IEEE Transactions on Electronics Packaging Manufacturing

IEEE Transactions on Electronics Packaging Manufacturing

ISSNs: 1521-334X

Institute of Electrical and Electronics Engineers Inc., United States

Journal

Journal Metrics
1 - 12 out of 12Page size: 20

Research Output

  1. 2010
  2. Published

    Electrical shorting propensity of tin whiskers

    Han, S., Osterman, M. & Pecht, M. G., Jul 2010, In: IEEE Transactions on Electronics Packaging Manufacturing. 33, 3, p. 205-211 5524096.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

    Scopus citations: 7
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  3. Published

    Comparison of Printed Circuit Board Property Variations in Response to Simulated Lead-Free Soldering

    Sood, B., Sanapala, R., Das, D., Pecht, M., Huang, C. Y. & Tsai, M. Y., 2010, In: IEEE Transactions on Electronics Packaging Manufacturing. 33, 2, p. 98 - 111

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

    Scopus citations: 13
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  4. 2009
  5. Published

    Effect of Lead-Free Soldering on Key Material Properties of FR-4 Printed Circuit Board Laminates

    Sanapala, R., Sood, B., Das, D. & PECHT, M., 2009, In: IEEE Transactions on Electronics Packaging Manufacturing. 32, 4, p. 272 - 280

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

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  6. 2008

  7. Automatic microassembly using visual servo control

    Wang, L., Mills, J. K. & Cleghorn, W. L., 2008, In: IEEE Transactions on Electronics Packaging Manufacturing. 31, 4, p. 316-325

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

    Scopus citations: 51
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  8. 2005

  9. A General Weibull Model for Reliability Analysis Under Different Failure Criteria - Application on Anisotropic Conductive Adhesive Joining Technology

    Liu, J., Cao, L., Xie, M., Goh, T. & Tang, Y., Oct 2005, In: IEEE Transactions on Electronics Packaging Manufacturing. 28, 4, p. 322-327

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

    Scopus citations: 8
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  10. 2004
  11. Published

    Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives

    Yin, C., Lu, H., Bailey, C. & Chan, Y., Oct 2004, In: IEEE Transactions on Electronics Packaging Manufacturing. 27, 4, p. 254-259

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 33
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  12. Foreword to the special section of the Asian Green Electronics Conference (AGEC)

    Liu, J., Griese, H. J. & Chan, Y., Oct 2004, In: IEEE Transactions on Electronics Packaging Manufacturing. 27, 4, p. 213-214

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › Editorial Preface

    Scopus citations: 1
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  13. Published

    Model-based integration of control and supervision for one kind of curing process

    Li, H., Deng, H. & Zhong, J., Jul 2004, In: IEEE Transactions on Electronics Packaging Manufacturing. 27, 3, p. 177-186

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

    Scopus citations: 38
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  14. 2003
  15. Published

    Comparative study of fluid dispensing modeling

    Hong, Y. & Li, H., Oct 2003, In: IEEE Transactions on Electronics Packaging Manufacturing. 26, 4, p. 273-280

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

    Scopus citations: 53
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  16. 2001

  17. Neural network modeling with confidence bounds: A case study on the solder paste deposition process

    Ho, S. L., Xie, M., Tang, L. C., Xu, K. & Goh, T. N., Oct 2001, In: IEEE Transactions on Electronics Packaging Manufacturing. 24, 4, p. 323-332

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

    Scopus citations: 32
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  18. 2000

  19. Burn-in effect on yield

    Kim, T., Kuo, W. & Chien, W. K., Oct 2000, In: IEEE Transactions on Electronics Packaging Manufacturing. 23, 4, p. 236

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › Meeting abstract › peer-review

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  20. Burn-In Effect on Yield

    Kim, T., Kuo, W. & Chien, W. K., Oct 2000, In: IEEE Transactions on Electronics Packaging Manufacturing. 23, 4, p. 293-299

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

    Scopus citations: 12
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