Journal of Alloys and Compounds

Journal of Alloys and Compounds

ISSNs: 0925-8388, 0022-5088

Additional searchable ISSN (Electronic): 1873-4669

Elsevier Science, Netherlands

Scopus rating (2018): CiteScore 4.12 SJR 1.065 SNIP 1.386

Journal

Journal Metrics

Research Output

  1. 2007
  2. Published

    Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization

    Sharif, A. & Chan, Y. C., 16 Aug 2007, In : Journal of Alloys and Compounds. 440, 1-2, p. 117-121

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 24
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  3. Published

    Effect of adding 0.3 wt% Ni into the Sn-0.7 wt%Cu solder. Part I: Wetting behavior on Cu and Ni substrates

    Rizvi, M. J., Bailey, C., Chan, Y. C. & Lu, H., 12 Jul 2007, In : Journal of Alloys and Compounds. 438, 1-2, p. 116-121

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 27
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  4. Published

    Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging

    Rizvi, M. J., Bailey, C., Chan, Y. C., Islam, M. N. & Lu, H., 12 Jul 2007, In : Journal of Alloys and Compounds. 438, 1-2, p. 122-128

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 51
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  5. Published

    Formation and corrosion behavior of glassy Ni-Nb-Ti-Zr-Co(-Cu) alloys

    Pang, S. J., Shek, C. H., Asami, K., Inoue, A. & Zhang, T., 31 May 2007, In : Journal of Alloys and Compounds. 434-435, SPEC. ISS., p. 240-243

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 17
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  6. Published

    The best glass-forming compositions in Al-Co(or Ni)-Y ternary systems

    Wang, Y., Shek, C. H., Qiang, J., Dong, C., Pang, S. & Zhang, T., 31 May 2007, In : Journal of Alloys and Compounds. 434-435, SPEC. ISS., p. 167-170

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 5
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  7. Published

    Thermal and mechanical properties of Cu-Zr-Al bulk metallic glasses

    Cheung, T. L. & Shek, C. H., 31 May 2007, In : Journal of Alloys and Compounds. 434-435, SPEC. ISS., p. 71-74

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 64
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  8. 2006
  9. Published

    MgNi/Pd multilayer hydrogen storage thin films prepared by dc magnetron sputtering

    Ouyang, L. Z., Wang, H., Chung, C. Y., Ahn, J. H. & Zhu, M., 28 Sep 2006, In : Journal of Alloys and Compounds. 422, 1-2, p. 58-61

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 31
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  10. Published

    Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints

    Zhong, W. H., Chan, Y. C., Alam, M. O., Wu, B. Y. & Guan, J. F., 13 Apr 2006, In : Journal of Alloys and Compounds. 414, 1-2, p. 123-130

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 44
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  11. Published

    Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

    Rizvi, M. J., Chan, Y. C., Bailey, C., Lu, H. & Islam, M. N., 5 Jan 2006, In : Journal of Alloys and Compounds. 407, 1-2, p. 208-214

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 74
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  12. 2005
  13. Published

    Microstructure of MmM5/Mg multi-layer films prepared by magnetron sputtering

    Ouyang, L. Z., Wang, H., Zhu, M., Zou, J. & Chung, C. Y., 8 Dec 2005, In : Journal of Alloys and Compounds. 404-406, SPEC. ISS., p. 485-489

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 20
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  14. Published

    Effect of Nb content on the microstructure and mechanical properties of Zr-Cu-Ni-Al-Nb glass forming alloys

    Sun, Y. F., Shek, C. H., Wei, B. C., Li, W. H. & Wang, Y. R., 10 Nov 2005, In : Journal of Alloys and Compounds. 403, 1-2, p. 239-244

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 27
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  15. Published

    Investigations of interfacial reactions of Sn-Zn based and Sn-Ag-Cu lead-free solder alloys as replacement for Sn-Pb solder

    Islam, M. N., Chan, Y. C., Rizvi, M. J. & Jillek, W., 1 Sep 2005, In : Journal of Alloys and Compounds. 400, 1-2, p. 136-144

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 101
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  16. Published

    Effect of 9 wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

    Islam, M. N., Chan, Y. C., Sharif, A. & Rizvi, M. J., 21 Jun 2005, In : Journal of Alloys and Compounds. 396, 1-2, p. 217-223

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 29
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  17. Published

    Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn-In-Ag-Cu solder

    Sharif, A. & Chan, Y. C., 3 May 2005, In : Journal of Alloys and Compounds. 393, 1-2, p. 135-140

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 25
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  18. Published

    Electric current effect on microstructure of ball grid array solder joint

    Wu, B. Y. & Chan, Y. C., 19 Apr 2005, In : Journal of Alloys and Compounds. 392, 1-2, p. 237-246

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 19
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  19. Published

    Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method

    Yu, D. Q., Wu, C. M. L., Law, C. M. T., Wang, L. & Lai, J. K. L., 19 Apr 2005, In : Journal of Alloys and Compounds. 392, 1-2, p. 192-199

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 100
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  20. Published

    Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder

    Islam, R. A., Wu, B. Y., Alam, M. O., Chan, Y. C. & Jillek, W., 19 Apr 2005, In : Journal of Alloys and Compounds. 392, 1-2, p. 149-158

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 101
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  21. Published

    Effect of indium addition in Sn-rich solder on the dissolution of Cu metallization

    Sharif, A. & Chan, Y. C., 22 Mar 2005, In : Journal of Alloys and Compounds. 390, 1-2, p. 67-73

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 62
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  22. Published

    Intense visible fluorescence and energy transfer in Dy3+, Tb3+, Sm3+ and Eu3+ doped rare-earth borate glasses

    Lin, H., Pun, E. Y., Wang, X. & Liu, X., 22 Mar 2005, In : Journal of Alloys and Compounds. 390, 1-2, p. 197-201

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 105
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  23. Published

    Photovoltaic effects of diodes containing lanthanide complexes

    Chu, B., Li, W. L., Wei, H. Z., Wang, D. Y., Li, M. T., Zhang, Z. Q., Hu, Z. Z. & 2 othersLee, C. S. & Lee, S. T., 8 Mar 2005, In : Journal of Alloys and Compounds. 389, 1-2, p. 252-255

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 6
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