IEEE Transactions on Advanced Packaging

IEEE Transactions on Advanced Packaging

ISSNs: 1521-3323

Institute of Electrical and Electronics Engineers Inc., United States

Scopus rating (2021)

Journal

Journal Metrics
1 - 17 out of 17Page size: 20

Research Output

  1. 2008
  2. Presented

    Mechanical behavior and low-cycle shear fatigue life of the pure Ni laser-welded joints in optoelectronics packaging

    Tan, C. W., Chan, Y. C., Leung, N. W. & Liu, H. D., May 2008, In : IEEE Transactions on Advanced Packaging. 31, 2, p. 386-393

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 4
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  3. 2007
  4. Published

    Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

    Chan, Y. C., Tan, S. C., Lui, N. S. M. & Tan, C. W., Feb 2007, In : IEEE Transactions on Advanced Packaging. 30, 1, p. 142-147

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 10
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  5. 2006
  6. Published

    Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages

    Chan, Y. C., Tan, S. C., Lui, N. S. M. & Tan, C. W., Nov 2006, In : IEEE Transactions on Advanced Packaging. 29, 4, p. 735-740

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 12
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  7. Published

    The effect of different bonding temperatures on the mechanical and electrical performance of NCF-bonded flip-chip-on-flex packages

    Tan, S. C., Chan, Y. C. & Lui, N. S. M., Aug 2006, In : IEEE Transactions on Advanced Packaging. 29, 3, p. 570-575

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 13
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  8. 2005
  9. Published

    Interfacial microstructure and strength of lead-free Sn-Zn-RE BGA solder bumps

    Law, C. M. T., Wu, C. M. L., Yu, D. Q., Li, M. & Chi, D. Z., May 2005, In : IEEE Transactions on Advanced Packaging. 28, 2, p. 252-258

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 20
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  10. Published

    Microstructural evolution of lead-free Sn-Bi-Ag-Cu SMT joints during aging

    Wu, C. M. L. & Huang, M. L., Feb 2005, In : IEEE Transactions on Advanced Packaging. 28, 1, p. 128-133

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 16
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  11. 2002
  12. Published

    Multiple scattering among vias in lossy planar waveguides using SMCG method

    Huang, C., Tsang, L. & Chan, C. H., May 2002, In : IEEE Transactions on Advanced Packaging. 25, 2, p. 181-188

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal

    Scopus citations: 26
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  13. 2001
  14. Published

    Aging Studies of PBGA Solder Joints Reflowed at Different Conveyor Speeds

    Fan, S. H., Chan, Y. C., Tang, C. W. & Lai, J. K. L., Nov 2001, In : IEEE Transactions on Advanced Packaging. 24, 4, p. 486-492

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 8
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  15. Published

    Effect of Intermetallic Compounds on Vibration Fatigue of μBGA Solder Joint

    Tu, P. L., Chan, Y. C. & Lai, J. K. L., May 2001, In : IEEE Transactions on Advanced Packaging. 24, 2, p. 197-205

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 49
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  16. Published

    Nondestructive Methodology for Standoff Height Measurement of Flip Chip on Flex (FCOF) by SAM

    Tang, C. W., Chan, Y. C., Hung, K. C. & Webb, D. P., May 2001, In : IEEE Transactions on Advanced Packaging. 24, 2, p. 163-168

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 6
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  17. Published

    Effect of Cooling Rate on the Isothermal Fatigue Behavior of CBGA Solder Joints in Shear

    Fan, S. H., Chan, Y. C., Tang, C. W. & Lai, J. K. L., Feb 2001, In : IEEE Transactions on Advanced Packaging. 24, 1, p. 10-16

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 7
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  18. Published

    Reliability Studies of μBGA Solder Joints-effect of Ni-Sn Intermetallic Compound

    Chan, Y. C., Tu, P. L., Tang, C. W., Hung, K. C. & Lai, J. K. L., Feb 2001, In : IEEE Transactions on Advanced Packaging. 24, 1, p. 25-32

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 66
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  19. 2000
  20. Published

    Comparative Study of Micro-BGA Reliability Under Bending Stress

    Tu, P. L., Chan, Y. C., Hung, K. C. & Lai, J. K. L., Nov 2000, In : IEEE Transactions on Advanced Packaging. 23, 4, p. 750-756

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 33
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  21. Published

    Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock

    Poon, N. M., Wu, C. M. L., Lai, J. K. L. & Chan, Y. C., Nov 2000, In : IEEE Transactions on Advanced Packaging. 23, 4, p. 708-714

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 39
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  22. Published

    Study of Self-Alignment of μBGA Packages

    Hung, K. C., Chan, Y. C., Tu, P. L., Ong, H. C., Webb, D. P. & Lai, J. K. L., Nov 2000, In : IEEE Transactions on Advanced Packaging. 23, 4, p. 631-636

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 2
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  23. Published

    Impact Properties of PBGA Assemblies Reflowed in Nitrogen Ambient and Compressed Air

    Wu, Y. P. & Chan, Y. C., Aug 2000, In : IEEE Transactions on Advanced Packaging. 23, 3, p. 421-425

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 4
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  24. Published

    Nondestructive Defect Detection in Multilayer Ceramic Capacitors Using an Improved Digital Speckle Correlation Method with Wavelet Packet Noise Reduction Processing

    Chan, Y. C., Hung, K. C. & Dai, X., Feb 2000, In : IEEE Transactions on Advanced Packaging. 23, 1, p. 80-87

    Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review

    Scopus citations: 15
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