Journal of Applied Physics
Journal of Applied Physics
ISSNs: 0021-8979
Additional searchable ISSN (electronic): 1089-7550
AMER INST PHYSICS, United States
Scopus rating (2023): CiteScore 5.4 SJR 0.649 SNIP 0.96
Journal
Research Output
- 2007
Growth mechanism from nano-ordered clusters to nanocrystals in a deeply undercooled melt of Zr-Ni-Ti metallic glass
Liu, X. J., Chen, G. L., Hui, X. D., Hou, H. Y., Yao, K. F. & Liu, C. T., 2007, In: Journal of Applied Physics. 102, 6, 63515.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 20Hole transport in molecularly doped naphthyl diamine
Tong, K. L., Tsang, S. W., Tsung, K. K., Tse, S. C. & So, S. K., 2007, In: Journal of Applied Physics. 102, 9, 93705.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 40New criterion of glass forming ability for bulk metallic glasses
Du, X. H., Huang, J. C., Liu, C. T. & Lu, Z. P., 2007, In: Journal of Applied Physics. 101, 8, 86108.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 180Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu
Suh, J. O., Tu, K. N. & Tamura, N., 2007, In: Journal of Applied Physics. 102, 6, 063511.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 77Structural transition of ferromagnetic Ni2MnGa nanoparticles
Wang, Y. D., Ren, Y., Nie, Z. H., Liu, D. M., Zuo, L., Choo, H. & Li, H. & 5 others, , 2007, In: Journal of Applied Physics. 101, 6, 063530.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 63Three-dimensional structure of CdX (X=Se,Te) nanocrystals by total x-ray diffraction
Pradhan, S. K., Deng, Z. T., Tang, F., Wang, C., Ren, Y., Moeck, P. & Petkov, V., 2007, In: Journal of Applied Physics. 102, 4, 044304.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 15- 2006
Modeling of smoothening effect on morphologies of annealed submicron nickel particles used for electrically conductive adhesives
Goh, C. F., Gan, Z. H., Mhaisalkar, S. G., Boey, F. Y. C., Gusak, A. M. & Teo, P. S., 15 Oct 2006, In: Journal of Applied Physics. 100, 8, 084302.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 3Capillarity and electromigration effects on asperity contact evolution in microelectromechanical systems switches
Kim, J. H., Srolovitz, D. J., Cha, P.-R. & Yoon, J.-K., 1 Sept 2006, In: Journal of Applied Physics. 100, 5, 054502.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 8Film/substrate interface stability in thin films
Krishnamurthy, R. & Srolovitz, D. J., 15 Feb 2006, In: Journal of Applied Physics. 99, 4, 043504.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 10Electromigration in Pb-free flip chip solder joints on flexible substrates
Nah, J. W., Ren, F., Tu, K. N., Venk, S. & Camara, G., 15 Jan 2006, In: Journal of Applied Physics. 99, 2, 023520.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 39Application of admittance spectroscopy to evaluate carrier mobility in organic charge transport materials
Tsang, S. W., So, S. K. & Xu, J. B., 2006, In: Journal of Applied Physics. 99, 1, 13706.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 235Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints
Huang, A. T., Tu, K. N. & Lai, Y.-S., 2006, In: Journal of Applied Physics. 100, 3, 033512.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 55Electromigration and critical product in eutectic SnPb solder lines at 100°C
Agarwal, R., Ou, S. E. & Tu, K. N., 2006, In: Journal of Applied Physics. 100, 2, 024909.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 36Electromigration in flip chip solder joints having a thick Cu column bump and a shallow solder interconnect
Nah, J.-W., Suh, J. O., Tu, K. N., Yoon, S. W., Rao, V. S., Kripesh, V. & Hua, F., 2006, In: Journal of Applied Physics. 100, 12, 123513.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 98Examining the oxygen isotope and magnetic field effect on phase separation in Sm0.5Sr0.5MnO3
Styka, A. N., Ren, Y., Gorbenko, O. Y., Babushkina, N. A. & Brown, D. E., 2006, In: Journal of Applied Physics. 100, 10, 103520.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 9Polymeric conducting anode for small organic transporting molecules in dark injection experiments
Tse, S. C., Tsang, S. W. & So, S. K., 2006, In: Journal of Applied Physics. 100, 6, 63708.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 87Structural properties of Ge nanocrystals embedded in sapphire
Sharp, I. D., Xu, Q., Yi, D. O., Yuan, C. W., Beeman, J. W., Yu, K. M. & Ager III, J. W. & 2 others, , 2006, In: Journal of Applied Physics. 100, 11, 114317.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 25- 2005
Three-dimensional simulation of void migration at the interface between thin metallic film and dielectric under electromigration
Zaporozhets, T. V., Gusak, A. M., Tu, K. N. & Mhaisalkar, S. G., 15 Nov 2005, In: Journal of Applied Physics. 98, 10, 103508.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 35Effects of stoichiometry on electrical, optical, and structural properties of indium nitride
Ho, J. C., Specht, P., Yang, Q., Xu, X., Hao, D. & Weber, E. R., 1 Nov 2005, In: Journal of Applied Physics. 98, 9, 093712.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 28Bismuth replacement by samarium in strontium bismuth niobate and its multiferroic nature
Srinivas, A., Sritharan, T. & Boey, F. Y. C., 1 Aug 2005, In: Journal of Applied Physics. 98, 3, 036104.Research output: Journal Publications and Reviews › RGC 21 - Publication in refereed journal › peer-review
Scopus citations: 16