Journal of Electronic Materials

Journal of Electronic Materials

ISSNs: 0361-5235

Additional searchable ISSN (electronic): 1543-186X

Springer, United States

Scopus rating (2023): CiteScore 4.1 SJR 0.439 SNIP 0.668

Journal

Journal Metrics
21 - 40 out of 77Page size: 20

Research Output

  1. 2008
  2. Published

    Joule heating enhanced phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu solder joints during current stressing

    Wu, B. Y., Alam, M. O., Chan, Y. C. & Zhong, H. W., Apr 2008, In: Journal of Electronic Materials. 37, 4, p. 469-476

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 18
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  3. Published

    Silicidation of Ni(Yb) film on Si(001)

    Luo, J., Jiang, Y., Ru, G., Li, B. & Chu, P. K., Mar 2008, In: Journal of Electronic Materials. 37, 3, p. 245-248

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 7
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  4. 2007

  5. Electromigration in the flip chip solder joint of Sn-8Zn-3Bi on copper pads

    Lin, W. H., Wu, A. T., Lin, S. Z., Chuang, T. H. & Tu, K. N., Jul 2007, In: Journal of Electronic Materials. 36, 7, p. 753-759

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 22
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  6. 2006

  7. Electromigration effect on intermetallic growth and Young's modulus in SAC solder joint

    XU, L., PANG, J. H. L., REN, F. & TU, K. N., Dec 2006, In: Journal of Electronic Materials. 35, 12, p. 2116-2125

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 27
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  8. Published

    Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad

    Sharif, A. & Chan, Y. C., Oct 2006, In: Journal of Electronic Materials. 35, 10, p. 1812-1817

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 14
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  9. Published

    Intergrowth mechanism of silicon nanowires and silver dendrites

    Qiu, T., Wu, X. L., Siu, G. G. & Chu, P. K., Oct 2006, In: Journal of Electronic Materials. 35, 10, p. 1879-1884

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 64
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  10. Published

    Stable optical emission from annealed poly (p-phenylene vinylene) derivative films containing oxadiazole

    Kong, F., Wu, X. L., Yuan, R. K., Zhang, S. Y., Yang, C. Z., Chu, P. K. & Siu, G. G., Sept 2006, In: Journal of Electronic Materials. 35, 9, p. 1689-1692

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

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  11. Published

    Interfacial adhesion of spin-coated thin adhesive film on silicon substrate for the fabrication of polymer optical waveguide

    Uddin, M. A., Ho, W. F., Chow, C. K. & Chan, H. P., Jul 2006, In: Journal of Electronic Materials. 35, 7, p. 1558-1565

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 18
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  12. Published

    Processability and reliability of nonconductive adhesives (NCAs) in fine-pitch chip-on-flex applications

    Chiang, W. K., Chan, Y. C., Ralph, B. & Holland, A., Mar 2006, In: Journal of Electronic Materials. 35, 3, p. 443-452

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 14
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  13. Published

    Microstructure, solderability and growth of intermetallic compounds of Sn-Ag-Cu-RE lead-free solder alloys

    Law, C. M. T., Wu, C. M. L., Yu, D. Q., Wang, L. & Lai, J. K. L., Jan 2006, In: Journal of Electronic Materials. 35, 1, p. 89-93

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 96
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  14. Published

    Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding

    Islam, H. A. & Chan, Y. C., Jan 2006, In: Journal of Electronic Materials. 35, 1, p. 123-131

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 3
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  15. 2005
  16. Published

    Creep resistance of tin-based lead-free solder alloys

    Huang, M. L., Wu, C. M. L. & Wang, L., Nov 2005, In: Journal of Electronic Materials. 34, 11, p. 1373-1377

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 18
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  17. Published

    Process optimization to overcome void formation in nonconductive paste interconnections for fine-pitch applications

    Tan, S. C., Chan, Y. C. & Lui, N. S. M., Aug 2005, In: Journal of Electronic Materials. 34, 8, p. 1143-1149

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 11
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  18. Published

    Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates

    Rizvi, M. J., Chan, Y. C., Bailey, C., Lu, H., Islam, M. N. & Wu, B. Y., Aug 2005, In: Journal of Electronic Materials. 34, 8, p. 1115-1122

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 44
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  19. Published

    Interfacial reactions of Cu-containing lead-free solders with Au/NiP metallization

    Islam, M. N. & Chan, Y. C., May 2005, In: Journal of Electronic Materials. 34, 5, p. 662-669

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 10
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  20. Published

    Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging

    Islam, M. N., Sharif, A. & Chan, Y. C., Feb 2005, In: Journal of Electronic Materials. 34, 2, p. 143-149

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 101
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  21. Published

    Comparative study of interfacial reactions of Sn-Ag-Cu and Sn-Ag solders on Cu pads during reflow soldering

    Sharif, A. & Chan, Y. C., Jan 2005, In: Journal of Electronic Materials. 34, 1, p. 46-52

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 22
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  22. 2004

  23. The application of lead-free solder to optical fiber packaging

    Ou, S., Xu, G., Xu, Y. & Tu, K. N., Dec 2004, In: Journal of Electronic Materials. 33, 12, p. 1440-1444

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 1
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  24. Published

    Effect of bump characteristics and temperature variation on the online contact resistance of anisotropic conductive joints

    Ali, L., Chan, Y. C. & Alam, M. O., Sept 2004, In: Journal of Electronic Materials. 33, 9, p. 1028-1035

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 5
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  25. Published

    Effect of Spin Coating on the Curing Rate of Epoxy Adhesive for the Fabrication of a Polymer Optical Waveguide

    Uddin, M. A., Chan, H. P., Chow, C. K. & Chan, Y. C., Mar 2004, In: Journal of Electronic Materials. 33, 3, p. 224-228

    Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review

    Scopus citations: 30
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