Presenter :

IUMRS-ICEM 2024 Conference

Activity: Participating in or organising a conference / an eventParticipation in conference

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Participant(s)

Description

Enabling Low-temperature Cu-to-Cu Direct Bonding via Nanotwin-doped Nanocrystalline Copper

Research Unit / Event Journal/Book Series

Conference

TitleIUMRS-ICEM 2024 Conference
Date20/05/2420/05/24
LocationHong Kong
CityHong Kong
PlaceHong Kong

Link(s)