Journal of Electronic Materials

Journal of Electronic Materials

ISSNs: 0361-5235

Additional searchable ISSN (electronic): 1543-186X

Springer, United States

Scopus rating (2023): CiteScore 4.1 SJR 0.439 SNIP 0.668

Journal

Journal Metrics
1 - 20 out of 77Page size: 20

Research Output

  1. 2020

  2. Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure

    Wang, I., Ku, C., Lam, T., Huang, E., Tu, K. N. & Chen, C., Jan 2020, In: Journal of Electronic Materials. 49, 1, p. 109-115

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 6
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  3. 2018
  4. Published

    Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction

    ZHOU, Z., MO, L., LIU, H., CHAN, Y. C. & WU, F., Dec 2018, In: Journal of Electronic Materials. 47, 12, p. 7435-7448

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 2
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  5. Published

    Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

    PUN, K. P. L., ISLAM, M. N., ROTANSON, J., CHEUNG, C. & CHAN, A. H. S., Sept 2018, In: Journal of Electronic Materials. 47, 9, p. 5191–5202

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 14
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  6. Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3

    Tseng, Y., Lee, H., Hau, N. Y., Feng, S. & Chen, C., 1 Jan 2018, In: Journal of Electronic Materials. 47, 1, p. 27-34

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 9
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  7. 2017
  8. Published

    TiO2/Sb2S3/P3HT Based Inorganic–Organic Hybrid Heterojunction Solar Cells with Enhanced Photoelectric Conversion Performance

    Zhang, H., Song, L., Luo, L., Liu, L., Wang, H. & Wang, F., 1 Jul 2017, In: Journal of Electronic Materials. 46, 7, p. 4670-4675

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 8
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  9. Published

    Chemical Coupling SERS Properties of Pyridine on Silver-Caged Metal Clusters M@Ag-12 (M = V-, Nb-, Ta-, Cr, Mo, W, Mn+, Tc+, Re+)

    Chen, L., Wang, Z., Li, Z. & Zhang, R., Jul 2017, In: Journal of Electronic Materials. 46, 7, p. 3904-3909

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 4
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  10. Published

    Structural Asymmetry-Facilitated Tunability of Spin Distribution in the (10,0) Carbon Nanotube Induced by Charging

    Wang, J., Gao, Y., Zhang, Z., Xu, D., Wang, Z. & Zhang, R., Jul 2017, In: Journal of Electronic Materials. 46, 7, p. 3857-3861

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 2
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  11. 2016

  12. Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing

    Lai, K., Wu, P., Chen, C., Wei, T., Wu, C. & Feng, S., 1 Oct 2016, In: Journal of Electronic Materials. 45, 10, p. 4813-4822

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 9
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  13. 2014
  14. Published

    Modeling and optimization of thermoelements by a combined analytical and numerical method

    XU, S., CHEN, Q., ZHU, Y., WANG, L., ZHENG, L. & CHU, P. K., Feb 2014, In: Journal of Electronic Materials. 43, 2, p. 404-413

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 1
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  15. 2013
  16. Published

    Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn-3.0Ag-0.5Cu solder alloy

    Shafiq, I., Lau, H. Y. & Chan, Y. C., Sept 2013, In: Journal of Electronic Materials. 42, 9, p. 2835-2847

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 9
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  17. Microstructure of GaN1-xBix

    Liliental-Weber, Z., Dos Reis, R., Levander, A. X., Yu, K. M., Walukiewicz, W., Novikov, S. V. & Foxon, C. T., Jan 2013, In: Journal of Electronic Materials. 42, 1, p. 26-32

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 5
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  18. 2012
  19. Published

    Effects of high-temperature treatment on the reaction between Sn-3%Ag-0.5%Cu solder and sputtered Ni-V film on ferrite substrate

    Shen, X., Jin, H., Dong, S., Wong, H., Zhou, J., Guo, Z. & Wang, D., Nov 2012, In: Journal of Electronic Materials. 41, 11, p. 3145-3151

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 1
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  20. Published

    Electrical properties of textured (KNa) 0.44Li 0.06Nb 0.84Sb 0.06Ta 0.1O 3 thick films

    Fu, F., Zhai, J., Xu, Z., Bai, W. & Kong, L., Nov 2012, In: Journal of Electronic Materials. 41, 11, p. 3077-3081

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 2
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  21. Published

    Near-ultraviolet light-emitting devices using vertical ZnO nanorod arrays

    Jha, S., Wang, C. D., Luan, C. Y., Liu, C. P., Bin, H., Kutsay, O., Bello, I., & 3 othersZapien, J. A., Zhang, W. J. & Lee, S. T., May 2012, In: Journal of Electronic Materials. 41, 5, p. 853-856

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 11
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  22. Synthesis of Ge 1-xSn x alloy thin films using ion implantation and pulsed laser melting (II-PLM)

    Bhatia, A., Hlaing Oo, W. M., Siegel, G., Stone, P. R., Yu, K. M. & Scarpulla, M. A., May 2012, In: Journal of Electronic Materials. 41, 5, p. 837-844

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 12
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  23. 2011
  24. Published

    Fabrication and Characterization of Silicon Microchannel Plates as Temperature-Sensing Materials

    CI, P., SHI, J., WANG, F., XU, S., YANG, Z., YANG, P., WANG, L., & 1 othersCHU, P. K., Dec 2011, In: Journal of Electronic Materials. 40, 12, p. 2363-2367

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 1
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  25. 2009

  26. Nonuniform and negative marker displacements induced by current crowding during electromigration in flip-chip Sn-0.7Cu solder joints

    Liang, S. W., Hsiao, H., Chen, C., Xu, L., Tu, K. N. & Lai, Y., Dec 2009, In: Journal of Electronic Materials. 38, 12, p. 2443-2448

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 5
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  27. Published

    An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

    Wang, W., Choubey, A., Azarian, M. H. & Pecht, M., Jun 2009, In: Journal of Electronic Materials. 38, 6, p. 815-827

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 38
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  28. 2008
  29. Published

    Electromigration in line-type Cu/Sn-Bi/Cu solder joints

    Gu, X. & Chan, Y. C., Nov 2008, In: Journal of Electronic Materials. 37, 11, p. 1721-1726

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 58
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  30. Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration

    Liang, S. W., Chang, Y. W., Chen, C., Preciado, J. & Tu, K. N., Jul 2008, In: Journal of Electronic Materials. 37, 7, p. 962-967

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 4
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