vinylene) derivative films containing oxadiazole

    Kong, F., Wu, X. L., Yuan, R. K., Zhang, S. Y., Yang, C. Z., Chu, P. K. & Siu, G. G., Sept 2006, In: Journal of Electronic Materials. 35, 9, p. 1689-1692

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

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  28. Published

    Interfacial adhesion of spin-coated thin adhesive film on silicon substrate for the fabrication of polymer optical waveguide

    Uddin, M. A., Ho, W. F., Chow, C. K. & Chan, H. P., Jul 2006, In: Journal of Electronic Materials. 35, 7, p. 1558-1565

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 18
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  29. Published

    Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications

    Chiang, W. K., Chan, Y. C., Ralph, B. & Holland, A., Mar 2006, In: Journal of Electronic Materials. 35, 3, p. 443-452

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 14
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