IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging
ISSNs: 1521-3323
Institute of Electrical and Electronics Engineers Inc., United States
Scopus rating (2021)
Journal
Research Output
- 2008
- Presented
Mechanical behavior and low-cycle shear fatigue life of the pure Ni laser-welded joints in optoelectronics packaging
Tan, C. W., Chan, Y. C., Leung, N. W. & Liu, H. D., May 2008, In : IEEE Transactions on Advanced Packaging. 31, 2, p. 386-393Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 4 - 2007
- Published
Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages
Chan, Y. C., Tan, S. C., Lui, N. S. M. & Tan, C. W., Feb 2007, In : IEEE Transactions on Advanced Packaging. 30, 1, p. 142-147Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 10 - 2006
- Published
Electrical Characterization of NCP- and NCF-Bonded Fine-Pitch Flip-Chip-on-Flexible Packages
Chan, Y. C., Tan, S. C., Lui, N. S. M. & Tan, C. W., Nov 2006, In : IEEE Transactions on Advanced Packaging. 29, 4, p. 735-740Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 12 - Published
The effect of different bonding temperatures on the mechanical and electrical performance of NCF-bonded flip-chip-on-flex packages
Tan, S. C., Chan, Y. C. & Lui, N. S. M., Aug 2006, In : IEEE Transactions on Advanced Packaging. 29, 3, p. 570-575Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 13 - 2005
- Published
Interfacial microstructure and strength of lead-free Sn-Zn-RE BGA solder bumps
Law, C. M. T., Wu, C. M. L., Yu, D. Q., Li, M. & Chi, D. Z., May 2005, In : IEEE Transactions on Advanced Packaging. 28, 2, p. 252-258Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 20 - Published
Microstructural evolution of lead-free Sn-Bi-Ag-Cu SMT joints during aging
Wu, C. M. L. & Huang, M. L., Feb 2005, In : IEEE Transactions on Advanced Packaging. 28, 1, p. 128-133Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 16 - 2002
- Published
Multiple scattering among vias in lossy planar waveguides using SMCG method
Huang, C., Tsang, L. & Chan, C. H., May 2002, In : IEEE Transactions on Advanced Packaging. 25, 2, p. 181-188Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 22_Publication in policy or professional journal
Scopus citations: 26 - 2001
- Published
Aging Studies of PBGA Solder Joints Reflowed at Different Conveyor Speeds
Fan, S. H., Chan, Y. C., Tang, C. W. & Lai, J. K. L., Nov 2001, In : IEEE Transactions on Advanced Packaging. 24, 4, p. 486-492Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 8 - Published
Effect of Intermetallic Compounds on Vibration Fatigue of μBGA Solder Joint
Tu, P. L., Chan, Y. C. & Lai, J. K. L., May 2001, In : IEEE Transactions on Advanced Packaging. 24, 2, p. 197-205Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 49 - Published
Nondestructive Methodology for Standoff Height Measurement of Flip Chip on Flex (FCOF) by SAM
Tang, C. W., Chan, Y. C., Hung, K. C. & Webb, D. P., May 2001, In : IEEE Transactions on Advanced Packaging. 24, 2, p. 163-168Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 6 - Published
Effect of Cooling Rate on the Isothermal Fatigue Behavior of CBGA Solder Joints in Shear
Fan, S. H., Chan, Y. C., Tang, C. W. & Lai, J. K. L., Feb 2001, In : IEEE Transactions on Advanced Packaging. 24, 1, p. 10-16Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 7 - Published
Reliability Studies of μBGA Solder Joints-effect of Ni-Sn Intermetallic Compound
Chan, Y. C., Tu, P. L., Tang, C. W., Hung, K. C. & Lai, J. K. L., Feb 2001, In : IEEE Transactions on Advanced Packaging. 24, 1, p. 25-32Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 66 - 2000
- Published
Comparative Study of Micro-BGA Reliability Under Bending Stress
Tu, P. L., Chan, Y. C., Hung, K. C. & Lai, J. K. L., Nov 2000, In : IEEE Transactions on Advanced Packaging. 23, 4, p. 750-756Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 33 - Published
Residual shear strength of Sn-Ag and Sn-Bi lead-free SMT joints after thermal shock
Poon, N. M., Wu, C. M. L., Lai, J. K. L. & Chan, Y. C., Nov 2000, In : IEEE Transactions on Advanced Packaging. 23, 4, p. 708-714Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 39 - Published
Study of Self-Alignment of μBGA Packages
Hung, K. C., Chan, Y. C., Tu, P. L., Ong, H. C., Webb, D. P. & Lai, J. K. L., Nov 2000, In : IEEE Transactions on Advanced Packaging. 23, 4, p. 631-636Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 2 - Published
Impact Properties of PBGA Assemblies Reflowed in Nitrogen Ambient and Compressed Air
Wu, Y. P. & Chan, Y. C., Aug 2000, In : IEEE Transactions on Advanced Packaging. 23, 3, p. 421-425Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 4 - Published
Nondestructive Defect Detection in Multilayer Ceramic Capacitors Using an Improved Digital Speckle Correlation Method with Wavelet Packet Noise Reduction Processing
Chan, Y. C., Hung, K. C. & Dai, X., Feb 2000, In : IEEE Transactions on Advanced Packaging. 23, 1, p. 80-87Research output: Journal Publications and Reviews (RGC: 21, 22, 62) › 21_Publication in refereed journal › peer-review
Scopus citations: 15