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13th International Conference on Tangible, Embedded, and Embodied Interaction (TEI 2019)

Activity: Organizing or Participating in a conference / an event › Conference / Symposium

Description

Program Co-Chair
Period17 Mar 2019 → 20 Mar 2019
Event typeConference
SponsorACM SIGCHI
LocationTempe, United StatesShow on map
Degree of RecognitionInternational

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