Journal of Alloys and Compounds

Journal of Alloys and Compounds

ISSNs: 0925-8388, 0022-5088

Additional searchable ISSN (Electronic): 1873-4669

Elsevier Science, Netherlands

Scopus rating (2018): CiteScore 4.12 SJR 1.065 SNIP 1.386

Journal

Journal Metrics

Research Output

  1. 2007
  2. Published

    Effect of adding 0.3 wt% Ni into the Sn-0.7 wt% Cu solder. Part II. Growth of intermetallic layer with Cu during wetting and aging

    Rizvi, M. J., Bailey, C., Chan, Y. C., Islam, M. N. & Lu, H., 12 Jul 2007, In : Journal of Alloys and Compounds. 438, 1-2, p. 122-128

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 51
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  3. Crystallization and thermal stability of the Mg65Cu25-xGd10Agx (x = 0-10) amorphous alloys

    Chang, L., Jang, J., Yang, B. & Huang, J. C., 31 May 2007, In : Journal of Alloys and Compounds. 434-435, p. 221-224

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 10
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  4. Published

    Formation and corrosion behavior of glassy Ni-Nb-Ti-Zr-Co(-Cu) alloys

    Pang, S. J., Shek, C. H., Asami, K., Inoue, A. & Zhang, T., 31 May 2007, In : Journal of Alloys and Compounds. 434-435, SPEC. ISS., p. 240-243

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 18
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  5. Influence of air and vacuum environment on fatigue behavior of Zr-based bulk metallic glasses

    Wang, G. Y., Liaw, P. K., Yokoyama, Y., Peter, W. H., Yang, B., Freels, M., Buchanan, R. A. & 2 othersLiu, C. T. & Brooks, C. R., 31 May 2007, In : Journal of Alloys and Compounds. 434-435, SPEC. ISS., p. 68-70

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 17
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  6. Published

    The best glass-forming compositions in Al-Co(or Ni)-Y ternary systems

    Wang, Y., Shek, C. H., Qiang, J., Dong, C., Pang, S. & Zhang, T., 31 May 2007, In : Journal of Alloys and Compounds. 434-435, SPEC. ISS., p. 167-170

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 5
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  7. Published

    Thermal and mechanical properties of Cu-Zr-Al bulk metallic glasses

    Cheung, T. L. & Shek, C. H., 31 May 2007, In : Journal of Alloys and Compounds. 434-435, SPEC. ISS., p. 71-74

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 64
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  8. Deformation behavior of Mg-Zn-Gd-based alloys reinforced with quasicrystal and Laves phases at elevated temperatures

    Liu, Y., Yuan, G., Ding, W. & Lu, C., 16 Jan 2007, In : Journal of Alloys and Compounds. 427, 1-2, p. 160-165

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 57
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  9. 2006
  10. Effect of strain in La0.7Sr0.3MnO3 epitaxial films with different crystallographic orientation

    di Uccio, U. S., Davidson, B., Di Capua, R., Miletto Granozio, F., Pepe, G., Perna, P., Ruotolo, A. & 1 othersSalluzzo, M., 26 Oct 2006, In : Journal of Alloys and Compounds. 423, 1-2 SPEC. ISS., p. 228-231

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 9
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  11. Published

    MgNi/Pd multilayer hydrogen storage thin films prepared by dc magnetron sputtering

    Ouyang, L. Z., Wang, H., Chung, C. Y., Ahn, J. H. & Zhu, M., 28 Sep 2006, In : Journal of Alloys and Compounds. 422, 1-2, p. 58-61

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 31
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  12. Published

    Effect of multiple reflow processes on the reliability of ball grid array (BGA) solder joints

    Zhong, W. H., Chan, Y. C., Alam, M. O., Wu, B. Y. & Guan, J. F., 13 Apr 2006, In : Journal of Alloys and Compounds. 414, 1-2, p. 123-130

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 44
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  13. Published

    Effect of adding 1 wt% Bi into the Sn-2.8Ag-0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging

    Rizvi, M. J., Chan, Y. C., Bailey, C., Lu, H. & Islam, M. N., 5 Jan 2006, In : Journal of Alloys and Compounds. 407, 1-2, p. 208-214

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 74
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  14. 2005
  15. Published

    Microstructure of MmM5/Mg multi-layer films prepared by magnetron sputtering

    Ouyang, L. Z., Wang, H., Zhu, M., Zou, J. & Chung, C. Y., 8 Dec 2005, In : Journal of Alloys and Compounds. 404-406, SPEC. ISS., p. 485-489

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 20
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  16. Published

    Effect of Nb content on the microstructure and mechanical properties of Zr-Cu-Ni-Al-Nb glass forming alloys

    Sun, Y. F., Shek, C. H., Wei, B. C., Li, W. H. & Wang, Y. R., 10 Nov 2005, In : Journal of Alloys and Compounds. 403, 1-2, p. 239-244

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 27
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  17. Published

    Investigations of interfacial reactions of Sn-Zn based and Sn-Ag-Cu lead-free solder alloys as replacement for Sn-Pb solder

    Islam, M. N., Chan, Y. C., Rizvi, M. J. & Jillek, W., 1 Sep 2005, In : Journal of Alloys and Compounds. 400, 1-2, p. 136-144

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 101
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  18. Published

    Effect of 9 wt.% in addition to Sn3.5Ag0.5Cu solder on the interfacial reaction with the Au/NiP metallization on Cu pads

    Islam, M. N., Chan, Y. C., Sharif, A. & Rizvi, M. J., 21 Jun 2005, In : Journal of Alloys and Compounds. 396, 1-2, p. 217-223

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 29
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  19. Effect of preparation method on the surface and redox properties of Ce 0.67Zr0.33O2 mixed oxides

    Wu, X., Fan, J., Ran, R., Yang, J. & Weng, D., 31 May 2005, In : Journal of Alloys and Compounds. 395, 1-2, p. 135-140

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 44
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  20. Published

    Interfacial reactions on electrolytic Ni and electroless Ni(P) metallization with Sn-In-Ag-Cu solder

    Sharif, A. & Chan, Y. C., 3 May 2005, In : Journal of Alloys and Compounds. 393, 1-2, p. 135-140

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 25
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  21. Published

    Electric current effect on microstructure of ball grid array solder joint

    Wu, B. Y. & Chan, Y. C., 19 Apr 2005, In : Journal of Alloys and Compounds. 392, 1-2, p. 237-246

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 19
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  22. Published

    Intermetallic compounds growth between Sn-3.5Ag lead-free solder and Cu substrate by dipping method

    Yu, D. Q., Wu, C. M. L., Law, C. M. T., Wang, L. & Lai, J. K. L., 19 Apr 2005, In : Journal of Alloys and Compounds. 392, 1-2, p. 192-199

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 101
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  23. Published

    Investigations on microhardness of Sn-Zn based lead-free solder alloys as replacement of Sn-Pb solder

    Islam, R. A., Wu, B. Y., Alam, M. O., Chan, Y. C. & Jillek, W., 19 Apr 2005, In : Journal of Alloys and Compounds. 392, 1-2, p. 149-158

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62)21_Publication in refereed journalNot applicablepeer-review

    Scopus citations: 101
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