Journal of Electronic Materials

Journal of Electronic Materials

ISSNs: 0361-5235

Additional searchable ISSN (Electronic): 1543-186X

Springer, United States

Scopus rating (2022): CiteScore 3.9 SJR 0.383 SNIP 0.626

Journal

Journal Metrics

Research Output

  1. 2008
  2. Published

    Joule heating enhanced phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu solder joints during current stressing

    Wu, B. Y., Alam, M. O., Chan, Y. C. & Zhong, H. W., Apr 2008, In: Journal of Electronic Materials. 37, 4, p. 469-476

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 15
    Check@CityULib
  3. Published

    Silicidation of Ni(Yb) film on Si(001)

    Luo, J., Jiang, Y., Ru, G., Li, B. & Chu, P. K., Mar 2008, In: Journal of Electronic Materials. 37, 3, p. 245-248

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 7
    Check@CityULib
  4. 2007
  5. Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads

    Lin, W. H., Wu, A. T., Lin, S. Z., Chuang, T. H. & Tu, K. N., Jul 2007, In: Journal of Electronic Materials. 36, 7, p. 753-759

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 21
    Check@CityULib
  6. 2006
  7. Electromigration effect on intermetallic growth and Young's modulus in SAC solder joint

    XU, L., PANG, J. H. L., REN, F. & TU, K. N., Dec 2006, In: Journal of Electronic Materials. 35, 12, p. 2116-2125

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 27
    Check@CityULib
  8. Published

    Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad

    Sharif, A. & Chan, Y. C., Oct 2006, In: Journal of Electronic Materials. 35, 10, p. 1812-1817

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 13
    Check@CityULib
  9. Published

    Intergrowth mechanism of silicon nanowires and silver dendrites

    Qiu, T., Wu, X. L., Siu, G. G. & Chu, P. K., Oct 2006, In: Journal of Electronic Materials. 35, 10, p. 1879-1884

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 63
    Check@CityULib
  10. Published

    Stable optical emission from annealed poly (p-phenylene vinylene) derivative films containing oxadiazole

    Kong, F., Wu, X. L., Yuan, R. K., Zhang, S. Y., Yang, C. Z., Chu, P. K. & Siu, G. G., Sept 2006, In: Journal of Electronic Materials. 35, 9, p. 1689-1692

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Check@CityULib
  11. Published

    Interfacial adhesion of spin-coated thin adhesive film on silicon substrate for the fabrication of polymer optical waveguide

    Uddin, M. A., Ho, W. F., Chow, C. K. & Chan, H. P., Jul 2006, In: Journal of Electronic Materials. 35, 7, p. 1558-1565

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 18
    Check@CityULib
  12. Published

    Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications

    Chiang, W. K., Chan, Y. C., Ralph, B. & Holland, A., Mar 2006, In: Journal of Electronic Materials. 35, 3, p. 443-452

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 14
    Check@CityULib
  13. Published

    Microstructure, solderability and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys

    Law, C. M. T., Wu, C. M. L., Yu, D. Q., Wang, L. & Lai, J. K. L., Jan 2006, In: Journal of Electronic Materials. 35, 1, p. 89-93

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 96
    Check@CityULib
  14. Published

    Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding

    Islam, H. A. & Chan, Y. C., Jan 2006, In: Journal of Electronic Materials. 35, 1, p. 123-131

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 3
    Check@CityULib
  15. 2005
  16. Published

    Creep resistance of tin-based lead-free solder alloys

    Huang, M. L., Wu, C. M. L. & Wang, L., Nov 2005, In: Journal of Electronic Materials. 34, 11, p. 1373-1377

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 18
    Check@CityULib
  17. Published

    Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications

    Tan, S. C., Chan, Y. C. & Lui, N. S. M., Aug 2005, In: Journal of Electronic Materials. 34, 8, p. 1143-1149

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 11
    Check@CityULib
  18. Published

    Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates

    Rizvi, M. J., Chan, Y. C., Bailey, C., Lu, H., Islam, M. N. & Wu, B. Y., Aug 2005, In: Journal of Electronic Materials. 34, 8, p. 1115-1122

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 44
    Check@CityULib
  19. Published

    Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

    Islam, M. N. & Chan, Y. C., May 2005, In: Journal of Electronic Materials. 34, 5, p. 662-669

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 10
    Check@CityULib
  20. Published

    Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

    Islam, M. N., Sharif, A. & Chan, Y. C., Feb 2005, In: Journal of Electronic Materials. 34, 2, p. 143-149

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 99
    Check@CityULib
  21. Published

    Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering

    Sharif, A. & Chan, Y. C., Jan 2005, In: Journal of Electronic Materials. 34, 1, p. 46-52

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 22
    Check@CityULib
  22. 2004
  23. The application of lead-free solder to optical fiber packaging

    Ou, S., Xu, G., Xu, Y. & Tu, K. N., Dec 2004, In: Journal of Electronic Materials. 33, 12, p. 1440-1444

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 1
    Check@CityULib
  24. Published

    Effect of bump characteristics and temperature variation on the online contact resistance of anisotropic conductive joints

    Ali, L., Chan, Y. C. & Alam, M. O., Sept 2004, In: Journal of Electronic Materials. 33, 9, p. 1028-1035

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 5
    Check@CityULib
  25. Published

    Effect of Spin Coating on the Curing Rate of Epoxy Adhesive for the Fabrication of a Polymer Optical Waveguide

    Uddin, M. A., Chan, H. P., Chow, C. K. & Chan, Y. C., Mar 2004, In: Journal of Electronic Materials. 33, 3, p. 224-228

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalpeer-review

    Scopus citations: 29
    Check@CityULib