Journal of Electronic Materials

Journal of Electronic Materials

ISSNs: 0361-5235

Additional searchable ISSN (electronic): 1543-186X

Springer, United States

Scopus rating (2023): CiteScore 4.1 SJR 0.439 SNIP 0.668

Journal

Journal Metrics
41 - 60 out of 77Page size: 20

Research Output

  1. 2004
  2. Published

    Oxygen Segregation and Ge Diffusion in Annealed Oxygen Ion-Implanted Relaxed SiGe/Si Heterostructures

    An, Z., Zhang, M., Fu, R. K. Y., Chu, P. K. & Lin, C., Mar 2004, In: Journal of Electronic Materials. 33, 3, p. 207-212

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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  3. Published

    A Continuous Contact Resistance Monitoring during the Temperature Ramp of Anisotropic Conductive Adhesive Film Joint

    Uddin, M. A., Chan, Y. C., Chan, H. P. & Alam, M. O., Jan 2004, In: Journal of Electronic Materials. 33, 1, p. 14-21

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 13
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  4. 2003

  5. Formation of nickel disilicide using nickel implantation and rapid thermal annealing

    Choi, C., Chang, S., Ok, Y., Seong, T., Gan, H., Pan, G. Z. & Tu, K. N., Oct 2003, In: Journal of Electronic Materials. 32, 10, p. 1072-1078

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 6
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  6. Published

    Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film

    Uddin, M. A., Alam, M. O., Chan, Y. C. & Chan, H. P., Oct 2003, In: Journal of Electronic Materials. 32, 10, p. 1117-1124

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 20
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  7. Published

    Research on the contact resistance, reliability, and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications

    Zhang, J. H. & Chan, Y. C., Apr 2003, In: Journal of Electronic Materials. 32, 4, p. 228-234

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 32
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  8. Published

    Curing kinetics of anisotropic conductive adhesive film

    Chan, Y. C., Uddin, M. A., Alam, M. O. & Chan, H. P., Mar 2003, In: Journal of Electronic Materials. 32, 3, p. 131-136

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 30
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  9. Published

    Current-carrying capacity of anisotropic-conductive film joints for the flip chip on flex applications

    Fan, S. H. & Chan, Y. C., Feb 2003, In: Journal of Electronic Materials. 32, 2, p. 101-108

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 14
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  10. Published

    The wettability and microstructure of Sn-Zn-RE alloys

    Wu, C. M. L., Law, C. M. T., Yu, D. Q. & Wang, L., Feb 2003, In: Journal of Electronic Materials. 32, 2, p. 63-69

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 122
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  11. Electroless Cu deposition process on TiN for ULSI interconnect fabrication via Pd/Sn colloid activation

    Fong, H. P., Wu, Y., Wang, Y. Y. & Wan, C. C., Jan 2003, In: Journal of Electronic Materials. 32, 1, p. 9-17

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 12
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  12. 2002
  13. Published

    Interfacial reaction of Pb-Sn solder and Sn-Ag solder with electroless Ni deposit during reflow

    Alam, M. O., Chan, Y. C. & Hung, K. C., Oct 2002, In: Journal of Electronic Materials. 31, 10 SPEC., p. 1117-1121

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 45
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  14. Published

    Microstructure and mechanical properties of new lead-free Sn-Cu-Re solder alloys

    Wu, C. M. L., Yu, D. Q., Law, C. M. T. & Wang, L., Sept 2002, In: Journal of Electronic Materials. 31, 9, p. 928-932

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 95
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  15. Published

    The properties of Sn-9Zn lead-free solder alloys doped with trace rare earth elements

    Wu, C. M. L., Yu, D. Q., Law, C. M. T. & Wang, L., Sept 2002, In: Journal of Electronic Materials. 31, 9, p. 921-927

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 132
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  16. Band anticrossing in highly mismatched group II-VI semiconductor alloys

    Yu, K. M., Wu, J., Walukiewicz, W., Beeman, J. W., Ager, J. W., Haller, E. E., Miotkowski, I., & 1 othersRamdas, A., Jul 2002, In: Journal of Electronic Materials. 31, 7, p. 754-758

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 7
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  17. Published

    Erratum: Creep Behavior of Eutectic Sn-Cu Lead-Free Solder Alloy (Journal of Electronic Materials (2002) 31 (5) (442-448))

    WU, C. M. L. & HUANG, M. L., Jul 2002, In: Journal of Electronic Materials. 31, 7, p. 828

    Research output: Journal Publications and Reviews › Erratum

    Scopus citations: 4
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  18. Published

    Creep behavior of eutectic Sn-Cu lead-free solder alloy

    Wu, C. M. L. & Huang, M. L., May 2002, In: Journal of Electronic Materials. 31, 5, p. 442-448

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 71
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  19. 2001

  20. Mechanisms of dislocation reduction in GaN using an intermediate temperature interlayer

    Bourret-Courchesne, E. D., Yu, K. M., Benamara, M., Liliental-Weber, Z. & Washburn, J., Nov 2001, In: Journal of Electronic Materials. 30, 11, p. 1417-1420

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 15
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  21. Morphological stability of solder reaction products in flip chip technology

    Tu, K. N., Ku, F. & Lee, T. Y., Sept 2001, In: Journal of Electronic Materials. 30, 9, p. 1129-1132

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 50
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  22. Synthesis and characterization of porous polymeric low dielectric constant films

    Xu, Y., Zheng, D. W., Tsai, Y., Tu, K. N., Zhao, B., Liu, Q. Z., Brongo, M., & 4 othersOng, C. W., Choy, C. L., Sheng, G. T. T. & Tung, C. H., Apr 2001, In: Journal of Electronic Materials. 30, 4, p. 309-313

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 23
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  23. Wetting reaction of Sn-Ag based solder systems on Cu substrates plated with Au and/or Pd layer

    Liu, C. Y., Li, J., Vandentop, G. J., Choi, W. J. & Tu, K. N., 2001, In: Journal of Electronic Materials. 30, 5, p. 521-525 92.

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 22
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  24. 2000

  25. Developing a lead-free solder alloy Sn-Bi-Ag-Cu by mechanical alloying

    Wu, C. M. L., Huang, M. L., Lai, J. K. L. & Chan, Y. C., Aug 2000, In: Journal of Electronic Materials. 29, 8, p. 1015-1020

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 43
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