Effect of residual stress on the interfacial bonding in layered nanocomposites - an atomistic approach

Description

Interfacial bonding plays a significant role in determining the performance and serviceability of nanocomposites, especially the layered thin film nanocomposites, where the interface interactions between the two phases are maximized. This bonding in layered nanocomposite highly depends on the residual stress, causing by the dissimilar structure and different properties between bonded materials. However, how the film nanostructure affects the residual stress is still unknown. There is lack of an approach to quantify the relationship between film structure and the residual stress. Our work investigates the relationship between the film nanostructure and residual stress. We also discuss the effect of the residual stress on the evolution of film nanostructure and the interfacial bonding properties. Our findings provide a guideline for the nanocomposite design by taking the residual stress into consideration. This may enable us to design more durable nanocomposites applied in mechanically-reinforced lightweight components, non-linear optics, battery cathodes, nanowires, and sensors. Moreover, the bonded nanocomposites with a minimized stress can have an improved dimensional stability with a wide application in semiconductors, micro- and nano-electro-mechanical-systems and electronic packaging.

Period	29 Aug 2017 → 31 Aug 2017
Event title	7th International Conference on Nanoscience & Technology, China  (ChinaNano 2017)
Event type	Conference
Location	Beijing, ChinaShow on map
Degree of Recognition	International