IEEE Transactions on Components, Packaging and Manufacturing Technology

IEEE Transactions on Components, Packaging and Manufacturing Technology

ISSNs: 2156-3950

Additional searchable ISSN (Electronic): 2156-3985

IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC, United States

Scopus rating (2022): CiteScore 4.4 SJR 0.615 SNIP 1.15

Journal

Journal Metrics
1 - 20 out of 29Page size: 20

Research Output

  1. 2023
  2. Online published

    Free-Form Filters Designed Using Binary Optimization Algorithm

    Ruan, X. & Chan, C. H., 17 Apr 2023, (Online published) In: IEEE Transactions on Components, Packaging and Manufacturing Technology.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

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  3. 2020

  4. Mean-Time-To-Failure Equations for Electromigration, Thermomigration, and Stress Migration

    Tu, K. N. & Gusak, A. N., Sept 2020, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 9, p. 1427-1431 9119477.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 6
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  5. Published

    Surrogate Model-Based Structure Optimization of Jetting System

    Shan, X., Wang, B., Xu, K. & Li, H., Mar 2020, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 10, 3, p. 494-501 8985253.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 3
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  6. 2019
  7. Published

    Broadband Filtering Power Dividers Using Simple Three-Line Coupled Structures

    Da Xu, K., Bai, Y., Ren, X. & Xue, Q., Jun 2019, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 6, p. 1103-1110

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 34
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  8. Published

    High Selectivity Balanced-to-Unbalanced Filtering Power Dividers Using Dual-mode Ring Resonators

    Feng, W., Che, W., Shi, Y., Xue, Q., Li, Y. C. & Zhou, X. Y., May 2019, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 5, p. 927-935

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 11
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  9. Published

    Multilayer Balanced-to-Unbalanced Power Divider with Wideband Transmission Characteristic and Common-Mode Suppression

    Ren, X. & Da Xu, K., Jan 2019, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 9, 1, p. 72-79

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 17
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  10. 2018
  11. Published

    Design of a Compact Wideband Butler Matrix Using Vertically Installed Planar Structure

    Chen, Q. P., Qamar, Z., Zheng, S. Y., Long, Y. L. & Ho, D., Aug 2018, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 8, p. 1420-1430

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 17
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  12. Published

    Integration of Wireless Coil and Bluetooth Antenna for High Charging and Radiation Efficiencies

    Wong, S., Sun, G., Zhu, L., Chen, Z. N. & Chu, Q., Jul 2018, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 7, p. 1292-1299

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 5
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  13. Published

    Optimal Design of Jetting Configuration for Robust Performance

    Shan, X., Li, H. & Si, H., Jul 2018, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 7, p. 1300-1306

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 1
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  14. Thermally Conductive Composite Material with Percolating Microparticles Applied as Underfill

    Straessle, R., Zimmermann, S., Del Carro, L., Zurcher, J., Schlottig, G., Achen, A., Hong, G., & 2 othersPoulikakos, D. & Brunschwiler, T., 1 May 2018, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 5, p. 840-850

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 6
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  15. Published

    Design of Compact Coaxial-Like Bandpass Filters Using Dielectric-Loaded Strip Resonator

    Zhou, L., Chen, J. & Xue, Q., Mar 2018, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 3, p. 456-464

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 8
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  16. Published

    Integrated Sensing-/Model-Based Online Estimation of Jet Dispensing

    Shan, X., Li, H., Si, H. & Chen, Y., Feb 2018, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 8, 2, p. 300-309 8248641.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 8
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  17. 2017
  18. Published

    Novel Compact Planar Crossover With Bandpass Response Based on Cross-Shaped Resonator

    Guo, Q., Zhang, X. Y. & Gao, L., Dec 2017, In: IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 7, 12, p. 2018-2026

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 11
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  19. Published

    A universal approach for designing an unequal branch-line coupler with arbitrary phase differences and input/output impedances

    Wu, Y., Jiao, L., Xue, Q. & Liu, Y., 1 Jun 2017, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 6, p. 944-955 7914733.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 41
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  20. Published

    LTCC Wideband Bandpass Filters With High Performance Using Coupled Lines With Open/Shorted Stubs

    Feng, W., Gao, X., Che, W., Yang, W. & Xue, Q., Apr 2017, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 4, p. 602-609 7865973.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 26
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  21. Published

    Novel Varactor-Tuned Coupling Mechanism and Its Applications to High-Order Bandwidth-Agile Bandpass Filters

    Cai, J., Qin, W., Chen, J. & Xue, Q., 1 Feb 2017, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 7, 2, p. 246-253 7831455.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 10
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  22. 2016
  23. Published

    Compact Single-/Dual-Band Planar Crossovers Based on Strong Coupled Lines

    Feng, W., Zhang, T., Che, W. & Xue, Q., 1 Jun 2016, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 6, 6, p. 854-863 7470568.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 20
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  24. Published

    Synthesis and Implementation of LTCC Bandpass Filter with Harmonic Suppression

    Xu, J., Zhang, X. Y., Zhao, X. & Xue, Q., 2016, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 6, 4, p. 596-604

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 24
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  25. 2015
  26. Published

    An Equivalent Circuit Model With Current Return Path Effects for ON-Chip Interconnect up to 80 GHz

    Zhu, Y., Kang, K., Wu, Y., Zhao, C., Ban, Y., Guo, J., Sun, L. L., & 2 othersYin, W. & Xue, Q., 1 Sept 2015, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 5, 9, p. 1320-1330 7226794.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 13
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  27. Published

    Investigation on the Influence of Nanofluids in Wavy Microchannel Heat Sink

    Sakanova, A., Zhao, J. & Tseng, K., 1 Jul 2015, In: IEEE Transactions on Components, Packaging and Manufacturing Technology. 5, 7, p. 956-970 7161475.

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 19
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