Journal of Applied Physics

Journal of Applied Physics

ISSNs: 0021-8979

Additional searchable ISSN (electronic): 1089-7550

AMER INST PHYSICS, United States

Scopus rating (2022): CiteScore 5.1 SJR 0.706 SNIP 1.006

Journal

Journal Metrics

Research Output

  1. 2001
  2. Effects of phase transformation and interdiffusion on the exchange bias of NiFe/NiMn

    Lai, C., Lien, W. C., Chen, F. R., Kai, J. J. & Mao, S., 1 Jun 2001, In: Journal of Applied Physics. 89, 11 II, p. 6600-6602

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 12
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  3. Micro-optical nonlinearity of a silver oxide layer

    Fukaya, T., Büchel, D., Shinbori, S., Tominaga, J., Atoda, N., Tsai, D. P. & Lin, W. C., Jun 2001, In: Journal of Applied Physics. 89, 11 I, p. 6139-6144

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 48
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  4. Modifying the microstructure and morphology of film surface layers by manipulating chemical vapor deposition reactor conditions

    Paritosh, F. & Srolovitz, D. J., 1 May 2001, In: Journal of Applied Physics. 89, 9, p. 4857-4865

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 7
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  5. Wetting reaction versus solid state aging of eutectic SnPb on Cu

    Tu, K. N., Lee, T. Y., Jang, J. W., Li, L., Frear, D. R., Zeng, K. & Kivilahti, J. K., 1 May 2001, In: Journal of Applied Physics. 89, 9, p. 4843-4849

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 132
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  6. Electromigration in eutectic SnPb solder lines

    Huynh, Q. T., Liu, C. Y., Chen, C. & Tu, K. N., 15 Apr 2001, In: Journal of Applied Physics. 89, 8, p. 4332-4335

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 85
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  7. Sputtering and in-plane texture control during the deposition of MgO

    Dong, L., Zepeda-Ruiz, L. A. & Srolovitz, D. J., 1 Apr 2001, In: Journal of Applied Physics. 89, 7, p. 4105-4112

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 35
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  8. Effects of contact resistance and film thickness on current crowding and the critical product of electromigration in Blech structures

    Yeh, E. C. C. & Tu, K. N., 15 Mar 2001, In: Journal of Applied Physics. 89, 6, p. 3203-3208

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 15
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  9. Electromigration of eutectic SnPb solder interconnects for flip chip technology

    Lee, T. Y., Tu, K. N., Kuo, S. M. & Frear, D. R., 15 Mar 2001, In: Journal of Applied Physics. 89, 6, p. 3189-3194

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 199
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  10. 11B and 10B magic-angle spinning nuclear magnetic resonance studies of cubic boron nitride films prepared by plasma chemical vapor deposition

    Zhang, W. J., Tansho, M., Matsumoto, S. & Mori, T., 1 Feb 2001, In: Journal of Applied Physics. 89, 3, p. 1734-1737

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 8
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  11. 2000
  12. Morphology of interfacial reaction between lead-free solders and electroless Ni-P under bump metallization

    Jang, J. W., Frear, D. R., Lee, T. Y. & Tu, K. N., Dec 2000, In: Journal of Applied Physics. 88, 11, p. 6359-6363

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 190
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  13. Electromigration in Sn-Pb solder strips as a function of alloy composition

    Liu, C. Y., Chen, C. & Tu, K. N., 15 Nov 2000, In: Journal of Applied Physics. 88, 10, p. 5703-5709

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 154
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  14. Measurement of mechanical properties for dense and porous polymer films having a low dielectric constant

    Xu, Y., Tsai, Y., Zheng, D. W., Tu, K. N., Ong, C. W., Choy, C. L., Zhao, B., & 2 othersLiu, Q. Z. & Brongo, M., 15 Nov 2000, In: Journal of Applied Physics. 88, 10, p. 5744-5750

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 17
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  15. Numerical simulation of current crowding phenomena and their effects on electromigration in very large scale integration interconnects

    Yeh, E. C. C. & Tu, K. N., 15 Nov 2000, In: Journal of Applied Physics. 88, 10, p. 5680-5686

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 43
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  16. The electro-optic properties of interdiffused InGaAs/Inp quantum well structures

    Weiss, B. L., Chan, Y., Shiu, W. C. & Li, E. H., Sept 2000, In: Journal of Applied Physics. 88, 6, p. 3418-3425

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 9
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  17. Composition, residual stress, and structural properties of thin tungsten nitride films deposited by reactive magnetron sputtering

    Shen, Y. G., Mai, Y. W., McKenzie, D. R., Zhang, Q. C., McFall, W. D. & McBride, W. E., Aug 2000, In: Journal of Applied Physics. 88, 3, p. 1380-1388

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 103
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  18. Mechanical properties of xerogel silica films derived from stress versus temperature and cracking experiments

    Chow, L. A., Dunn, B., Tu, K. N. & Chiang, C., Jun 2000, In: Journal of Applied Physics. 87, 11, p. 7788-7792

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 20
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  19. Electroluminescence of different colors from polycation/CdTe nanocrystal self-assembled films

    Mingyuan, G., Lesser, C., Kirstein, S., Möhwald, E., Rogach, A. L. & Weller, H., Mar 2000, In: Journal of Applied Physics. 87, 5, p. 2297-2302

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 321
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  20. Electron microscopy study of interfacial reaction between eutectic SnPb and Cu/Ni(V)/Al thin film metallization

    Liu, C. Y., Tu, K. N., Sheng, T. T., Tung, C. H., Frear, D. R. & Elenius, P., 15 Jan 2000, In: Journal of Applied Physics. 87, 2, p. 750-754

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 120
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  21. Residual stress, microstructure, and structure of tungsten thin films deposited by magnetron sputtering

    Shen, Y. G., Mai, Y. W., Zhang, Q. C., McKenzie, D. R., McFall, W. D. & McBride, W. E., 1 Jan 2000, In: Journal of Applied Physics. 87, 1, p. 177-187

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 197
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  22. 1999
  23. Asymmetrical heating behavior of doped Si channels in bulk silicon and in silicon-on-insulator under high current stress

    Liao, C. N., Chen, C., Huang, J. S. & Tu, K. N., Dec 1999, In: Journal of Applied Physics. 86, 12, p. 6895-6901

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 2
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