Journal of Applied Physics

Journal of Applied Physics

ISSNs: 0021-8979

Additional searchable ISSN (Electronic): 1089-7550

AMER INST PHYSICS, United States

Scopus rating (2022): CiteScore 5.1 SJR 0.706 SNIP 1.006

Journal

Journal Metrics

Research Output

  1. 2008
  2. Spacerless metal-manganite pseudo-spin-valve structure

    Cheng, W. F., Ruotolo, A., Chan, Y. K., Wong, K. H. & Leung, C. W., 2008, In: Journal of Applied Physics. 103, 10, 103903.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 5
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  3. 2007
  4. Enhancing UV photoconductivity of ZnO nanobelt by polyacrylonitrile functionalization

    He, J. H., Lin, Y. H., McConney, M. E., Tsukruk, V. V., Wang, Z. L. & Bao, G., 15 Oct 2007, In: Journal of Applied Physics. 102, 8, 084303.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 131
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  5. Photoluminescence phenomena of Ce3+-doped Y3Al5O12 nanophosphors

    Su, L. T., Tok, A. I. Y., Boey, F. Y. C., Zhang, X. H., Woodhead, J. L. & Summers, C. J., 15 Oct 2007, In: Journal of Applied Physics. 102, 8, 083541.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 49
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  6. On the physics of moisture-induced cracking in metal-glass (copper-silica) interfaces

    Card, J. C., Cannon, R. M., Saiz, E., Tomsia, A. P. & Ritchie, R. O., 1 Sept 2007, In: Journal of Applied Physics. 102, 5, 053516.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 11
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  7. Nanospot welding and contact evolution during cycling of a model microswitch

    Doelling, C. M., Kyle Vanderlick, T., Song, J. & Srolovitz, D., 18 Jun 2007, In: Journal of Applied Physics. 101, 12, 124303.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 13
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  8. Very high-cycle fatigue failure in micron-scale polycrystalline silicon films: Effects of environment and surface oxide thickness

    Alsem, D. H., Timmerman, R., Boyce, B. L., Stach, E. A., De Hosson, J. T. M. & Ritchie, R. O., 1 Jan 2007, In: Journal of Applied Physics. 101, 1, 013515.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 57
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  9. Electron mobility in InN and III-N alloys

    Hsu, L., Jones, R. E., Li, S. X., Yu, K. M. & Walukiewicz, W., 2007, In: Journal of Applied Physics. 102, 7, 73705.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 54
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  10. Growth mechanism from nano-ordered clusters to nanocrystals in a deeply undercooled melt of Zr-Ni-Ti metallic glass

    Liu, X. J., Chen, G. L., Hui, X. D., Hou, H. Y., Yao, K. F. & Liu, C. T., 2007, In: Journal of Applied Physics. 102, 6, 63515.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 19
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  11. Hole transport in molecularly doped naphthyl diamine

    Tong, K. L., Tsang, S. W., Tsung, K. K., Tse, S. C. & So, S. K., 2007, In: Journal of Applied Physics. 102, 9, 93705.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 40
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  12. New criterion of glass forming ability for bulk metallic glasses

    Du, X. H., Huang, J. C., Liu, C. T. & Lu, Z. P., 2007, In: Journal of Applied Physics. 101, 8, 86108.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 168
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  13. Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu

    Suh, J. O., Tu, K. N. & Tamura, N., 2007, In: Journal of Applied Physics. 102, 6, 063511.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 74
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  14. Structural transition of ferromagnetic Ni2MnGa nanoparticles

    Wang, Y. D., Ren, Y., Nie, Z. H., Liu, D. M., Zuo, L., Choo, H., Li, H., & 5 othersLiaw, P. K., Yan, J. Q., McQueeney, R. J., Richardson, J. W. & Huq, A., 2007, In: Journal of Applied Physics. 101, 6, 063530.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 59
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  15. Three-dimensional structure of CdX (X=Se,Te) nanocrystals by total x-ray diffraction

    Pradhan, S. K., Deng, Z. T., Tang, F., Wang, C., Ren, Y., Moeck, P. & Petkov, V., 2007, In: Journal of Applied Physics. 102, 4, 044304.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 15
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  16. 2006
  17. Modeling of smoothening effect on morphologies of annealed submicron nickel particles used for electrically conductive adhesives

    Goh, C. F., Gan, Z. H., Mhaisalkar, S. G., Boey, F. Y. C., Gusak, A. M. & Teo, P. S., 15 Oct 2006, In: Journal of Applied Physics. 100, 8, 084302.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 2
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  18. Capillarity and electromigration effects on asperity contact evolution in microelectromechanical systems switches

    Kim, J. H., Srolovitz, D. J., Cha, P. & Yoon, J., 1 Sept 2006, In: Journal of Applied Physics. 100, 5, 054502.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 7
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  19. Film/substrate interface stability in thin films

    Krishnamurthy, R. & Srolovitz, D. J., 15 Feb 2006, In: Journal of Applied Physics. 99, 4, 043504.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 9
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  20. Electromigration in Pb-free flip chip solder joints on flexible substrates

    Nah, J. W., Ren, F., Tu, K. N., Venk, S. & Camara, G., 15 Jan 2006, In: Journal of Applied Physics. 99, 2, 023520.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 38
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  21. Application of admittance spectroscopy to evaluate carrier mobility in organic charge transport materials

    Tsang, S. W., So, S. K. & Xu, J. B., 2006, In: Journal of Applied Physics. 99, 1, 13706.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 232
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  22. Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints

    Huang, A. T., Tu, K. N. & Lai, Y., 2006, In: Journal of Applied Physics. 100, 3, 033512.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 55
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  23. Electromigration and critical product in eutectic SnPb solder lines at 100°C

    Agarwal, R., Ou, S. E. & Tu, K. N., 2006, In: Journal of Applied Physics. 100, 2, 024909.

    Research output: Journal Publications and ReviewsRGC 21 - Publication in refereed journalpeer-review

    Scopus citations: 34
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