Journal of Electronic Materials

Journal of Electronic Materials

ISSNs: 0361-5235

Additional searchable ISSN (Electronic): 1543-186X

Springer, United States

Scopus rating (2019): CiteScore 3 SJR 0.418 SNIP 0.761

Journal

Journal Metrics

Research Output

  1. 2018
  2. Published

    Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction

    ZHOU, Z., MO, L., LIU, H., CHAN, Y. C. & WU, F., Dec 2018, In : Journal of Electronic Materials. 47, 12, p. 7435-7448

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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  3. Published

    Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection

    PUN, K. P. L., ISLAM, M. N., ROTANSON, J., CHEUNG, C. & CHAN, A. H. S., Sep 2018, In : Journal of Electronic Materials. 47, 9, p. 5191–5202

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 6
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  4. 2017
  5. Published

    TiO2/Sb2S3/P3HT Based Inorganic–Organic Hybrid Heterojunction Solar Cells with Enhanced Photoelectric Conversion Performance

    Zhang, H., Song, L., Luo, L., Liu, L., Wang, H. & Wang, F., 1 Jul 2017, In : Journal of Electronic Materials. 46, 7, p. 4670-4675

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 5
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  6. Published

    Chemical Coupling SERS Properties of Pyridine on Silver-Caged Metal Clusters M@Ag-12 (M = V-, Nb-, Ta-, Cr, Mo, W, Mn+, Tc+, Re+)

    Chen, L., Wang, Z., Li, Z. & Zhang, R., Jul 2017, In : Journal of Electronic Materials. 46, 7, p. 3904-3909

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 2
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  7. Published

    Structural Asymmetry-Facilitated Tunability of Spin Distribution in the (10,0) Carbon Nanotube Induced by Charging

    Wang, J., Gao, Y., Zhang, Z., Xu, D., Wang, Z. & Zhang, R., Jul 2017, In : Journal of Electronic Materials. 46, 7, p. 3857-3861

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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  8. 2014
  9. Published

    Modeling and optimization of thermoelements by a combined analytical and numerical method

    Xu, S., Chen, Q., Zhu, Y., Wang, L., Zheng, L. & Chu, P. K., 2014, In : Journal of Electronic Materials. 43, 2, p. 404-413

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 1
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  10. 2013
  11. Published

    Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn-3.0Ag-0.5Cu solder alloy

    Shafiq, I., Lau, H. Y. & Chan, Y. C., Sep 2013, In : Journal of Electronic Materials. 42, 9, p. 2835-2847

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 8
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  12. Microstructure of GaN1-x Bi x

    Liliental-Weber, Z., Dos Reis, R., Levander, A. X., Yu, K. M., Walukiewicz, W., Novikov, S. V. & Foxon, C. T., Jan 2013, In : Journal of Electronic Materials. 42, 1, p. 26-32

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 3
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  13. 2012
  14. Published

    Effects of high-temperature treatment on the reaction between Sn-3%Ag-0.5%Cu solder and sputtered Ni-V film on ferrite substrate

    Shen, X., Jin, H., Dong, S., Wong, H., Zhou, J., Guo, Z. & Wang, D., Nov 2012, In : Journal of Electronic Materials. 41, 11, p. 3145-3151

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 1
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  15. Published

    Electrical properties of textured (KNa) 0.44Li 0.06Nb 0.84Sb 0.06Ta 0.1O 3 thick films

    Fu, F., Zhai, J., Xu, Z., Bai, W. & Kong, L., Nov 2012, In : Journal of Electronic Materials. 41, 11, p. 3077-3081

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 2
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  16. Published

    Near-ultraviolet light-emitting devices using vertical ZnO nanorod arrays

    Jha, S., Wang, C. D., Luan, C. Y., Liu, C. P., Bin, H., Kutsay, O., Bello, I. & 3 others, Zapien, J. A., Zhang, W. J. & Lee, S. T., May 2012, In : Journal of Electronic Materials. 41, 5, p. 853-856

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 10
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  17. Synthesis of Ge 1-xSn x alloy thin films using ion implantation and pulsed laser melting (II-PLM)

    Bhatia, A., Hlaing Oo, W. M., Siegel, G., Stone, P. R., Yu, K. M. & Scarpulla, M. A., May 2012, In : Journal of Electronic Materials. 41, 5, p. 837-844

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 8
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  18. 2011
  19. Published

    Fabrication and Characterization of Silicon Microchannel Plates as Temperature-Sensing Materials

    Ci, P., Shi, J., Wang, F., Xu, S., Yang, Z., Yang, P., Wang, L. & 1 others, Chu, P. K., Dec 2011, In : Journal of Electronic Materials. 40, 12, p. 2363-2367

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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  20. 2009
  21. Published

    An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics

    Wang, W., Choubey, A., Azarian, M. H. & Pecht, M., Jun 2009, In : Journal of Electronic Materials. 38, 6, p. 815-827

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 24
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  22. 2008
  23. Published

    Electromigration in line-type Cu/Sn-Bi/Cu solder joints

    Gu, X. & Chan, Y. C., Nov 2008, In : Journal of Electronic Materials. 37, 11, p. 1721-1726

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 46
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  24. Published

    Joule heating enhanced phase coarsening in Sn37Pb and Sn3.5Ag0.5Cu solder joints during current stressing

    Wu, B. Y., Alam, M. O., Chan, Y. C. & Zhong, H. W., Apr 2008, In : Journal of Electronic Materials. 37, 4, p. 469-476

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 11
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  25. Published

    Silicidation of Ni(Yb) film on Si(001)

    Luo, J., Jiang, Y., Ru, G., Li, B. & Chu, P. K., Mar 2008, In : Journal of Electronic Materials. 37, 3, p. 245-248

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 7
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  26. 2006
  27. Published

    Effect of reaction time on mechanical strength of the interface formed between the Sn-Zn(-Bi) solder and the Au/Ni/Cu bond pad

    Sharif, A. & Chan, Y. C., Oct 2006, In : Journal of Electronic Materials. 35, 10, p. 1812-1817

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 13
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  28. Published

    Intergrowth mechanism of silicon nanowires and silver dendrites

    Qiu, T., Wu, X. L., Siu, G. G. & Chu, P. K., Oct 2006, In : Journal of Electronic Materials. 35, 10, p. 1879-1884

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

    Scopus citations: 56
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  29. Published

    Stable optical emission from annealed poly (p-phenylene vinylene) derivative films containing oxadiazole

    Kong, F., Wu, X. L., Yuan, R. K., Zhang, S. Y., Yang, C. Z., Chu, P. K. & Siu, G. G., Sep 2006, In : Journal of Electronic Materials. 35, 9, p. 1689-1692

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journal

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