Journal of Electronic Materials
Journal of Electronic Materials
ISSNs: 0361-5235
Additional searchable ISSN (electronic): 1543-186X
Springer, United States
Scopus rating (2023): CiteScore 4.1 SJR 0.439 SNIP 0.668
Journal
Research Output
- 2020
Tuning Stress in Cu Thin Films by Developing Highly (111)-Oriented Nanotwinned Structure
Wang, I., Ku, C., Lam, T., Huang, E., Tu, K. N. & Chen, C., Jan 2020, In: Journal of Electronic Materials. 49, 1, p. 109-115Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 5- 2018
- Published
Study of Fusion Thickness of Tin Solder Heating by Self-Propagating Exothermic Reaction
ZHOU, Z., MO, L., LIU, H., CHAN, Y. C. & WU, F., Dec 2018, In: Journal of Electronic Materials. 47, 12, p. 7435-7448Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 2 - Published
Enhancement of Sn-Bi-Ag Solder Joints with ENEPIG Surface Finish for Low-Temperature Interconnection
PUN, K. P. L., ISLAM, M. N., ROTANSON, J., CHEUNG, C. & CHAN, A. H. S., Sept 2018, In: Journal of Electronic Materials. 47, 9, p. 5191–5202Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 14 Electrodeposition of Ni on Bi2Te3 and Interfacial Reaction Between Sn and Ni-Coated Bi2Te3
Tseng, Y., Lee, H., Hau, N. Y., Feng, S. & Chen, C., 1 Jan 2018, In: Journal of Electronic Materials. 47, 1, p. 27-34Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 9- 2017
- Published
TiO2/Sb2S3/P3HT Based Inorganic–Organic Hybrid Heterojunction Solar Cells with Enhanced Photoelectric Conversion Performance
Zhang, H., Song, L., Luo, L., Liu, L., Wang, H. & Wang, F., 1 Jul 2017, In: Journal of Electronic Materials. 46, 7, p. 4670-4675Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 8 - Published
Chemical Coupling SERS Properties of Pyridine on Silver-Caged Metal Clusters M@Ag-12 (M = V-, Nb-, Ta-, Cr, Mo, W, Mn+, Tc+, Re+)
Chen, L., Wang, Z., Li, Z. & Zhang, R., Jul 2017, In: Journal of Electronic Materials. 46, 7, p. 3904-3909Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 4 - Published
Structural Asymmetry-Facilitated Tunability of Spin Distribution in the (10,0) Carbon Nanotube Induced by Charging
Wang, J., Gao, Y., Zhang, Z., Xu, D., Wang, Z. & Zhang, R., Jul 2017, In: Journal of Electronic Materials. 46, 7, p. 3857-3861Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 2 - 2016
Interfacial Characterizations of a Nickel-Phosphorus Layer Electrolessly Deposited on a Silane Compound-Modified Silicon Wafer Under Thermal Annealing
Lai, K., Wu, P., Chen, C., Wei, T., Wu, C. & Feng, S., 1 Oct 2016, In: Journal of Electronic Materials. 45, 10, p. 4813-4822Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 9- 2014
- Published
Modeling and optimization of thermoelements by a combined analytical and numerical method
XU, S., CHEN, Q., ZHU, Y., WANG, L., ZHENG, L. & CHU, P. K., Feb 2014, In: Journal of Electronic Materials. 43, 2, p. 404-413Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 1 - 2013
- Published
Effect of trace diamond nanoparticle addition on the interfacial, mechanical, and damping properties of Sn-3.0Ag-0.5Cu solder alloy
Shafiq, I., Lau, H. Y. & Chan, Y. C., Sept 2013, In: Journal of Electronic Materials. 42, 9, p. 2835-2847Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 9 Microstructure of GaN1-xBix
Liliental-Weber, Z., Dos Reis, R., Levander, A. X., Yu, K. M., Walukiewicz, W., Novikov, S. V. & Foxon, C. T., Jan 2013, In: Journal of Electronic Materials. 42, 1, p. 26-32Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 5- 2012
- Published
Effects of high-temperature treatment on the reaction between Sn-3%Ag-0.5%Cu solder and sputtered Ni-V film on ferrite substrate
Shen, X., Jin, H., Dong, S., Wong, H., Zhou, J., Guo, Z. & Wang, D., Nov 2012, In: Journal of Electronic Materials. 41, 11, p. 3145-3151Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 1 - Published
Electrical properties of textured (KNa) 0.44Li 0.06Nb 0.84Sb 0.06Ta 0.1O 3 thick films
Fu, F., Zhai, J., Xu, Z., Bai, W. & Kong, L., Nov 2012, In: Journal of Electronic Materials. 41, 11, p. 3077-3081Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 2 - Published
Near-ultraviolet light-emitting devices using vertical ZnO nanorod arrays
Jha, S., Wang, C. D., Luan, C. Y., Liu, C. P., Bin, H., Kutsay, O., Bello, I., & 3 others , May 2012, In: Journal of Electronic Materials. 41, 5, p. 853-856Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 11 Synthesis of Ge 1-xSn x alloy thin films using ion implantation and pulsed laser melting (II-PLM)
Bhatia, A., Hlaing Oo, W. M., Siegel, G., Stone, P. R., Yu, K. M. & Scarpulla, M. A., May 2012, In: Journal of Electronic Materials. 41, 5, p. 837-844Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 11- 2011
- Published
Fabrication and Characterization of Silicon Microchannel Plates as Temperature-Sensing Materials
CI, P., SHI, J., WANG, F., XU, S., YANG, Z., YANG, P., WANG, L., & 1 others , Dec 2011, In: Journal of Electronic Materials. 40, 12, p. 2363-2367Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 1 - 2009
Nonuniform and negative marker displacements induced by current crowding during electromigration in flip-chip Sn-0.7Cu solder joints
Liang, S. W., Hsiao, H., Chen, C., Xu, L., Tu, K. N. & Lai, Y., Dec 2009, In: Journal of Electronic Materials. 38, 12, p. 2443-2448Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 5- Published
An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics
Wang, W., Choubey, A., Azarian, M. H. & Pecht, M., Jun 2009, In: Journal of Electronic Materials. 38, 6, p. 815-827Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 38 - 2008
- Published
Electromigration in line-type Cu/Sn-Bi/Cu solder joints
Gu, X. & Chan, Y. C., Nov 2008, In: Journal of Electronic Materials. 37, 11, p. 1721-1726Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 57 Effect of migration and condensation of pre-existing voids on increase in bump resistance of flip chips on flexible substrates during electromigration
Liang, S. W., Chang, Y. W., Chen, C., Preciado, J. & Tu, K. N., Jul 2008, In: Journal of Electronic Materials. 37, 7, p. 962-967Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 4